Abstract: Various methods and systems are provided for an ultrasound transducer structure for an ultrasound probe and methods of manufacturing thereof. In one example, the ultrasound transducer structure may include a lens, an acoustic stack disposed on the lens, and an acoustic backing material bonded to a side of the acoustic stack facing away from the lens without any intervening layer between the acoustic backing material and the acoustic stack, such that the acoustic backing material is in face-sharing contact with the side of the acoustic stack, wherein the acoustic backing material is composed of a solidified blend comprising a backing polymer.

Abstract: Various methods and systems are provided for an ultrasound transducer structure for an ultrasound probe and methods of manufacturing thereof. In one example, the ultrasound transducer structure may include a lens, an acoustic stack disposed on the lens, and an acoustic backing material bonded to a side of the acoustic stack facing away from the lens without any intervening layer between the acoustic backing material and the acoustic stack, such that the acoustic backing material is in face-sharing contact with the side of the acoustic stack, wherein the acoustic backing material is composed of a solidified blend comprising a backing polymer.

Abstract: The present approach relates to an interconnect structure (e.g., an electrical standoff) for use between two electrical components, such as a matrix transducer array and ASIC of an ultrasound probe and to the manufacture of such a structure. In accordance with certain embodiments, the interconnect structure provides electrical interconnection between electrical components and provides improved acoustic attenuation.