Patents by Inventor Craig P. Meuchel
Craig P. Meuchel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7138016Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: June 26, 2001Date of Patent: November 21, 2006Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Thomas H. Oberlitner, Craig P. Meuchel, Aleksander Owczarz, Raymon F. Thompson
-
Patent number: 7094291Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: June 26, 2001Date of Patent: August 22, 2006Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner, Aleksander Owczarz, Raymon F. Thompson
-
Patent number: 6745494Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.Type: GrantFiled: December 30, 2002Date of Patent: June 8, 2004Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Ian Sharp, Craig P. Meuchel, H. Frederick Woods
-
Publication number: 20030088995Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.Type: ApplicationFiled: December 30, 2002Publication date: May 15, 2003Applicant: Semitool, Inc.Inventors: Eric J. Bergman, Ian Sharp, Craig P. Meuchel, H. Frederick Woods
-
Patent number: 6543156Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.Type: GrantFiled: March 18, 2002Date of Patent: April 8, 2003Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Ian Sharp, Craig P. Meuchel, H. Frederick Woods
-
Patent number: 6488038Abstract: A method and apparatus for cleaning organic material from a semiconductor substrate suppresses the oxidation of a conductive film or layer on the substrate. A semiconductor substrate is immersed within a bath of water. The conductive layer is contacted to a source of electrons. The electrons form a floating charge protecting the conductive layer from oxidation. Ozone gas is introduced into the water bath. In another aspect, the semiconductor substrate is sprayed with water. Organic contaminants or films are oxidized and removed by the ozone, while the conductive or metal layer is preserved. An anode may be placed adjacent to the surface of the semiconductor substrate to passivate the metal layer via current flow.Type: GrantFiled: November 6, 2000Date of Patent: December 3, 2002Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Craig P. Meuchel, Ian Sharp
-
Publication number: 20020095816Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.Type: ApplicationFiled: March 18, 2002Publication date: July 25, 2002Applicant: Semitool, Inc.Inventors: Eric J. Bergman, Ian Sharp, Craig P. Meuchel, H. Frederick Woods
-
Patent number: 6375741Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: May 23, 2000Date of Patent: April 23, 2002Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Publication number: 20020040679Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: ApplicationFiled: June 26, 2001Publication date: April 11, 2002Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Publication number: 20020038629Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: ApplicationFiled: June 26, 2001Publication date: April 4, 2002Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Patent number: 6357142Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.Type: GrantFiled: August 7, 2001Date of Patent: March 19, 2002Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Ian Sharp, Craig P. Meuchel, H. Frederick Woods
-
Publication number: 20020026729Abstract: A system for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.Type: ApplicationFiled: August 7, 2001Publication date: March 7, 2002Applicant: Semitool, Inc.Inventors: Eric J. Bergman, Ian Sharp, Craig P. Meuchel, H. Frederick Woods
-
Publication number: 20010050041Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: ApplicationFiled: May 23, 2000Publication date: December 13, 2001Inventors: TIMOTHY J. REARDON, CRAIG P. MEUCHEL, THOMAS H. OBERLITNER
-
Patent number: 6286231Abstract: A method and apparatus for high-pressure drying of semiconductor wafers includes the insertion of a wafer into an open vessel, the immersion of the wafer in a liquid, pressure-sealing of the vessel, pressurization of the vessel with an inert gas, and then the controlled draining of the liquid using a moveable drain that extracts water from a depth maintained just below the gas-liquid interface. Thereafter, the pressure may be reduced in the vessel and the dry and clean wafer may be removed. The high pressure suppresses the boiling point of liquids, thus allowing higher temperatures to be used to optimize reactivity. Megasonic waves are used with pressurized fluid to enhance cleaning performance. Supercritical substances are provided in a sealed vessel containing a wafer to promote cleaning and other treatment.Type: GrantFiled: January 12, 2000Date of Patent: September 11, 2001Assignee: Semitool, Inc.Inventors: Eric J. Bergman, Ian Sharp, Craig P. Meuchel, H. Frederick Woods
-
Patent number: 6066575Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: June 26, 1997Date of Patent: May 23, 2000Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner
-
Patent number: 5658387Abstract: A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.Type: GrantFiled: April 12, 1995Date of Patent: August 19, 1997Assignee: Semitool, Inc.Inventors: Timothy J. Reardon, Craig P. Meuchel, Thomas H. Oberlitner