Patents by Inventor Craig T. Clyne

Craig T. Clyne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die attached to a support member by a plurality of adhesive members
    Patent number: 9064973
    Abstract: Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: June 23, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Craig T. Clyne, John C. Fernandez
  • METHODS AND SYSTEMS FOR ADHERING MICROFEATURE WORKPIECES TO SUPPORT MEMBERS
    Publication number: 20130000842
    Abstract: Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.
    Type: Application
    Filed: September 12, 2012
    Publication date: January 3, 2013
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Craig T. Clyne, John C. Fernandez
  • Methods of adhering microfeature workpieces, including a chip, to a support member
    Patent number: 8278751
    Abstract: Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.
    Type: Grant
    Filed: February 8, 2005
    Date of Patent: October 2, 2012
    Assignee: Micron Technology, Inc.
    Inventors: Craig T. Clyne, John C. Fernandez
  • Microfeature systems including adhered microfeature workpieces and support members
    Patent number: 7518237
    Abstract: Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further include adhesively attaching the microfeature workpiece to the support member by contacting the first adhesive with the second adhesive while the second adhesive is only partially cured. In further particular embodiments, the first and second adhesives can have different compositions, and the second adhesive can be fully cured after the microfeature workpiece and support member are adhesively attached.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: April 14, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Craig T. Clyne, John C. Fernandez
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6921017
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: July 26, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Publication number: 20040026486
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Application
    Filed: July 7, 2003
    Publication date: February 12, 2004
    Inventors: Sven Evers, Craig T. Clyne
  • Semiconductor wire bond machine leadframe thermal map system
    Patent number: 6652138
    Abstract: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductor devices and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic wire bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: November 25, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6634538
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: December 11, 2001
    Date of Patent: October 21, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6588649
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: July 8, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Semiconductor wirebond machine leadframe thermal map system
    Publication number: 20020181538
    Abstract: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
    Type: Application
    Filed: July 18, 2002
    Publication date: December 5, 2002
    Inventor: Craig T. Clyne
  • Semiconductor wirebond machine leadframe thermal map system
    Patent number: 6447162
    Abstract: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductor devices and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic wire bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: September 10, 2002
    Assignee: Micron Technology, Inc.
    Inventor: Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Publication number: 20020066775
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Application
    Filed: January 16, 2002
    Publication date: June 6, 2002
    Inventors: Sven Evers, Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6375061
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: April 23, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Publication number: 20020043548
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Application
    Filed: December 11, 2001
    Publication date: April 18, 2002
    Inventors: Sven Evers, Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6352191
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: October 30, 2000
    Date of Patent: March 5, 2002
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Semiconductor wirebond machine leadframe thermal map system
    Publication number: 20010033598
    Abstract: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
    Type: Application
    Filed: June 11, 2001
    Publication date: October 25, 2001
    Inventor: Craig T. Clyne
  • Semiconductor wirebond machine leadframe thermal map system
    Patent number: 6273605
    Abstract: A method and apparatus for measuring the surface temperatures of wire-bonded semiconductors and the like for preparing thermal maps include a conventional ultrasonic wire bonding machine adapted for mounting a fluorescence-decay temperature sensor in the capillary holder. A trigger box circuit is provided to trigger a temperature measurement based on initiation of an electrical voltage signal from the ultrasonic bonding controller. A computer is provided for coordinating the stage control and temperature measurements, and for collating and plotting the temperature, time and location indications as thermal maps and other displayed/printed correlations.
    Type: Grant
    Filed: February 16, 2000
    Date of Patent: August 14, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6138891
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: October 31, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6126062
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: April 2, 1998
    Date of Patent: October 3, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne
  • Non-conductive and self-leveling leadframe clamp insert for wirebonding integrated circuits
    Patent number: 6105846
    Abstract: A leadframe clamping apparatus includes a resilient polymeric membrane which permits self-leveling compensation of a variably movable clamp insert for variations in leadframe thickness. The clamp insert is formed of a polymer such as polyimide to provide further compensation for leadframe variations.
    Type: Grant
    Filed: July 9, 1999
    Date of Patent: August 22, 2000
    Assignee: Micron Technology, Inc.
    Inventors: Sven Evers, Craig T. Clyne