Patents by Inventor Craig V. Lucas

Craig V. Lucas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Field-deployable electronics platform having thermoelectric power source and electronics module
    Patent number: 8198527
    Abstract: A wrapped thermoelectric power source having an inner and an outer insulator is provided within a housing formed, at least partially, by an upper and lower thermal transfer elements. The thermoelectric power source including a plurality of coupled pairs of thin film materials possessing thermoelectric properties, the pairs disposed on a flexible substrate and electrically coupled in any series/parallel combination, with the flexible substrate wrapped around an inner thermal insulator. The thermoelectric power source may be sized such that at least a portion of an electronics module may be disposed at least partly within the inner thermal insulator. The electronics module is electrically coupled to the thermoelectric power source, and includes components for voltage regulation and/or power conditioning.
    Type: Grant
    Filed: December 8, 2008
    Date of Patent: June 12, 2012
    Assignee: Perpetua Power Source Technologies, Inc.
    Inventors: R. Jon Hofmeister, Craig V. Lucas, Paul H. McClelland, Marshall Field, Marcus S. Ward
  • Field-deployable electronics platform having thermoelectric power source and interchangeable power management electronics and application modules
    Publication number: 20100139291
    Abstract: A wrapped thermoelectric power source having an inner and an outer insulator is provided within a housing formed, at least partially, by an upper and lower thermal transfer elements. The thermoelectric power source including a plurality of coupled pairs of thin film materials possessing thermoelectric properties, the pairs disposed on a flexible substrate and electrically coupled in any series/parallel combination, with the flexible substrate wrapped around an inner thermal insulator. The thermoelectric power source may be sized such that at least a portion of an electronics module may be disposed at least partly within the inner thermal insulator. The electronics module is electrically coupled to the thermoelectric power source, and includes components for voltage regulation and/or power conditioning.
    Type: Application
    Filed: December 8, 2008
    Publication date: June 10, 2010
    Inventors: R. Jon Hofmeister, Craig V. Lucas, Paul H. McClelland, Marshall Field, Marcus S. Ward