Abstract: A semiconductor chip (12) includes a plurality of bond pads (16). A plurality of bond shelves (28) are located along opposed end edges (20, 22) of the chip (12). The bond pads (16) are oriented in selected areas remote from the bond shelves (28). A via (42) is formed through an insulating layer (38) to the surface of the bond pad (18) to provide electrical connection thereto. A metallization layer (44) is formed over the an insulating layer (38), filling the via (42). The metallization layer (44) is patterned and etched to form a patten of trace lines (18) spatially separated to connect each bond pad (16) to bond shelves (28).

Abstract: A multiple device fixture, used in conjunction with a temperature forcing unit, provides flow and direction control of conditioned air from the temperature forcing unit to two or more integrated circuits during temperature testing or characterization. The multiple device fixture provides an efficient way to temperature test multiple electronic devices simultaneously over accurately controlled temperature ranges when an automated device handler is not available, does not exist for a specific package type or is too expensive.

Abstract: A multiple device fixture, used in conjunction with a temperature forcing unit, provides flow and direction control of conditioned air from the temperature forcing unit to two or more integrated circuits during temperature testing or characterization. The multiple device fixture provides an efficient way to temperature test multiple electronic devices simultaneously over accurately controlled temperature ranges when an automated device handler is not available, does not exist for a specific package type or is too expensive.