Abstract: An LED light fixture includes a heat-sink, a circuit board thereon and having a plurality of spaced LED light sources, and a one-piece optical member with a plurality of secondary lenses over corresponding LED light sources, the one-piece optical member comprises (a) each of the lenses having at least one layer of a polymeric material which extends into a lens flange of such material that surrounds the lens and is spaced from the other lenses and (b) a polymeric carrier portion surrounding the lenses, overlapping and molded onto to the lens flanges across such overlapping, and extending to a peripheral edge. The polymeric materials may be different; e.g., the lens layer and lense flanges being an acrylic and the carrier being a polycarbonate. The innermost lens layer may be of an LSR material. The invention is also such one-piece optical member and a method of manufacturing such member.

Abstract: The present disclosure relates to optical elements and coatings comprising rare-earth element (REE) compounds for light wavelength attenuation of light emitting diode (LED) elements and lamps. More particularly, the present disclosure relates to LED elements and lamps comprising wavelength attenuating elements comprising REE compounds having at least a portion of non-crystalline, non-hydrate form, methods of preparing such elements, and LED elements, LED arrays, LED packages, optical elements, lamps and systems made with same.

Abstract: Embodiments of a multi-layer environmental barrier for a semiconductor device and methods of manufacturing the same are disclosed. In one embodiment, a semiconductor device is formed on a semiconductor die. The semiconductor die includes a semiconductor body and a passivation structure on the semiconductor body. A multi-level environmental barrier is provided on the passivation structure. The multi-layer environmental barrier is a low-defect multi-layer dielectric film that hermetically seals the semiconductor device from the environment. In one embodiment, the multi-layer environmental barrier has a defect density of less than 10 defects per square centimeter (cm2). By having a low defect density, the multi-layer environmental barrier serves as a robust barrier to the environment.

Abstract: An electronic device includes a drift region having a first conductivity type and a grid including a plurality of doped regions formed in the drift region and having a second conductivity type. The doped regions have a dopant concentration greater than 2.2×1019 cm?3. Related methods are also disclosed.

Abstract: A unitary optic member for directing light from a plurality of LED light sources on a board beneath the optic member, the optic member having a plurality of lens portions surrounded by and interconnected by a non-lens portion and comprising: a first molded polymeric layer forming (a) the non-lens portion and (b) an outermost layer of each of the lens portions, the outermost layer of each lens portion forming a pocket-space at such lens portion; and for each lens portion, a second molded polymeric layer overmolded onto the first polymeric layer within the corresponding pocket-space. The invention includes an LED light fixture with such a unitary optic member. Another aspect of the invention is a multi-layer polymeric lens for directing light from an LED light source, the lens defining a lens optical footprint and at least one of the polymeric layers being less than coextensive with the lens optical footprint.

Abstract: An LED light fixture includes a heat-sink, a circuit board thereon and having a plurality of spaced LED light sources, and a one-piece optical member with a plurality of secondary lenses over corresponding LED light sources, the one-piece optical member comprises (a) each of the lenses having at least one layer of a polymeric material which extends into a lens flange of such material that surrounds the lens and is spaced from the other lenses and (b) a polymeric carrier portion surrounding the lenses, overlapping and molded onto to the lens flanges across such overlapping, and extending to a peripheral edge. The polymeric materials may be different; e.g., the lens layer and lense flanges being an acrylic and the carrier being a polycarbonate. The innermost lens layer may be of an LSR material. The invention is also such one-piece optical member and a method of manufacturing such member.

Abstract: An LED light fixture including a heat-sink body having a circuit-board mounting surface and an aperture member supported over the circuit-board mounting surface and forming an optical aperture. An LED circuit board is affixed in thermal-contact relationship to the circuit-board mounting surface in position between the mounting surface and the aperture member, the circuit board having an LED-populated area and a surrounding non-LED-populated area which extends beyond the optical aperture. In some other embodiments, the fixture is a low-profile LED light fixture including a cover and a base plate which has a substantially planar back surface, a front surface and heat-dissipating surfaces extending forward from the front surface. An LED circuit board and at least one LED power-circuitry unit, which are secured with respect to the front surface along side the heat-dissipating surfaces, do not extend behind the back surface of the base plate.

Abstract: A light fixture including at least one LED emitter and at least one LED power-circuitry unit within an enclosure formed by a base and a cover movably secured with respect to the base. The at least one LED emitter is secured with respect to the base and in thermal communication therewith. The at least one LED power-circuitry unit is secured with respect to the base such that, when the cover is closed, the power-circuitry unit is in thermal communication with the cover. During operation primary heat transfer from the power-circuitry unit and primary heat transfer from the LED emitter(s) are to separate enclosure members.

Abstract: An LED light fixture including a housing, a heat sink secured with respect to the housing and an LED illuminator secured with respect to the heat sink. The heat sink includes central and peripheral portions. The central portion has an LED-supporting surface and forward, rearward and lateral sides, the LED illuminator being at the LED-supporting surface. The peripheral portion extends laterally from the lateral sides. The central portion of the heat sink has downwardly-extending shield members at the lateral sides thereof configured and dimensioned to block upward illumination. In embodiments where the optical member is configured for directing emitter light predominantly toward the forward side, the central heat-sink portion has a downwardly-extending shield member at the rearward side thereof configured and dimensioned to block rearward illumination.

Abstract: An LED light fixture including a housing, a heat sink secured with respect to the housing and an LED illuminator secured with respect to the heat sink. The heat sink includes central and peripheral portions. The central portion has an LED-supporting surface and forward, rearward and lateral sides, the LED illuminator being at the LED-supporting surface. The peripheral portion extends laterally from the lateral sides. The central portion of the heat sink has downwardly-extending shield members at the lateral sides thereof configured and dimensioned to block illumination in a direction opposite the LED illuminator. In embodiments where the optical member is configured for directing emitter light predominantly toward the forward side, the central heat-sink portion has a downwardly-extending shield member at the rearward side thereof configured and dimensioned to block rearward illumination.

Abstract: An LED based lamp has an optically transmissive enclosure connected to a base. The base may include a heat sink. A substrate is positioned in the enclosure and supports a plurality of LEDs where the periphery of the substrate has alternating recessed portions and protruding portions that define a plurality of laterally extending projections. One LED is located on each of the projections to increase the amount of down light generated by the lamp.

Abstract: An LED light fixture including a frame defining a forward open region and a rearward region with a rearmost portion adapted for securement to a support member. An LED assembly is secured with respect to the frame and positioned within the open forward region with open spaces remaining therebetween. The LED assembly includes an LED illuminator secured with respect to the LED-supporting region of a heat sink with an LED-supporting region and heat-dissipating surfaces extending therefrom. Another aspect of the invention is a non-metallic frame defining a forward open region and having a rearward region having a rearmost portion adapted for securement to a support member. An LED assembly is secured with respect to the frame and positioned within the open forward region with open spaces remaining therebetween.

Abstract: An optical waveguide includes a body of optically transmissive material having a width substantially greater than an overall thickness thereof and including a first side, a second side opposite the first side, a central bore extending between the first and second sides and adapted to receive a light emitting diode, and extraction features on the second side. A light diverter extends into the central bore for diverting light into and generally along the width of the body of material. The extraction features direct light out of the first side and wherein at least one extraction feature has an extraction surface dimension transverse to the thickness that is between about 5% and about 75% the overall thickness of the body of material.

Abstract: An optical waveguide includes a body of optically transmissive material having a width substantially greater than an overall thickness thereof. The body of material has a first side, a second side opposite the first side, and a plurality of interior bores extending between the first and second sides each adapted to receive a light emitting diode. Extraction features are disposed on the second side and the extraction features direct light out of at least the first side and at least one extraction feature forms a taper disposed at an outer portion of the body.

Abstract: LED lighting apparatus including (a) a circuit board which has a plurality of light sources spaced thereon, (b) a heat sink to which the circuit board is thermally coupled, and (c) a securement structure which includes a rigid peripheral structure applying force along a peripheral area of the circuit board toward the heat sink to increase the thermal coupling therebetween to facilitate heat transfer from the light sources during operation. The lighting apparatus may also include an optical member with a plurality of lens portions over corresponding light sources and a peripheral region, the securement structure engaging the peripheral region which sandwiches a gasket against the heat sink. The apparatus may use manipulation involving surface convexity, such as bowing, thereby allowing the securement structure to further facilitate surface-to-surface thermal coupling between the circuit board and the heat sink.

Abstract: This disclosure relates to light engines for use in lighting fixtures, such as troffer-style lighting fixtures. Light engines according to the present disclosure have integrated features that eliminate the need for additional components such as a Printed Circuit Board (PCB), a heat sink, a cover portion, a lens and/or a reflective element. Devices according to this disclosure can comprise a rigid body, conductive elements arranged into electrical pathways and light sources such as light emitting diodes (LEDs). Devices according to this disclosure can further comprise integrated cover, lens and/or reflective element features. Methods for the manufacture of such devices are also disclosed.

Abstract: This disclosure relates to light engines for use in lighting fixtures, such as troffer-style lighting fixtures. Light engines according to the present disclosure have integrated features that eliminate the need for additional components such as a Printed Circuit Board (PCB), a heat sink, a cover portion, a lens and/or a reflective element. Devices according to this disclosure can comprise a rigid body, conductive elements arranged into electrical pathways and light sources such as light emitting diodes (LEDs). Devices according to this disclosure can further comprise integrated cover, lens and/or reflective element features. Methods for the manufacture of such devices are also disclosed.

Abstract: This disclosure relates to suspended linear lighting fixtures that are arranged to accept lighting elements. Lighting fixtures according to the present disclosure comprise at least one body and at least one suspension mechanism. These lighting fixtures can be arranged such that electrical and mechanical connections can be provided at various locations along their length, rather than only at the distal ends of the fixtures. The fixtures can also comprise various connectivity features that allow further arrangements, designs and spatial adjustments. Lighting systems utilizing these fixtures are also disclosed.

Abstract: This disclosure relates to retrofit systems and methods for lighting installations, and in particular, to retrofit systems and methods used to retrofit troffer-style lighting installations with LED light sources. Retrofit systems can be used with different light fixtures, but those described are particularly adapted for use with troffer-style fixtures. These retrofit systems can provide the same amount of light as traditional light fixtures already do, for example 1600-4000 lumens or more. The retrofit systems can be used with many different light sources but are particularly well-suited for use with solid state light sources or light engines, such as those utilizing LEDs. Some embodiments of the present invention comprise a mechanical mounting system for installing an LED light engine within an existing lighting system housing or pan, such as a troffer pan, without penetrating the ceiling plenum.

Abstract: The present disclosure is directed to LED components, and systems using such components, having a light emission profile that may be controlled independently of the lens shape by varying the position and/or orientation of LED chips with respect to one or both of an overlying lens and the surface of the component. For example, the optical centers of the LED emitting surface and the lens, which are normally aligned, may be offset from each other to generate a controlled and predictable emission profile. The LED chips may be positioned to provide a peak emission shifted from a perpendicular centerline of the lens base. The use of offset emitters allows for LED components with shifted or tilted emission patterns, without causing output at high angles of the components. This is beneficial as it allows a lighting system to have tilted emission from the LED component and primary optics.