Abstract: A circuit includes a power transistor having a main current path between a first supply node and an output pin for connecting a load. A resistance formed by a chip metallization is arranged between the main current path of the power transistor and the output pin. The circuit includes a current measuring circuit coupled to the power transistor and including a sense transistor coupled to the power transistor. The current measuring circuit delivers a measurement current representing a load current flowing through the power transistor. An amplifier circuit generates an amplifier output signal representing the voltage across the resistance, and a control circuit outputs a signal representing the measurement current in a first mode and a signal dependent on the amplifier output signal in a second mode.

Abstract: A transistor device is disclosed. The transistor device includes: a semiconductor body; a source conductor on top of the semiconductor body; a source clip on top of the source conductor and electrically connected to the source conductor; a first active device region arranged in the semiconductor body, covered by the source conductor and the source clip, and including at least one device cell; and a second active device region arranged in the semiconductor body, covered by regions of the source conductor that are not covered by the source clip, and including at least one device cell. The first active device region has a first area specific on-resistance and the second active device region has a second area specific on-resistance, the second area specific on-resistance being greater than the first area specific on-resistance.

Abstract: A transistor arrangement and an electronic circuit with a transistor arrangement are disclosed. The transistor arrangement includes: drift and drain regions arranged in a semiconductor body and connected to a drain node; at least one load transistor cell having a source region integrated in a first active region of the semiconductor body; at least one sense transistor cell having a source region integrated in a second active region of the semiconductor body; a first source node electrically coupled to the source region of the at least one load transistor cell; a second source node electrically coupled to the source region of the at least one sense transistor cell; and a compensation resistor connected between the source region of the at least one sense transistor cell and the second source node. The compensation resistor is integrated in the semiconductor body and has a resistive conductor which includes a doped semiconductor material.

Abstract: A transistor arrangement and an electronic circuit with a transistor arrangement are disclosed. The transistor arrangement includes: drift and drain regions arranged in a semiconductor body and connected to a drain node; at least one load transistor cell having a source region integrated in a first active region of the semiconductor body; at least one sense transistor cell having a source region integrated in a second active region of the semiconductor body; a first source node electrically coupled to the source region of the at least one load transistor cell; a second source node electrically coupled to the source region of the at least one sense transistor cell; and a compensation resistor connected between the source region of the at least one sense transistor cell and the second source node. The compensation resistor is integrated in the semiconductor body and has a resistive conductor which includes a doped semiconductor material.

Abstract: A transistor device is disclosed. The transistor device includes: a semiconductor body; a source conductor on top of the semiconductor body; a source clip on top of the source conductor and electrically connected to the source conductor; a first active device region arranged in the semiconductor body, covered by the source conductor and the source clip, and including at least one device cell; and a second active device region arranged in the semiconductor body, covered by regions of the source conductor that are not covered by the source clip, and including at least one device cell. The first active device region has a first area specific on-resistance and the second active device region has a second area specific on-resistance, the second area specific on-resistance being greater than the first area specific on-resistance.

Abstract: Thermo-migration induced stress in power devices can be mitigated by deactivating a subset of power device components (e.g., transistors, etc.) when the power device experiences a high stress condition. Deactivating the subset of power device components serves to bifurcate the active area of the power switching device into smaller active regions, which advantageously changes the temperature gradients in the active area/regions. In some embodiments, a control circuit dynamically deactivates different subsets of power device components to shift the thermo-migration induced stress points to different portions of the active region over the lifetime of the power switching device.

Abstract: A device for thermal protection is described. The device may be configured to determine current temperature information for a set of light emitting diodes (LEDs), receive an indication of a requested light pattern for the set of LEDs, and determine predicted temperature information for the set of LEDs based on the current temperature information and the requested light pattern. In this example, the device is further configured to operate the set of LEDs at a modified light pattern that is different from the requested light pattern in response to determining that the predicted temperature information indicates that the set of LEDs operates at an unsafe temperature when operating at the requested light pattern.

Abstract: A device for thermal protection is described. The device may be configured to determine current temperature information for a set of light emitting diodes (LEDs), receive an indication of a requested light pattern for the set of LEDs, and determine predicted temperature information for the set of LEDs based on the current temperature information and the requested light pattern. In this example, the device is further configured to operate the set of LEDs at a modified light pattern that is different from the requested light pattern in response to determining that the predicted temperature information indicates that the set of LEDs operates at an unsafe temperature when operating at the requested light pattern.

Abstract: Thermo-migration induced stress in power devices can be mitigated by deactivating a subset of power device components (e.g., transistors, etc.) when the power device experiences a high stress condition. Deactivating the subset of power device components serves to bifurcate the active area of the power switching device into smaller active regions, which advantageously changes the temperature gradients in the active area/regions. In some embodiments, a control circuit dynamically deactivates different subsets of power device components to shift the thermo-migration induced stress points to different portions of the active region over the lifetime of the power switching device.