Abstract: A sensor assembly. The sensor assembly has a substrate, a seismic mass, and a functional layer arranged between the substrate and the seismic mass. The seismic mass is connected to the substrate in such a way that the seismic mass can be deflected at least along a first direction running perpendicular to the substrate. Within the functional layer and between the seismic mass and the substrate, at least one stop is formed that is spring-loaded and can be deflected along the first direction.

Abstract: A micromechanical structure, including a substrate, a seismic mass movable with respect to the substrate, and first and second detectors. A first direction and a second direction perpendicular to the first direction define a main extension plane of the substrate. The first and second detectors respectively detect a translatory deflection, and a rotatory deflection. The seismic mass is connected to the substrate via an anchoring element and four torsion spring sections. The first detector include an electrode structure, including first electrodes attached at the seismic mass and second electrodes attached at the substrate. The first and second electrodes have a two-dimensional extension in the second direction and in a third direction perpendicular to the main extension plane. The anchoring element includes first and second sections with a gap between them. A connecting element connects two first electrodes and is guided through the gap.

Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Abstract: A MEMS sensor, including a substrate, and at least three functional layers, which are connected to the substrate on top of one another and spaced apart from one another. A first of the at least three functional layers is deflectably situated. A first electrode, which includes at least two areas being situated at the first functional layer. A first area of the first electrode together with a second electrode of a second of the at least three functional layers form a first capacitance, and a second area of the first electrode together with at least one area of a third electrode of a third functional layer form a second capacitance. The electrodes are situated in such a way that, upon a change in the distance of the electrodes of the first capacitance, a contrary change in the distance of the electrodes of the second capacitance takes place.

Abstract: A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

Abstract: A micromechanical structure including a substrate, a moveable seismic mass, a detection structure, and a main spring. The seismic mass is connected to the substrate using the main spring. A first direction and a second direction perpendicular thereto define a main extension plane of the substrate. The detection structure detects a deflection of the seismic mass and includes first electrodes mounted at the seismic mass and second electrodes mounted at the substrate. The first electrodes and second electrodes have a two-dimensional extension in the first and second directions. The micromechanical structure has a graduated stop structure including a first spring stop, a second spring stop, and a fixed stop.

Abstract: A micromechanical structure, including a substrate, a seismic mass movable with respect to the substrate, and first and second detection means. A first direction and a second direction perpendicular to the first direction define a main extension plane of the substrate. The first and second detection means respectively detect a translatory deflection, and a rotatory deflection. The seismic mass is connected to the substrate via an anchoring element and four torsion spring sections. The first detection means include an electrode structure, including first electrodes attached at the seismic mass and second electrodes attached at the substrate. The first and second electrodes have a two-dimensional extension in the second direction and in a third direction perpendicular to the main extension plane. The anchoring element includes first and second sections with a gap between them. A connecting element connects two first electrodes and is guided through the gap.

Abstract: A MEMS sensor, including a substrate, and at least three functional layers, which are connected to the substrate on top of one another and spaced apart from one another. A first of the at least three functional layers is deflectably situated. A first electrode, which includes at least two areas being situated at the first functional layer. A first area of the first electrode together with a second electrode of a second of the at least three functional layers form a first capacitance, and a second area of the first electrode together with at least one area of a third electrode of a third functional layer form a second capacitance. The electrodes are situated in such a way that, upon a change in the distance of the electrodes of the first capacitance, a contrary change in the distance of the electrodes of the second capacitance takes place.

Abstract: A micromechanical device including a substrate, a movable mass, and a stop spring structure, which includes a stop. The substrate includes a substrate surface in parallel to a main extension plane and the movable mass is situated movably above the substrate surface in relation to the substrate. The stop spring structure is connected to the movable mass. The stop is designed to strike against the substrate surface in the event of a deflection of the movable mass in a z direction, perpendicular to the main extension plane. The stop spring structure, at the location of the stop, includes a first spring constant, a second spring constant, in parallel to the main extension plane, and a third spring constant, in parallel to the main extension plane and perpendicular to the x direction. The first spring constant is greater than the second spring constant and/or is greater than the third spring constant.

Abstract: A micromechanical sensor device is described that includes an integrated housing seal, a micromechanical sensor assembly, and a corresponding manufacturing method. The micromechanical sensor device with an integrated housing seal is equipped with a micromechanical sensor chip that includes an upper side and a lower side, a sensor area that may be brought into contact with an environmental medium being provided on or at the upper side, and is equipped with at least one circumferential trench, open toward the upper side, that is provided in the periphery of the sensor area and that is at least partly filled with a sealing medium for sealing a corresponding area of a housing to be mounted thereon.

Abstract: A micromechanical sensor device is described that includes an integrated housing seal, a micromechanical sensor assembly, and a corresponding manufacturing method. The micromechanical sensor device with an integrated housing seal is equipped with a micromechanical sensor chip that includes an upper side and a lower side, a sensor area that may be brought into contact with an environmental medium being provided on or at the upper side, and is equipped with at least one circumferential trench, open toward the upper side, that is provided in the periphery of the sensor area and that is at least partly filled with a sealing medium for sealing a corresponding area of a housing to be mounted thereon.