Patents by Inventor Cuc Huynh

Cuc Huynh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHOTORESIST TRIMMING PROCESS
    Publication number: 20080032214
    Abstract: A photoresist trimming gas compound is provided which will selectively remove a resist foot or scum from the lower portions of sidewalls of a photoresist. Additionally, the trimmer compound hardens or toughens an upper surface of the photoresist thereby strengthening the photoresist. The trimmer compound includes O2 and at least one other gaseous oxide and is typically utilized in a dry etching process after a trench has been formed in a photoresist. The other oxide gases, in addition to the O2 may include CO2, SO2 and NO2.
    Type: Application
    Filed: October 9, 2007
    Publication date: February 7, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shaun Crawford, Cuc Huynh, A. Reid, Adam Smith, Thomas Wagner
  • PHOTORESIST TRIMMING PROCESS
    Publication number: 20080020586
    Abstract: A photoresist trimming gas compound is provided which will selectively remove a resist foot or scum from the lower portions of sidewalls of a photoresist. Additionally, the trimmer compound hardens or toughens an upper surface of the photoresist thereby strengthening the photoresist. The trimmer compound includes O2 and at least one other gaseous oxide and is typically utilized in a dry etching process after a trench has been formed in a photoresist. The other oxide gases, in addition to the O2 may include CO2, SO2 and NO2.
    Type: Application
    Filed: September 27, 2007
    Publication date: January 24, 2008
    Applicant: International Business Machines Corporation
    Inventors: Shaun CRAWFORD, Cuc Huynh, A. Reid, Adam Smith, Thomas Wagner
  • PHOTORESIST TRIMMING PROCESS
    Publication number: 20060040504
    Abstract: A photoresist trimming gas compound is provided which will selectively remove a resist foot or scum from the lower portions of sidewalls of a photoresist. Additionally, the trimmer compound hardens or toughens an upper surface of the photoresist thereby strengthening the photoresist. The trimmer compound includes O2 and at least one other gaseous oxide and is typically utilized in a dry etching process after a trench has been formed in a photoresist The other oxide gases, in addition to the O2 may include CO2, SO2 and NO2.
    Type: Application
    Filed: August 19, 2004
    Publication date: February 23, 2006
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shaun Crawford, Cuc Huynh, A. Reid, Adam Smith, Thomas Wagner
  • OPTIMIZED SCHEDULING BASED ON SENSITIVITY DATA
    Publication number: 20050283265
    Abstract: A scheduling optimizer system, method and program product that analyzes a device for sensitivities, such as ESD sensitivities, and allows for modification of a floor schedule of the assembly unit of the device based on the sensitivity of the device while improving the overall performance of the assembly unit are disclosed. The scheduling optimizer analyzes sensitivity data for a device during operation of the assembly unit on the floor schedule. The floor schedule is then optimized based on the analyzed sensitivity data.
    Type: Application
    Filed: June 16, 2004
    Publication date: December 22, 2005
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Brian Denton, Cuc Huynh, Shreesh Tandel, Steven Voldman
  • Method of planarizing semiconductor wafers
    Patent number: 5935869
    Abstract: A CMP semiconductor wafer planarization method is provided employing an aqueous solution of a trialkanol amine as a wafer cleaning solution. Wafers are produced exhibiting a substantial reduction in semiconductor device failures as shown by a significant decrease in m.sub.1- m.sub.1 (metal to metal) shorts.
    Type: Grant
    Filed: July 10, 1997
    Date of Patent: August 10, 1999
    Assignee: International Business Machines Corporation
    Inventors: Cuc Huynh, Rangarajan Jagannathan, Amarnath Jha, Thomas Martin, Keith Pope, Thomas Sandwick
  • Silicon wafer cleaning and polishing pads
    Patent number: 5778481
    Abstract: Disc shaped cleaning/polishing pads are disclosed for use on a cleaning/polishing apparatus wherein the surface of the cleaning/polishing pad comprises resilient members arranged in patterns which will facilitate the movement of fluids (deoinized water, chemical slurry, etc.) from the center region of the pad to the periphery of the pad. Arrangement of the resilient members on the pads may be spiral, swirl, concentric or any other suitable pattern which will direct fluids to the periphery of the pad upon rotation of the pad.
    Type: Grant
    Filed: July 26, 1996
    Date of Patent: July 14, 1998
    Assignee: International Business Machines Corporation
    Inventors: Michael R. Amsden, Richard A. Bartley, Cuc Huynh, Paul A. Manfredi, Douglas P. Nadeau