Patents by Inventor Cuneyt Bakan

Cuneyt Bakan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DEVICE IDENTIFICATION FOR A SYSTEM OF ELECTRONIC DEVICES
    Publication number: 20230262375
    Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.
    Type: Application
    Filed: April 24, 2023
    Publication date: August 17, 2023
    Applicant: Apple Inc.
    Inventors: Jason Joseph LeBlanc, Rohan Gupta, Robert D. Zupke, Todd K. Moyer, Cuneyt Bakan, Brooke L. Bunney, Justin T. Ng, Jeff A. Kalt, Tian Shi Li, Lionel B. Barrow
  • Headband identification for a headphone system
    Patent number: 11665462
    Abstract: A detachable headband for a headphone system can incorporate a headband identification circuit that stores or encodes a headband identification parameter value. When the headband becomes attached to an ear cup, the headband can transmit the headband identification parameter value to the ear cup.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: May 30, 2023
    Assignee: Apple Inc.
    Inventors: Jason Joseph LeBlanc, Rohan Gupta, Robert D. Zupke, Todd K. Moyer, Cuneyt Bakan, Brooke L. Bunney, Justin T. Ng, Jeff A. Kalt, Tian Shi Li, Lionel B. Barrow
  • High-speed connector system
    Patent number: 9825410
    Abstract: Connector receptacles, examples of which comprise a housing having a first plurality of slots in a top side and a second plurality of slots in a bottom side, a top row of contacts positioned in the first plurality of slots in the housing, a bottom row of contacts positioned in the second plurality of slots in the housing, a top shell portion over the top of the housing, the top shell portion comprising first and second electromagnetic contacts extending from a front of the top shell and passing through openings in the top side of the housing, and a bottom shell portion under the bottom of the housing, the bottom shell portion comprising third and fourth electromagnetic contacts extending from a front of the bottom shell and passing through openings in the bottom side of the housing.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: November 21, 2017
    Assignee: Apple Inc.
    Inventors: Robert Scritzky, John Raff, Cuneyt Bakan, Eric T. SooHoo, Erik A. Uttermann, Patrick J. Quinn
  • HIGH-SPEED CONNECTOR SYSTEM
    Publication number: 20170133799
    Abstract: Connector receptacles that may have a desired form factor to fit in a stylized device enclosure. These stylized connector receptacles and corresponding connector inserts may also be capable of high-speed performance. Examples may also provide circuitry for these connector inserts and connector receptacles that support these high speeds.
    Type: Application
    Filed: September 8, 2016
    Publication date: May 11, 2017
    Applicant: Apple Inc.
    Inventors: Robert Scritzky, John Raff, Cuneyt Bakan, Eric T. SooHoo, Erik A. Uttermann, Patrick J. Quinn