Patents by Inventor Cuong D. Nguyen
Cuong D. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11875462Abstract: In implementations of systems for augmented reality authoring of remote environments, a computing device implements an augmented reality authoring system to display a three-dimensional representation of a remote physical environment on a display device based on orientations of an image capture device. The three-dimensional representation of the remote physical environment is generated from a three-dimensional mesh representing a geometry of the remote physical environment and digital video frames depicting portions of the remote physical environment. The augmented reality authoring system receives input data describing a request to display a digital video frame of the digital video frames. A particular digital video frame of the digital video frames is determined based on an orientation of the image capture device relative to the three-dimensional mesh. The augmented reality authoring system displays the particular digital video frame on the display device.Type: GrantFiled: November 18, 2020Date of Patent: January 16, 2024Assignee: Adobe Inc.Inventors: Zeyu Wang, Paul J. Asente, Cuong D. Nguyen
-
Publication number: 20230267696Abstract: Techniques for responsive video canvas generation are described to impart three-dimensional effects based on scene geometry to two-dimensional digital objects in a two-dimensional design environment. A responsive video canvas, for instance, is generated from input data including a digital video and scene data. The scene data describes a three-dimensional representation of an environment and includes a plurality of planes. A visual transform is generated and associated with each plane to enable digital objects to interact with the underlying scene geometry. In the responsive video canvas, an edit positioning a two-dimensional digital object with respect to a particular plane of the responsive video canvas is received. A visual transform associated with the particular plane is applied to the digital object and is operable to align the digital object to the depth and orientation of the particular plane. Accordingly, the digital object includes visual features based on the three-dimensional representation.Type: ApplicationFiled: February 23, 2022Publication date: August 24, 2023Applicant: Adobe Inc.Inventors: Cuong D. Nguyen, Valerie Lina Head, Talin Chris Wadsworth, Stephen Joseph DiVerdi, Paul John Asente
-
Publication number: 20220157024Abstract: In implementations of systems for augmented reality authoring of remote environments, a computing device implements an augmented reality authoring system to display a three-dimensional representation of a remote physical environment on a display device based on orientations of an image capture device. The three-dimensional representation of the remote physical environment is generated from a three-dimensional mesh representing a geometry of the remote physical environment and digital video frames depicting portions of the remote physical environment. The augmented reality authoring system receives input data describing a request to display a digital video frame of the digital video frames. A particular digital video frame of the digital video frames is determined based on an orientation of the image capture device relative to the three-dimensional mesh. The augmented reality authoring system displays the particular digital video frame on the display device.Type: ApplicationFiled: November 18, 2020Publication date: May 19, 2022Applicant: Adobe Inc.Inventors: Zeyu Wang, Paul J. Asente, Cuong D. Nguyen
-
Patent number: 11238657Abstract: In implementations of augmented video prototyping, a mobile device records augmented video data as a captured video of a recorded scene in an environment, the augmented video data including augmented reality tracking data as 3D spatial information relative to objects in the recorded scene. A video prototyping module localizes the mobile device with reference to the objects in the recorded scene using the 3D spatial information for the mobile device being within boundaries of the recorded scene in the environment. The video prototyping module can generate an avatar for display that represents the mobile device at a current location from a perspective of the recorded scene, and create a spatial layer over a video frame at the current location of the avatar that represents the mobile device. The spatial layer is an interactive interface on which to create an augmented reality feature that displays during playback of the captured video.Type: GrantFiled: March 2, 2020Date of Patent: February 1, 2022Assignee: Adobe Inc.Inventors: Cuong D. Nguyen, Paul J. Asente, Germán Ariel Leiva, Rubaiat Habib Kazi
-
Publication number: 20210272363Abstract: In implementations of augmented video prototyping, a mobile device records augmented video data as a captured video of a recorded scene in an environment, the augmented video data including augmented reality tracking data as 3D spatial information relative to objects in the recorded scene. A video prototyping module localizes the mobile device with reference to the objects in the recorded scene using the 3D spatial information for the mobile device being within boundaries of the recorded scene in the environment. The video prototyping module can generate an avatar for display that represents the mobile device at a current location from a perspective of the recorded scene, and create a spatial layer over a video frame at the current location of the avatar that represents the mobile device. The spatial layer is an interactive interface on which to create an augmented reality feature that displays during playback of the captured video.Type: ApplicationFiled: March 2, 2020Publication date: September 2, 2021Applicant: Adobe Inc.Inventors: Cuong D. Nguyen, Paul J. Asente, Germán Ariel Leiva, Rubaiat Habib Kazi
-
Patent number: 10613703Abstract: Techniques and systems to support collaborative interaction as part of virtual reality video are described. In one example, a viewport is generated such that a reviewing user of a reviewing user device may view VR video viewed by a source user of a source user device. The viewport, for instance, may be configured as a border at least partially surrounding a portion of the VR video output by the reviewing VR device. In another instance, the viewport is configured to support output of thumbnails within an output of VR video by the reviewing VR device. Techniques and systems are also described to support communication of annotations between the source and reviewing VR devices. Techniques and systems are also described to support efficient distribution of VR video within a context of a content editing application.Type: GrantFiled: August 18, 2017Date of Patent: April 7, 2020Assignee: Adobe Inc.Inventors: Stephen Joseph DiVerdi, Aaron Phillip Hertzmann, Cuong D. Nguyen
-
Publication number: 20190056848Abstract: Techniques and systems to support collaborative interaction as part of virtual reality video are described. In one example, a viewport is generated such that a reviewing user of a reviewing user device may view VR video viewed by a source user of a source user device. The viewport, for instance, may be configured as a border at least partially surrounding a portion of the VR video output by the reviewing VR device. In another instance, the viewport is configured to support output of thumbnails within an output of VR video by the reviewing VR device. Techniques and systems are also described to support communication of annotations between the source and reviewing VR devices. Techniques and systems are also described to support efficient distribution of VR video within a context of a content editing application.Type: ApplicationFiled: August 18, 2017Publication date: February 21, 2019Applicant: Adobe Systems IncorporatedInventors: Stephen Joseph DiVerdi, Aaron Phillip Hertzmann, Cuong D. Nguyen
-
Patent number: 10031039Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firType: GrantFiled: February 15, 2017Date of Patent: July 24, 2018Assignee: DUNAN SENSING LLCInventors: Tom T. Nguyen, Cuong D. Nguyen
-
Patent number: 9874486Abstract: Systems and methods for packaging a MEMS device are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, a metal port is mounted directly to the MEMS device using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal port.Type: GrantFiled: January 5, 2016Date of Patent: January 23, 2018Assignee: DUNAN SENSING, LLCInventors: Gary Winzeler, Danny Do, Cuong D. Nguyen, Emir Vukotic
-
Publication number: 20170191892Abstract: Systems and methods for packaging a MEMS device are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, a metal port is mounted directly to the MEMS device using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal port.Type: ApplicationFiled: January 5, 2016Publication date: July 6, 2017Inventors: Gary Winzeler, Danny Do, Cuong D. Nguyen, Emir Vukotic
-
Publication number: 20170160155Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firType: ApplicationFiled: February 15, 2017Publication date: June 8, 2017Inventors: TOM T. NGUYEN, CUONG D. NGUYEN
-
Patent number: 9593994Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firsType: GrantFiled: October 16, 2014Date of Patent: March 14, 2017Assignee: DUNAN SENSING, LLCInventors: Tom T. Nguyen, Cuong D. Nguyen
-
Patent number: 9506829Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.Type: GrantFiled: June 20, 2014Date of Patent: November 29, 2016Assignee: DUNAN SENSING LLCInventors: Tom T. Nguyen, Cuong D. Nguyen
-
Publication number: 20160109315Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firsType: ApplicationFiled: October 16, 2014Publication date: April 21, 2016Inventors: Tom T. Nguyen, Cuong D. Nguyen
-
Publication number: 20150369684Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.Type: ApplicationFiled: June 20, 2014Publication date: December 24, 2015Inventors: Tom T. Nguyen, Cuong D. Nguyen
-
Patent number: 8166447Abstract: A method of calculating a system power distribution network impedance is presented. The impedance calculation calculates the impedance as separate elements of the printed circuit board (PCB). An approximation of the power and ground via inductance of the printed circuit board is made based on the configuration of the printed circuit board. The decoupling capacitors of the PCB are modeled as a parallel combination of inductors, capacitors, and resistors, and the parallel combination is used to calculate the impedance. In addition to the impedance associated with the decoupling capacitors, the method calculates an inductance associated with a mounting orientation of the decoupling capacitors. The power and ground planes of the printed circuit board have an associated capacitance and inductance, which is calculated. The resultant simulated impedance profile illustrating the board configuration impedance over a frequency range is displayed.Type: GrantFiled: February 4, 2009Date of Patent: April 24, 2012Assignee: Altera CorporationInventors: Lawrence David Smith, Quoc Cuong D. Nguyen, Ravindra Reddy Gali