Patents by Inventor Cuong D. Nguyen

Cuong D. Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11875462
    Abstract: In implementations of systems for augmented reality authoring of remote environments, a computing device implements an augmented reality authoring system to display a three-dimensional representation of a remote physical environment on a display device based on orientations of an image capture device. The three-dimensional representation of the remote physical environment is generated from a three-dimensional mesh representing a geometry of the remote physical environment and digital video frames depicting portions of the remote physical environment. The augmented reality authoring system receives input data describing a request to display a digital video frame of the digital video frames. A particular digital video frame of the digital video frames is determined based on an orientation of the image capture device relative to the three-dimensional mesh. The augmented reality authoring system displays the particular digital video frame on the display device.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: January 16, 2024
    Assignee: Adobe Inc.
    Inventors: Zeyu Wang, Paul J. Asente, Cuong D. Nguyen
  • Publication number: 20230267696
    Abstract: Techniques for responsive video canvas generation are described to impart three-dimensional effects based on scene geometry to two-dimensional digital objects in a two-dimensional design environment. A responsive video canvas, for instance, is generated from input data including a digital video and scene data. The scene data describes a three-dimensional representation of an environment and includes a plurality of planes. A visual transform is generated and associated with each plane to enable digital objects to interact with the underlying scene geometry. In the responsive video canvas, an edit positioning a two-dimensional digital object with respect to a particular plane of the responsive video canvas is received. A visual transform associated with the particular plane is applied to the digital object and is operable to align the digital object to the depth and orientation of the particular plane. Accordingly, the digital object includes visual features based on the three-dimensional representation.
    Type: Application
    Filed: February 23, 2022
    Publication date: August 24, 2023
    Applicant: Adobe Inc.
    Inventors: Cuong D. Nguyen, Valerie Lina Head, Talin Chris Wadsworth, Stephen Joseph DiVerdi, Paul John Asente
  • Publication number: 20220157024
    Abstract: In implementations of systems for augmented reality authoring of remote environments, a computing device implements an augmented reality authoring system to display a three-dimensional representation of a remote physical environment on a display device based on orientations of an image capture device. The three-dimensional representation of the remote physical environment is generated from a three-dimensional mesh representing a geometry of the remote physical environment and digital video frames depicting portions of the remote physical environment. The augmented reality authoring system receives input data describing a request to display a digital video frame of the digital video frames. A particular digital video frame of the digital video frames is determined based on an orientation of the image capture device relative to the three-dimensional mesh. The augmented reality authoring system displays the particular digital video frame on the display device.
    Type: Application
    Filed: November 18, 2020
    Publication date: May 19, 2022
    Applicant: Adobe Inc.
    Inventors: Zeyu Wang, Paul J. Asente, Cuong D. Nguyen
  • Patent number: 11238657
    Abstract: In implementations of augmented video prototyping, a mobile device records augmented video data as a captured video of a recorded scene in an environment, the augmented video data including augmented reality tracking data as 3D spatial information relative to objects in the recorded scene. A video prototyping module localizes the mobile device with reference to the objects in the recorded scene using the 3D spatial information for the mobile device being within boundaries of the recorded scene in the environment. The video prototyping module can generate an avatar for display that represents the mobile device at a current location from a perspective of the recorded scene, and create a spatial layer over a video frame at the current location of the avatar that represents the mobile device. The spatial layer is an interactive interface on which to create an augmented reality feature that displays during playback of the captured video.
    Type: Grant
    Filed: March 2, 2020
    Date of Patent: February 1, 2022
    Assignee: Adobe Inc.
    Inventors: Cuong D. Nguyen, Paul J. Asente, Germán Ariel Leiva, Rubaiat Habib Kazi
  • Publication number: 20210272363
    Abstract: In implementations of augmented video prototyping, a mobile device records augmented video data as a captured video of a recorded scene in an environment, the augmented video data including augmented reality tracking data as 3D spatial information relative to objects in the recorded scene. A video prototyping module localizes the mobile device with reference to the objects in the recorded scene using the 3D spatial information for the mobile device being within boundaries of the recorded scene in the environment. The video prototyping module can generate an avatar for display that represents the mobile device at a current location from a perspective of the recorded scene, and create a spatial layer over a video frame at the current location of the avatar that represents the mobile device. The spatial layer is an interactive interface on which to create an augmented reality feature that displays during playback of the captured video.
    Type: Application
    Filed: March 2, 2020
    Publication date: September 2, 2021
    Applicant: Adobe Inc.
    Inventors: Cuong D. Nguyen, Paul J. Asente, Germán Ariel Leiva, Rubaiat Habib Kazi
  • Patent number: 10613703
    Abstract: Techniques and systems to support collaborative interaction as part of virtual reality video are described. In one example, a viewport is generated such that a reviewing user of a reviewing user device may view VR video viewed by a source user of a source user device. The viewport, for instance, may be configured as a border at least partially surrounding a portion of the VR video output by the reviewing VR device. In another instance, the viewport is configured to support output of thumbnails within an output of VR video by the reviewing VR device. Techniques and systems are also described to support communication of annotations between the source and reviewing VR devices. Techniques and systems are also described to support efficient distribution of VR video within a context of a content editing application.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: April 7, 2020
    Assignee: Adobe Inc.
    Inventors: Stephen Joseph DiVerdi, Aaron Phillip Hertzmann, Cuong D. Nguyen
  • Publication number: 20190056848
    Abstract: Techniques and systems to support collaborative interaction as part of virtual reality video are described. In one example, a viewport is generated such that a reviewing user of a reviewing user device may view VR video viewed by a source user of a source user device. The viewport, for instance, may be configured as a border at least partially surrounding a portion of the VR video output by the reviewing VR device. In another instance, the viewport is configured to support output of thumbnails within an output of VR video by the reviewing VR device. Techniques and systems are also described to support communication of annotations between the source and reviewing VR devices. Techniques and systems are also described to support efficient distribution of VR video within a context of a content editing application.
    Type: Application
    Filed: August 18, 2017
    Publication date: February 21, 2019
    Applicant: Adobe Systems Incorporated
    Inventors: Stephen Joseph DiVerdi, Aaron Phillip Hertzmann, Cuong D. Nguyen
  • Patent number: 10031039
    Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a fir
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: July 24, 2018
    Assignee: DUNAN SENSING LLC
    Inventors: Tom T. Nguyen, Cuong D. Nguyen
  • Patent number: 9874486
    Abstract: Systems and methods for packaging a MEMS device are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, a metal port is mounted directly to the MEMS device using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal port.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: January 23, 2018
    Assignee: DUNAN SENSING, LLC
    Inventors: Gary Winzeler, Danny Do, Cuong D. Nguyen, Emir Vukotic
  • Publication number: 20170191892
    Abstract: Systems and methods for packaging a MEMS device are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, a metal port is mounted directly to the MEMS device using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal port.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 6, 2017
    Inventors: Gary Winzeler, Danny Do, Cuong D. Nguyen, Emir Vukotic
  • Publication number: 20170160155
    Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second, third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a fir
    Type: Application
    Filed: February 15, 2017
    Publication date: June 8, 2017
    Inventors: TOM T. NGUYEN, CUONG D. NGUYEN
  • Patent number: 9593994
    Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firs
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: March 14, 2017
    Assignee: DUNAN SENSING, LLC
    Inventors: Tom T. Nguyen, Cuong D. Nguyen
  • Patent number: 9506829
    Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: November 29, 2016
    Assignee: DUNAN SENSING LLC
    Inventors: Tom T. Nguyen, Cuong D. Nguyen
  • Publication number: 20160109315
    Abstract: Compensated pressure sensor includes a MEMS pressure sensor die having resistors RA and RD connected in series in a first leg of a Wheatstone bridge and resistors RB and RC connected in series in a second leg of the Wheatstone bridge; a first and second fuse; and a first, second third, fourth, fifth and sixth resistor; wherein: a first end of the first resistor is connected in series with the first leg of the bridge and a first end of the second resistor is connected in series with the second leg of the bridge; the first fuse is connected, at a first end, to a first output of the bridge, and at a second end, to a second end of the third resistor and to a first end of the second fuse; the second fuse is connected, at a second end, to a second output of the bridge; a first end of the third resistor is connected to an input to the bridge and to a first end of the fourth resistor; a second end of the fourth resistor is connected to a second end of the first resistor, a second end of the second resistor and a firs
    Type: Application
    Filed: October 16, 2014
    Publication date: April 21, 2016
    Inventors: Tom T. Nguyen, Cuong D. Nguyen
  • Publication number: 20150369684
    Abstract: Pressure sensor package that includes: a pressure sensor support attached to an interconnect housing which is attached to a compensation support; wherein: (a) a pressure sensor device is attached to the pressure sensor support and is electrically connected to pads disposed on the pressure sensor support; (b) compensation circuitry is attached to the compensation support and is electrically connected to pads disposed on the compensation support; (c) connectors disposed in through holes in a wall of the interconnect housing are electrically connected to the pads on the pressure sensor support and to the pads on the compensation support; and (d) a pressure port is disposed in the pressure sensor support.
    Type: Application
    Filed: June 20, 2014
    Publication date: December 24, 2015
    Inventors: Tom T. Nguyen, Cuong D. Nguyen
  • Patent number: 8166447
    Abstract: A method of calculating a system power distribution network impedance is presented. The impedance calculation calculates the impedance as separate elements of the printed circuit board (PCB). An approximation of the power and ground via inductance of the printed circuit board is made based on the configuration of the printed circuit board. The decoupling capacitors of the PCB are modeled as a parallel combination of inductors, capacitors, and resistors, and the parallel combination is used to calculate the impedance. In addition to the impedance associated with the decoupling capacitors, the method calculates an inductance associated with a mounting orientation of the decoupling capacitors. The power and ground planes of the printed circuit board have an associated capacitance and inductance, which is calculated. The resultant simulated impedance profile illustrating the board configuration impedance over a frequency range is displayed.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: April 24, 2012
    Assignee: Altera Corporation
    Inventors: Lawrence David Smith, Quoc Cuong D. Nguyen, Ravindra Reddy Gali