Abstract: A single inductor multiple LED string driver comprises a switch control circuit and a current-sensing control circuit. The switch control circuit generates a plurality of digital control signals that are used to control a plurality of switches coupled to a plurality of strings of LEDs. Each switch is selectively turned on and off by each corresponding digital control signal. The current-sensing control circuit determines an integrated charge amount provided by each current that flows from an input voltage through each LED string, through each switch, through a common inductor, and through a main switch to ground. In response to the determined integrated charge amount, the current-sensing control circuit generates an on-time control signal that controls the on-time of each switch such that the average current flowing across each LED string is equal to each other. Furthermore, the total current flowing across each LED string is regulated to a predefined value.

Abstract: A single inductor multiple LED string driver comprises a switch control circuit and a current-sensing control circuit. The switch control circuit generates a plurality of digital control signals that are used to control a plurality of switches coupled to a plurality of strings of LEDs. Each switch is selectively turned on and off by each corresponding digital control signal. The current-sensing control circuit determines an integrated charge amount provided by each current that flows from an input voltage through each LED string, through each switch, through a common inductor, and through a main switch to ground. In response to the determined integrated charge amount, the current-sensing control circuit generates an on-time control signal that controls the on-time of each switch such that the average current flowing across each LED string is equal to each other. Furthermore, the total current flowing across each LED string is regulated to a predefined value.

Abstract: The present invention involves a universal connector assembly for electronic interconnection. The connector assembly includes a printed circuit board to which a male insert is in electrical communication. The male insert includes a strain relief tail connected to the printed circuit board and extends to a contact head. The assembly further includes a female socket for receiving the contact head of the male insert. The female socket has receiving members extending from a base to respective ends. The ends are biasingly spaced apart to define an opening through which the male insert is disposed for electrical contact with the female socket. The receiving members have an inside contact surface and an outside surface wherein the inside surface is configured to complement the outer contact wall of the male insert for electrical engagement when the male insert is disposed through the opening. The assembly further comprises a connector housing to which the base of the female socket is attached.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Abstract: An opto-electronic semiconductor microcircuit chip package where the chip is mounted upon a substrate or boat which in turn is mounted to the floor of the package upon a pool of reflowable solder. Actuator wires connect from package pads to pads on the boat. When the solder is liquefied, the entire package is placed in a magnetic field and current runs through actuator wires in order to force rotation of the boat according to Maxwell's equations for electric current in a magnetic field. The current is adjusted to obtain the proper torque on the boat to move it into alignment with an impinging fiber optic cable. Once in alignment, the solder is cooled to lock the boat in place and in alignment.

Abstract: A system and method for reworking, repairing and upgrading flatwire is disclosed. A repair tool for reworking and/or repairing the flatwire is disclosed for creating subsequent electrical and mechanical joints of equal or greater quality as compared to the original system. The repair tool includes a heating blade, a power controller, a tool assembly, an inerting system, a cooling system, a flatwire cassette, a tool material, a flatwire material, an upgrade/repair procedure and various other aspects for rapidly heating flatwire two join two separate portions of the flatwire. The system and method of the present invention addresses the challenges of working with substrate materials which typically degrade at temperatures commonly used to form solder joints. Further, the soldering tool of the present invention may be a portable, lightweight unit that can be used in the field, for automotive and aerospace applications.

Abstract: The present invention involves a universal connector assembly for electronic interconnection. The connector assembly includes a printed circuit board to which a male insert is in electrical communication. The male insert includes a strain relief tail connected to the printed circuit board and extends to a contact head. The assembly further includes a female socket for receiving the contact head of the male insert. The female socket has receiving members extending from a base to respective ends. The ends are biasingly spaced apart to define an opening through which the male insert is disposed for electrical contact with the female socket. The receiving members have an inside contact surface and an outside surface wherein the inside surface is configured to complement the outer contact wall of the male insert for electrical engagement when the male insert is disposed through the opening. The assembly further comprises a connector housing to which the base of the female socket is attached.

Abstract: A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes fixing the die to the substrate, interconnecting the electronic die to an at least one bonding pad on the substrate to form an electrical connection, coating the interconnects and the electronic die with an electrically insulating coating, and covering the electronic die with a low temperature melting metal. Thus, the method of the present invention improves the reliability of the electronic die.

Abstract: A first fixture holds a plurality of circuit components backside up in a substantially coplanar relationship. An adhesive applying device, such as screen printer, applies adhesive to the backside of each circuit component. A second fixture is aligned with and placed on the first fixture. The fixtures are then flipped so that the circuit components are supported in a right side up position by the second fixture. A device such as a pick and place machine, may then be used to transfer the circuit components from the second fixture to a substrate.

Abstract: A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

Abstract: A method for producing an electronic circuit assembly (e.g., a circuit board) from an etched tri-metal-layer structure which provides air bridge crossovers and specially designed bumps etched from a middle layer of the tri-metal-layer structure. The bumps are formed at particular circuit locations in order to provide interconnects for (1) heavy wirebonding, (2) fine wirebonding, or (3) direct chip attachment; or, to provide (4) lifters for assuring a minimum solder joint standoff height or (5) barriers for retarding solder joint crack propagation.

Abstract: A solderless method for assembling a semiconductor electronic flip-chip device to an electrical interconnecting substrate including the steps of forming a plurality of raised electrical contacts and plurality of contact pads. The pads correspond in number and physical location with the electrical contacts. The pads and contact mate when brought together. A quantity of plastic material is interposed between the electrical device and substrate. The plastic material is heated so that it softens and flows. The electronic device and substrate are urged together. The urging step displaces the molten plastic material from between the contacts and pads. The contacts and pads are jointed directly without any adhesive, solder or conducive filler therebetween to electrically interconnect the electronic device and substrate. The plastic material is allowed to cool whereby the electronic device and substrate are adhesively bonded together and electrically interconnected.

Abstract: An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20.

Abstract: A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, such as a screen printer, applies adhesive to the backside of each circuit component. The circuit components may then be transferred onto a substrate by the use of a piston transfer device, for instance. Preferably, all the circuit components are transferred substantially simultaneously.

Abstract: A substrate and electrical connector assembly including a unitary panel structure with metal conductors having a rigid main body portion, a rigid marginal edge portion, and a thin flexible section extending between the rigid main body portion and the rigid marginal edge portion. The assembly also includes an at least one conductive lead deposited on a surface of the plastic panel structure which extends from the rigid main body portion across the flexible section to the rigid marginal edge portion. Further included is an at least one conductive terminal affixed to the rigid marginal edge portion which is in electrical connection with the at least one conductive lead. The at least one conductive terminal is adapted to receive a mating connector. The flexible section enables the rigid marginal edge portion to move relative to the rigid main body portion.

Abstract: A method for bonding together at least two conductive members 20, wherein each member includes at least one metallic 22 having a respective bonding area 24. At least one member has a deposition of metallic bonding material 26 attached to each respective conductor proximate each bonding area, and at least one member has a plastic element 28 attached thereto proximate each respective bonding area. The members 20 are positioned in a predetermined orientation, clamped together between an ultrasonic horn and anvil arrangement, with pressure and orthogonal ultrasonic energy being applied thereto so that each plastic element 28 is heated, which in turn melts the bonding material 26. Any plastic element material between the conductors is squeezed away therefrom and the respective conductors 22 are brought into proximity with each other so that a molten joint of bonding material physically contacts each respective conductor.

Abstract: An electrical circuit assembly which requires no solder processing, including an electronic component having terminations arranged on at least one of its surfaces, and a molded curviplanar substrate having circuit traces thereon and a cavity formed therein, wherein the cavity substantially conforms in shape with the electronic component. Proximate the cavity is a plurality of electrical contacts, arranged in matched relation with the respective terminations of the electronic component, with at least one of the electrical contacts being connected to at least one of the circuit traces on the substrate. The cavity and electrical contacts are dimensioned such that an interference fit is provided between the component's terminations and the electrical contacts, such that the component is held within the cavity when the component is placed therein. The component is disposed in the cavity such that its terminations are in physical and electrical connection with their respective electrical contacts.

Abstract: A method of soldering materials by controlling ultrasonic energy to effect melting of only the solder in an assembly to be joined that is carried on a low temperature melting substrate.

Abstract: There is disclosed herein an electrically conductive coupling for connecting an electrical element to a conductive circuit trace on a printed circuit board, comprising: (1) a finger extending outward from an edge of a rigid printed circuit board, wherein the circuit trace terminates on a first surface of the finger; (2) an electrical connector formed from a metal stamping and comprising: a substantially rectotubular barrel portion being dimensioned so as to provide an interference fit with the finger when the finger is inserted therein; an engaging portion being removably connectable with the electrical element; and a transition portion integral with the barrel portion and engaging portion; wherein the finger is connectably inserted into the barrel portion; and (3) a solidified joint of electrically conductive bonding material disposed on the first surface of the finger, such that the joint electrically couples the circuit trace with the barrel portion of the electrical connector.