Abstract: Automatically associating users of a communication system, without using an invitation or affirmative permission. In one embodiment, a first user submits contact information about a second user to a relationship system, which stores the information in the first user's contact list. Similarly, a second user submits contact information about the first user to the relationship system, which stores the information in the second user's contact list. The relationship system detects the cross reference in the two contact lists, and stores a first degree relationship between the two users. One of the users submits a request to the relationship system to enable an operation with any other user that was associated with the submitting user. Associations can also be selectively higher degrees with other users. The submitting user need not know which other users will participate in the operation, and the other users need not know the submitting user's identity.

Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.

Abstract: A method of making a circuitized substrate having plated through holes free of filler material is provided. The method includes the steps of providing a dielectric substrate having first and second opposite faces. At least one via hole is formed from one face to the other. A first electrically conductive layer is applied onto the top and bottom faces of the dielectric member and onto the side wall of the via. First layers of photoresist are applied to each layer of conductive material and entering at least partially into the via hole. The first layers of photoresist are selectively exposed and developed to remove all of the photoresist, except that photoresist which is disposed in the via holes. Thereafter, a portion of the faces of the metal coatings on the surfaces of dielectric material and any photoresist remaining in the holes extending above the layers of electrically conductive material are removed to form a planar surface thinner than the thickness of the metal in the through hole.

Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.

Abstract: A high density printed wiring board is prepared by applying an essentially solid material into plated through holes such that the metallized layers within the through hole are unaffected by chemical metal etchants. In this manner, lateral surface metallized layers can exclusively be reduced in thickness by use of said chemical agents. These thinned lateral surface metallized layers are ultimately converted into fine pitch, 25 to 40 microns, circuitry, thereby providing high density boards. Since the through hole wall metallization is unaffected by the etching process, excellent electrical connection between the fine line circuitry is obtained. Various printed wiring board embodiments are also presented.

Abstract: A system for wet application of a dry film, such as a photoresist, to a generally planar panel having upper and lower surfaces, such as a printed circuit board, is provided. The apparatus comprises rotatable upper and lower wetting rollers each having an absorbent material such as neoprene on the surface thereof, and a mechanism for holding the upper wetting roller in forcible contact with the lower wetting roller so that rotation of the lower wetting roller is translated into rotation of the upper wetting roller. The lower wetting roller is positioned at least partially within a container providing a supply of wetting agent, such as water, such that the wetting agent is in contact with the absorbent material on the surface of the lower wetting roller.