Patents by Inventor Curtis L. Progl

Curtis L. Progl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8684565
    Abstract: A lamp comprises an LED assembly comprising at least a first LED operable to emit light. A heat sink for dissipating heat from the LED assembly comprises an active element and a passive heat conductive element. The active element may comprise a fan that forces air over the passive heat conducting element.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: April 1, 2014
    Assignee: Cree, Inc.
    Inventors: Peter E. Lopez, Curtis L. Progl, Long Larry Le
  • Publication number: 20130114260
    Abstract: A lamp comprises an LED assembly comprising at least a first LED operable to emit light. A heat sink for dissipating heat from the LED assembly comprises an active element and a passive heat conductive element. The active element may comprise a fan that forces air over the passive heat conducting element.
    Type: Application
    Filed: November 9, 2011
    Publication date: May 9, 2013
    Applicant: CREE, INC.
    Inventors: Peter E. Lopez, Curtis L. Progl, Long Larry Le
  • Patent number: 6837063
    Abstract: A system and method for power management of a computer with a vapor-cooled processor is disclosed. A dual mode cooling system for an information handling system includes a heat exchanger for receiving heat generated by the information handling system. The system further includes a condenser in communication with the heat exchanger such that the heat received at the heat exchanger is transferred to the condenser. The heat exchanger and the condenser are able to selectively operate in an active cooling mode and a passive cooling mode.
    Type: Grant
    Filed: July 31, 2003
    Date of Patent: January 4, 2005
    Assignee: Dell Products L.P.
    Inventors: Charles D. Hood, III, Curtis L. Progl
  • Patent number: 6084769
    Abstract: A portable computer docking base has incorporated therein a plug-in cooling system used to provide auxiliary operating heat dissipation for a portable notebook computer moved through a docking path along the base into a docked relationship therewith. The docking base cooling system has a fan-cooled heat sink member disposed within its housing, with a thermal plug structure projecting outwardly from the heat sink into the docking path. As the computer reaches its docked orientation on the base, the thermal plug is received in a socket within a heat sink portion of the computer's internal cooling system. The mated plug and socket portions of the two cooling systems form a thermal link therebetween that permits computer operating heat to be transferred to the docking base heat sink for dissipation therefrom. In one embodiment thereof the thermal plug structure is partially defined by an outwardly projecting evaporating end portion of a thermosyphoning heat pipe.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: July 4, 2000
    Assignee: Compaq Computer Corporation
    Inventors: David A. Moore, Curtis L. Progl, Mark S. Tracy
  • Patent number: 6075696
    Abstract: Operational heat generated by an electronic component in the base housing of a notebook computer is transferred to the back wall of its display housing for dissipation to ambient by a heat pipe disposed in the base housing and having an evaporator portion in thermal contact with the heat-generating component, and a spreader plate structure formed from multiple thin metal layers. The spreader plate structure has a heat dissipation portion disposed within the display housing and held in thermal contact with its back wall, a pickup region disposed in the base housing and held in thermal contact with a condensing portion of the heat pipe, and a bendable dynamic portion positioned between the heat dissipation and pickup portions and extending through the lid hinge area of the computer.
    Type: Grant
    Filed: November 6, 1997
    Date of Patent: June 13, 2000
    Assignee: Compaq Computer Corporation
    Inventors: Curtis L. Progl, Allen P. Zhang
  • Patent number: 5930115
    Abstract: A thermal management structure to provide mechanical isolation and heat removal for an unpackaged semiconductor die mounted directly on a printed circuit board substrate. The thermal management structure sandwiches the unpackaged semiconductor die and substrate between two heat sink pieces which are rigidly mounted to the substrate, thereby mechanically isolating the unpackaged semiconductor die and preventing the die from being accidentally touched. The two heat sink pieces further compliantly thermally engage selected sites on the exposed face of the semiconductor die and the surface of the substrate to conductively remove heat away from the substrate. The thermal management structure may also provide electromagnetic shielding which isolates the electromagnetic fields generated by the substrate from electromagnetic fields external to the thermal management structure.
    Type: Grant
    Filed: April 3, 1998
    Date of Patent: July 27, 1999
    Assignee: Compaq Computer Corp.
    Inventors: Mark S. Tracy, Minh H Nguyen, Curtis L. Progl
  • Patent number: 5847925
    Abstract: A computer includes a flexible member or tube fabricated from thermally conductive carbon fibers for transferring heat from a first portion, such as a base section of a portable computer, to a second portion, such as the display section of a portable computer, where the sections of the computer move between an open operating position and a closed position. The flexible member, fabricated from conductive fibers, is positioned so as to experience torsion upon opening the portable computer. A first heat pipe is thermally connected with a microprocessor in the base section at one end and at the other end is coaxially attached within the member or tube. A second heat pipe is similarly coaxially attached to the other end of the member or tube.
    Type: Grant
    Filed: August 12, 1997
    Date of Patent: December 8, 1998
    Assignee: Compaq Computer Corporation
    Inventors: Curtis L. Progl, Mark S. Tracy, David A. Moore