Abstract: A structure and method for cold weld compression bonding using a metallic nano-structured gasket is provided. This structure and method allows a hermetic package to be formed at lower pressures and temperatures than are possible using bulk or conventional thin-film gasket materials.

Abstract: A structure and method for cold weld compression bonding using a metallic nano-structured gasket is provided. This structure and method allows a hermetic package to be formed at lower pressures and temperatures than are possible using bulk or conventional thin-film gasket materials.

Abstract: A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld material is sealed to a package base 405 containing integral device 445 then cold welded with an external force mechanism to compress and flow cold seal preform material 435 creating a hermetic peripheral seal in an inert or vacuum atmosphere. Arrays of devices can be sealed with individual caps or arrays of caps which are interconnected.

Abstract: A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap 410 coated with precursor weld material is sealed to a package base 405 containing integral device 445 then cold welded with an external force mechanism to compress and flow cold seal preform material 435 creating a hermetic peripheral seal in an inert or vacuum atmosphere. Arrays of devices can be sealed with individual caps or arrays of caps which are interconnected.

Abstract: A swage hermetic sealing of a MEMS or microdevice or nanodevice package using high force. A cutting and flowing edge 430 is formed on a package cover which is pressed into a mating , integral gasket 425 on a package base. A material extension of the package cover 450 is simultaneously folded under the package base to supply force maintenance for permanent hermaticity. The swage hermetic sealing of single or an array of covers to an extended wafer or substrate is accomplished by a cutting and flowing edge 560. Permanent force maintenance is achieved through a re-entrant cavity 565 and annular ring 535 on the wafer or substrate.

Abstract: The present invention provides a glass BGA (ball grid array) including a glass substrate having a plurality of conductive leads, such as thin film metal deposited thereon. A die or chip is mounted in a fixed relationship to the glass substrate, and is often mounted on the glass substrate. The die includes a plurality of I/O pads for providing electrical access to circuitry inside the die. Circuitry is included for connecting the plurality of I/O pads to the plurality of conductive leads on the glass substrate.

Abstract: An apparatus for testing semiconductor devices including probe tips for contacting input/output pads on the device attached to a probe membrane fixed to a package using a layer of elastomeric material. The elastomeric material and use of compliant bump probe tips effect a global planarization for improved electrical contact between the probe assembly and the input/output contacts on the device under test.

Abstract: An apparatus for testing semiconductor devices including probe tips for contacting input/output pads on the device attached to a probe membrane fixed to a package using a layer of elastomeric material. The elastomeric material and use of compliant bump probe tips effect a global planarization for improved electrical contact between the probe assembly and the input/output contacts on the device under test.