Patents by Inventor C. Y. Wang
C. Y. Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240084399Abstract: The invention relates to modulating the SIRP?-CD47 interaction in order to treat hematological cancer and compounds therefor. In some embodiments, there is provided methods and uses of SIRP? polypeptides, fragments and fusion proteins for treating hematological cancer, preferably human acute myeloid leukemia.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicants: UNIVERSITY HEALTH NETWORK, THE HOSPITAL FOR SICK CHILDRENInventors: Jean C.Y. WANG, John DICK, Jayne DANSKA, Liqing JIN, Alexandre THEOCHARIDES, Sujeetha RAJAKUMAR
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Patent number: 11755410Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: GrantFiled: July 26, 2022Date of Patent: September 12, 2023Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
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Publication number: 20220358013Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: ApplicationFiled: July 26, 2022Publication date: November 10, 2022Inventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
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Patent number: 11429482Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: GrantFiled: February 18, 2021Date of Patent: August 30, 2022Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
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Publication number: 20210371937Abstract: There is described herein an assay comprising, for each of DNMT3B, ZBTB46, NYNRIN, ARHGAP22, LAPTM4B, MMRN1, DPYSL3, KIAA0125, CDK6, CPXM1, SOCS2, SMIM24, EMP1, NGFRAP1, CD34, AKR1C3, GPR56, a pair of probes complementary and hybridizable thereto on an array, optionally with a set of reference genes.Type: ApplicationFiled: August 5, 2021Publication date: December 2, 2021Inventors: JEAN C.Y. WANG, ZHIBIN LU, STANLEY NG, TRACY STOCKLEY, TRACY MURPHY, IAN KING, TONG ZHANG, MICHELLE MAH
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Publication number: 20210173739Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: ApplicationFiled: February 18, 2021Publication date: June 10, 2021Inventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C.Y. Wang
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Patent number: 10936413Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: GrantFiled: March 7, 2019Date of Patent: March 2, 2021Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C.Y. Wang
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Patent number: 10907209Abstract: The invention relates to modulating the SIRP?-CD47 interaction in order to treat hematological cancer and compounds therefor. In some embodiments, there is provided methods and uses of SIRP? polypeptides, fragments and fusion proteins for treating hematological cancer, preferably human acute myeloid leukemia.Type: GrantFiled: May 14, 2010Date of Patent: February 2, 2021Assignees: UNIVERSITY HEALTH NETWORK, THE HOSPITAL FOR SICK CHILDRENInventors: Jean C. Y. Wang, John Dick, Jayne Danska, Liqing Jin, Alexandre Theocharides, Sujeetha Rajakumar
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Publication number: 20190205208Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures, the subset of bits comprise compressed code. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: ApplicationFiled: March 7, 2019Publication date: July 4, 2019Inventors: YU-DER CHIH, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C.Y. Wang
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COMPOSITIONS AND METHODS FOR TREATING HEMATOLOGICAL CANCERS TARGETING THE SIRPALPHA CD47 INTERACTION
Publication number: 20190093174Abstract: The invention relates to modulating the SIRP?-CD47 interaction in order to treat hematological cancer and compounds therefor. In some embodiments, there is provided methods and uses of SIRP? polypeptides, fragments and fusion proteins for treating hematological cancer, preferably human acute myeloid leukemia.Type: ApplicationFiled: August 30, 2018Publication date: March 28, 2019Inventors: Jean C.Y. Wang, John Dick, Jayne Danska, Liqing Jin, Alexandre Theocharides, Sujeetha Rajakumar -
Patent number: 10228998Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: GrantFiled: August 4, 2016Date of Patent: March 12, 2019Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: Yu-Der Chih, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C. Y. Wang
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Publication number: 20180039537Abstract: Systems and methods for correcting data errors in memory caused by high-temperature processing of the memory are provided. An integrated circuit (IC) die including a memory is formed. Addresses of memory locations that are susceptible to data loss when subjected to elevated temperatures are determined. Bits of data are written to the memory, where the bits of data include a set of bits written to the memory locations. The set of bits are written to a storage device of the IC die that is not susceptible to data loss when subjected to the elevated temperatures. At least one of the bits stored at the addresses is overwritten after subjecting the IC die to an elevated temperature. The at least one of the bits is overwritten based on the set of bits written to the storage device.Type: ApplicationFiled: August 4, 2016Publication date: February 8, 2018Inventors: YU-DER CHIH, Ching-Huang Wang, Yi-Chun Shih, Meng-Chun Shih, C.Y. Wang
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ANTIBODIES AND ANTIBODY FRAGMENTS TARGETING SIRP-ALPHA AND THEIR USE IN TREATING HEMATOLOGIC CANCERS
Publication number: 20140242095Abstract: The invention relates to modulating the SIRP?—CD47 interaction in order to treat hematological cancer and compounds therefor. In particular, there is also provided SIRP? antibodies and antibody fragments, preferably used for treating hematological cancer.Type: ApplicationFiled: October 19, 2012Publication date: August 28, 2014Applicant: University Health NetworkInventors: Jean C. Y. Wang, Jayne S. Danska, John Dick, Sachdev Sidhu, Maruti Uppalapati -
Publication number: 20120189625Abstract: The invention relates to modulating the SIRP?-CD47 interaction in order to treat hematological cancer and compounds therefor. In some embodiments, there is provided methods and uses of SIRP? polypeptides, fragments and fusion proteins for treating hematological cancer, preferably human acute myeloid leukemia.Type: ApplicationFiled: May 14, 2010Publication date: July 26, 2012Applicant: UNIVERSITY HEALTH NETWORKInventors: Jean C.Y. Wang, John Dick, Jayne Danska, Liqing Jin, Alexandre Theocharides, Sujeetha Rajakumar
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Publication number: 20060246193Abstract: Shredded whole grain products, such as ready-to-eat cereals, and sweet and savory snacks, such as whole grain shredded corn chips are continuously produced by pelletizing agglomerates of cooked, tempered, whole cereal grain particles. Cooked whole grains, such as corn and other non-gluten or low-gluten containing grains have a tendency to become hard and rubbery after cooking during the cooling and tempering process. The pelletization results in the production of whole grain pellets having a soft, pliable texture, which are shreddable into continuous net-like sheets on a mass production basis. The pelletizing may be at a pressure of about 200 psig to about 600 psig, preferably from about 400 psig to about 500 psig. The pelletizing temperature may be controlled to provide a pellet temperature of about 80° F. to about 120° F., preferably from about 90° F. to about 110° F., upon exiting the pelletizer.Type: ApplicationFiled: April 29, 2005Publication date: November 2, 2006Inventors: Jan Karwowski, Vani Vemulapalli, C.Y. Wang, Kenneth Maas, Alex Gong, Mihaelos Mihalos
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Publication number: 20040067282Abstract: A savory or sweet snack having an expanded, crispy, chip-like textured, substantially uniform, homogeneous, cellular coating is obtained by tumbling an edible core material, such as nuts or dried fruit, and alternately applying an aqueous component and a preblended dry mixture on the tumbling edible core material to form a dough coating on the edible core material. The dough-coated core material may be heated by frying or baking to substantially reduce the moisture content of the dough, and to substantially expand the dough. The thick, expanded coating has a substantial amount of wheat yet it possesses a crispy, crunchy texture of a chip, rather than a leavened, mealy or flaky texture. Use of a pregelatinized waxy starch, which is not chemically modified, provides crispness and a high degree of expansion Use of a pure, raw potato starch which is not chemically modified promotes crunchiness and a chip-like texture and reduces oil pick-up or absorption during frying.Type: ApplicationFiled: October 4, 2002Publication date: April 8, 2004Inventors: Jan Karwowski, C. Y. Wang, Randy G. Young
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Publication number: 20040025879Abstract: A method and apparatus for protecting humans against hazardous particulate agents such as biological or chemical agents. A special porous cloth contains activated carbon threads that is used as a quick escape mask to cover the mouth and/or nose of a person to protect the person from inhaling hazardous particulates. This simple cloth mask may be designed for short-term emergency respiratory protection and can be particularly convenient for use by people who are in relatively public, enclosed areas (such as in restaurants, bars, or hotel rooms) and who might need to evacuate those areas in a short period of time. The cloth may also be used in other applications, for example, as a tent liner, as a liner for military uniforms or diving suits, or as a water or air filtration device. In addition to protection from hazardous agents, the cloth may sometimes additionally filter out bad odors.Type: ApplicationFiled: November 7, 2002Publication date: February 12, 2004Inventors: Roger C.Y. Wang, John J. Titus, Frederick M. Jameson
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Publication number: 20040026055Abstract: The present invention is drawn to a thermally and structurally stable, noncombustible paper, comprising a dominant amount of aluminosilicate refractory fibers and from 0.2% to 4% by weight of a polymeric binder. The refractory fibers can be substantially from 1 micron to 35 microns in width and from 1 cm to 15 cm in length, though other functional dimensions can be used. Optionally, from 0.1% to 5% by weight of viscose fibers and/or from 0.2% to 5% by weight of silicic acid aquagel can also be present. The papers of the present invention are mat-type papers that can be structurally stable at very high temperatures up to about 1400° C. or more.Type: ApplicationFiled: January 31, 2003Publication date: February 12, 2004Inventors: John J. Titus, Roger C.Y. Wang
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Patent number: 6533897Abstract: The present invention is drawn to a thermally and structurally stable, noncombustible paper, comprising a dominant amount of aluminosilicate refractory fibers and from 0.2% to 4% by weight of a polymeric binder. The refractory fibers can be substantially from 1 micron to 35 microns in width and from 1 cm to 15 cm in length, though other functional dimensions can be used. Optionally, from 0.1% to 5% by weight of viscose fibers and/or from 0.2% to 5% by weight of silicic acid aquagel can also be present. The papers of the present invention are mat-type papers that can be structurally stable at very high temperatures up to about 1400° C. or more.Type: GrantFiled: April 13, 2001Date of Patent: March 18, 2003Assignee: FMJ Technologies, LLCInventors: Roger C. Y. Wang, John Titus
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Publication number: 20020174963Abstract: The present invention is drawn to a thermally and structurally stable, noncombustible paper, comprising a dominant amount of aluminosilicate refractory fibers and from 0.2% to 4% by weight of a polymeric binder. The refractory fibers can be substantially from 1 micron to 35 microns in width and from 1 cm to 15 cm in length, though other functional dimensions can be used. Optionally, from 0.1% to 5% by weight of viscose fibers and/or from 0.2% to 5% by weight of silicic acid aquagel can also be present. The papers of the present invention are mat-type papers that can be structurally stable at very high temperatures up to about 1400° C. or more.Type: ApplicationFiled: April 13, 2001Publication date: November 28, 2002Applicant: FMJ Technologies, LLCInventors: Roger C.Y. Wang, John Titus