Patents by Inventor Cynthia Brooks

Cynthia Brooks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9585491
    Abstract: This disclosure relates generally to inflatable mattresses in the form of beds, chairs, couches, or other gas-inflatable structures. The mattress has an internal support structure with one or more diagonal structural support elements comprised of rigid or flexible cords or cables that are coupled to the top, bottom, and/or sides of the air mattress. The support elements provide increased top-to-bottom, side and/or corner rigidity when subject to top loading. The mattress may also include an integral handle structure so as to allow a user to readily lift and/or transport the air mattress when inflated.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: March 7, 2017
    Assignee: LSO LP
    Inventors: Brian P. Cox, Cynthia Brooks
  • Publication number: 20150113736
    Abstract: This disclosure relates generally to inflatable mattresses in the form of beds, chairs, couches, or other gas-inflatable structures. The mattress has an internal support structure with one or more diagonal structural support elements comprised of rigid or flexible cords or cables that are coupled to the top, bottom, and/or sides of the air mattress. The support elements provide increased top-to-bottom, side and/or corner rigidity when subject to top loading. The mattress may also include an integral handle structure so as to allow a user to readily lift and/or transport the air mattress when inflated.
    Type: Application
    Filed: October 29, 2014
    Publication date: April 30, 2015
    Inventors: Brian P. Cox, Cynthia Brooks
  • Publication number: 20070296980
    Abstract: Methods and apparatus for controlling the critical dimensions and monitoring the phase shift angles of photomasks. Critical dimensions measurement data before wafer processing and after wafer processing are collected by an integrated metrology tool to adjust the process recipe, to determine if the critical dimensions are in specification and to determine if additional etching is required. Phase shift angle and uniformity across substrate measurement after wafer processing are collected by an integrated metrology tool to determine if the phase shift angle and its uniformity are in specification. The real time process recipe adjustment and determination if additional etching is requires allow tightening of the process control. The phase shift angle and uniformity monitoring allows in-line screening of phase shift photomasks.
    Type: Application
    Filed: July 31, 2007
    Publication date: December 27, 2007
    Inventors: ALFRED MAK, Yung-Hee Lee, Cynthia Brooks, Melisa Buie, Turgut Sahin, Jian Ding
  • Publication number: 20060049137
    Abstract: Method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for processing a photolithographic reticle including positioning the reticle on a support member in a processing chamber, wherein the reticle comprises a metal photomask layer formed on a silicon-based substrate, and a patterned resist material deposited on the silicon-based substrate, etching the substrate with an oxygen-free processing gas, and then etching the substrate with an oxygen containing processing gas.
    Type: Application
    Filed: October 31, 2005
    Publication date: March 9, 2006
    Inventors: Cynthia Brooks, Melisa Buie, Brigitte Stoehr
  • Publication number: 20050153564
    Abstract: Methods and apparatus for controlling the critical dimensions and monitoring the phase shift angles of photomasks. Critical dimensions measurement data before wafer processing and after wafer processing are collected by an integrated metrology tool to adjust the process recipe, to determine if the critical dimensions are in specification and to determine if additional etching is required. Phase shift angle and uniformity across substrate measurement after wafer processing are collected by an integrated metrology tool to determine if the phase shift angle and its uniformity are in specification. The real time process recipe adjustment and determination if additional etching is requires allow tightening of the process control. The phase shift angle and uniformity monitoring allows in-line screening of phase shift photomasks.
    Type: Application
    Filed: January 9, 2004
    Publication date: July 14, 2005
    Inventors: Alfred Mak, Yung-Hee Lee, Cynthia Brooks, Melisa Buie, Turgut Sahin, Jian Ding
  • Publication number: 20050008945
    Abstract: Method and apparatus for etching a metal layer disposed on a substrate, such as a photolithographic reticle, are provided. In one aspect, a method is provided for processing a photolithographic reticle including positioning the reticle on a support member in a processing chamber, wherein the reticle comprises a metal photomask layer formed on a silicon-based substrate, and a patterned resist material deposited on the silicon-based substrate, etching the substrate with an oxygen-free processing gas, and then etching the substrate with an oxygen containing processing gas.
    Type: Application
    Filed: March 18, 2004
    Publication date: January 13, 2005
    Inventors: Cynthia Brooks, Melisa Buie, Brigitte Stoehr