Patents by Inventor Cynthia L. Cain

Cynthia L. Cain has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Molding and overmolding compositions for electronic devices
    Patent number: 9415532
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: August 16, 2016
    Assignee: HENKEL IP HOLDING GMBH
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES
    Publication number: 20160031134
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Application
    Filed: August 3, 2015
    Publication date: February 4, 2016
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • Molding and overmolding compositions for electronic devices
    Patent number: 9127153
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 8, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus
  • MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES
    Publication number: 20140127445
    Abstract: The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.
    Type: Application
    Filed: March 14, 2013
    Publication date: May 8, 2014
    Applicant: Henkel Corporation
    Inventors: Cynthia L. Cain, Charles W. Paul, Maria Cristina Barbosa DeJesus