Abstract: The method of coating the area of hybridization of a component that is constituted by two elements bonded to one another by means of a soldering material, including depositing proximate to the component a coating substance capable of filling by capillarity action the volume defined between the hybridized elements of the component. Further, along the periphery of the hybridization area on the lower element of the component is an area of non-wettability in regards to the coating substance, that is defined by depositing an anti-wetting covering of PECVD in regards to the coating substance, whereby the anti-wetting covering on the first element encompasses the hybridization area and surrounds a wetting surface for the coating substance.

Abstract: This method of coating the area of hybridization of a component constituted by two elements associated with one another by means of a soldering material, comprises depositing in proximity to said component a coating substance capable of filling by capillarity the volume defined between the hybridized elements of said component. On the periphery of the hybridization area on the lower element of said component is defined an area (10) of non-wettability as regards said substance, by deposition of a covering anti-wetting as regards said substance, applied by PECVD, and defining on said first element, in line with the hybridization, a wetting surface for the coating substance.

Abstract: A method for soldering or hybridizing two components to each other by means of a solder material, including producing, on the opposite-facing surfaces of the components to be soldered or hybridized, a surface capable of being wetted by said solder material, this surface being produced on a first component which is in electrical contact with a metallic conductor, depositing an appropriate quantity of solder material capable of constituting a solder or hybridization pad on one of the wettability surfaces, depositing a flux material in liquid form, bringing the wettability surface of the other component into contact with the solder material thus deposited and raising the temperature until at least the melting temperature of the solder material is reached in order to ensure effective soldering or hybridization of the two components to each other due to the reflow effect.

Abstract: According to the invention, in an assembly comprising an electronic component (108), said component is connected by microbeads (107) to at least one heat sink (106, 109), said beads being connected to electrically-conductive lines on said electronic component and to electrically-conductive lines on at least one heat sink, said beads carrying, on the one hand, electrical signals between the electronic component and each heat sink bearing said electrically-conductive lines and, on the other hand, the heat from the electronic component to each heat sink, via heat conduction.

Abstract: The invention relates to a method for making an anisotropic conductive film with pointed conductive inserts. The method comprises the etching of at least one pattern (C1, K1) in a single crystal substrate (15) in order to form at least one cell (22, 26) with a bottom intended for drawing the contour of an end of an insert (23, 27). The drawing of the pattern is for having at least one protruding tip appear in the bottom of the cell during the etching of the pattern along the (100) crystallographic plane of the substrate with limiting (111) or (110) planes of the pattern. The invention is applied to microconnector technology.