Abstract: The application relates to a semiconductor device for particle measurement having a cavity housing and a MEMS chip arranged inside the cavity housing. The housing includes a first opening, via which the cavity is connected to the surroundings and in which a first grating is arranged, which is capable by setting it to a first electrical potential of attracting particles from the surroundings and/or electrically charging them. The MEMS chip includes a membrane facing toward the first opening, which is capable by setting it to a second electrical potential of attracting particles. The application furthermore relates to a method for operating a semiconductor device having a cavity housing and a MEMS chip arranged inside the cavity housing.

Abstract: A radiation source device includes at least one membrane layer, a radiation source structure to emit electromagnetic or infrared radiation, a substrate and a spacer structure, wherein the substrate and the at least one membrane form a chamber, wherein a pressure in the chamber is lower than or equal to a pressure outside of the chamber, and wherein the radiation source structure is arranged between the at least one membrane layer and the substrate.

Abstract: One example implementation of a mirror system comprises a carrier, and a first chip package arranged on a surface of the carrier and comprising a first MEMS mirror. Furthermore, the mirror system comprises a second chip package arranged on the surface of the carrier and comprising a second MEMS mirror. The mirror system furthermore comprises a reflective element arranged over the surface of the carrier and above the first chip package and the second chip package in such a way that a radiation that is incident in the mirror system and is reflected by the first MEMS mirror in the direction of the reflective element is reflected by the reflective element in the direction of the second MEMS mirror.

Abstract: A microelectromechanical system (MEMS) package assembly and a method of manufacturing the same are provided for Light Detection and Ranging (LIDAR) systems. A MEMS package assembly includes a MEMS chip including a front-side surface and a back-side surface, the MEMS chip further including a LIDAR MEMS mirror configured to receive light and reflect the light as reflected light; and a cavity cap disposed on the front-side surface of the MEMS chip and forms a cavity that surrounds the LIDAR MEMS mirror such that the LIDAR MEMS mirror is sealed from an environment, the cavity cap having an asymmetrical shape such that a transmission surface of the cavity cap, through which the light and the reflected light is transmitted, is tilted at a tilt angle with respect to the front-side surface of the MEMS chip.

Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.

Abstract: A microelectromechanical system (MEMS) package assembly and a method of manufacturing the same are provided for Light Detection and Ranging (LIDAR) systems. A MEMS package assembly includes a MEMS chip including a front-side surface and a back-side surface, the MEMS chip further including a LIDAR MEMS mirror configured to receive light and reflect the light as reflected light; and a cavity cap disposed on the front-side surface of the MEMS chip and forms a cavity that surrounds the LIDAR MEMS mirror such that the LIDAR MEMS mirror is sealed from an environment, the cavity cap having an asymmetrical shape such that a transmission surface of the cavity cap, through which the light and the reflected light is transmitted, is tilted at a tilt angle with respect to the front-side surface of the MEMS chip.

Abstract: A microelectromechanical systems (MEMS) package assembly and a method of manufacturing the same is provided. The MEMS package assembly includes a substrate, a housing coupled to the substrate to form a cavity, wherein the housing includes a transparent plate disposed above and parallel to the substrate and is configured to permit a transmission of light therethrough, and a MEMS chip disposed within the cavity and including a first main surface proximal to the transparent plate and a second main surface opposite to the first main surface and coupled to the substrate. The MEMS chip is oriented such that the first main surface is tilted at a tilt angle with respect to the transparent plate.

Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract: A sensor structure is disclosed. The sensor structure may include a lead frame for supporting a MEMS sensor, a recess in a surface of the lead frame, and a MEMS sensor coupled to the surface of the lead frame and arranged over the recess to form a chamber. Alternatively, the lead frame may have a perforation formed through it and the MEMS sensor may be coupled to the surface of the lead frame and arranged over an opening of the perforation.

Abstract: A connector module (31, 71) has a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72) to be positioned into a depression (36) in the base body, a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73). The base body (21) and the molded part (33) form two jaws for gripping the fiber (73).

Abstract: An optoelectronic surface-mounted device is provided comprising a premolded casing having a first cavity and a second cavity and a leadframe to which a first electrooptical element and a second electrooptical element are mounted. The leadframe is embedded in the premolded casing. The first cavity is adapted for providing a first electromagnetic radiation path between a first waveguide and the first electrooptical element, wherein the second cavity is adapted for providing a second electromagnetic radiation path between a second waveguide and the second electrooptical element. The first cavity and the second cavity are formed in the premolded casing to decouple electromagnetic radiation propagating along the first electromagnetic radiation path from electromagnetic radiation propagating along the second electromagnetic radiation path.

Abstract: An optoelectronic surface-mounted device is provided comprising a premolded casing having a first cavity and a second cavity and a leadframe to which a first electrooptical element and a second electrooptical element are mounted. The leadframe is embedded in the premolded casing. The first cavity is adapted for providing a first electromagnetic radiation path between a first waveguide and the first electrooptical element, wherein the second cavity is adapted for providing a second electromagnetic radiation path between a second waveguide and the second electrooptical element. The first cavity and the second cavity are formed in the premolded casing to decouple electromagnetic radiation propagating along the first electromagnetic radiation path from electromagnetic radiation propagating along the second electromagnetic radiation path.

Abstract: An MID module with a plug-type connector for an optical fibre with an upper face, edge faces and a lower face, comprising an accommodating channel surrounded by walls for the accommodation of an optical fibre. Here the diameter of the accommodation channel essentially corresponds to that of the optical fibre. The MID module further comprises a semiconductor chip, which is arranged on a front face of the accommodating channel. The semiconductor chip comprises an optically active region, which is optically accessible from the accommodation channel. A slot is provided in the walls of the MID module for the accommodation of a locking element. A locking element, introducible into the slot, locks the fibre in the accommodating channel.

Abstract: An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.

Abstract: A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

Abstract: Connector module and method of manufacturing same A connector module (31, 71) comprises a base body (21) having a first contact (27) for electrically contacting an optoelectronic module (72), a second contact (25) for electronically contacting a board, and a conductive trace (23) for electrically connecting the first (27) and second (25) contacts on a surface of the base body (21), and a molded part (33), the molded part (33) being cast onto the base body (21) across a first part of the surface, and the base body (21) and/or the molded part (33) defining a through-opening (13, 19, 37) for introducing a fiber (73).

Abstract: An MID module with a plug-type connector for an optical fibre with an upper face, edge faces and a lower face, comprising an accommodating channel surrounded by walls for the accommodation of an optical fibre. Here the diameter of the accommodation channel essentially corresponds to that of the optical fibre. The MID module further comprises a semiconductor chip, which is arranged on a front face of the accommodating channel. The semiconductor chip comprises an optically active region, which is optically accessible from the accommodation channel. A slot is provided in the walls of the MID module for the accommodation of a locking element. A locking element, introducible into the slot, locks the fibre in the accommodating channel.