Patents by Inventor D. Michael Flint, Jr.

D. Michael Flint, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mountable direct chip attach device and method including integral integrated circuit
    Patent number: 7713785
    Abstract: A surface mountable chip comprises a semiconductor substrate having IC devices formed thereon and also vertically exposed electrical contacts formed as part of the IC fabrication substrate. Metallization lines electrically connect the IC devices with the contacts. The inventor also contemplates wafers having electrical connection vias in place on the wafers in preparation as a product for further fabrication. A method embodiment of the invention describes methods of fabricating such surface mountable chips.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: May 11, 2010
    Assignee: National Semiconductor Corporation
    Inventor: D. Michael Flint, Jr.
  • Surface mountable direct chip attach device and method including integral integrated circuit
    Patent number: 7511379
    Abstract: A surface mountable chip comprises a semiconductor substrate having IC devices formed thereon and also vertically exposed electrical contacts formed as part of the IC fabrication substrate. Metallization lines electrically connect the IC devices with the contacts. The inventor also contemplates wafers having electrical connection vias in place on the wafers in preparation as a product for further fabrication. A method embodiment of the invention describes methods of fabricating such surface mountable chips.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: March 31, 2009
    Assignee: National Semiconductor Corporation
    Inventor: D. Michael Flint, Jr.