Patents by Inventor Da Wan KIM

Da Wan KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230233126
    Abstract: Disclosed are a skin-attachable adhesive patch mimicking a leg structure of a diving beetle and having excellent skin-attachment ability even in a dry or wet condition, and a method for manufacturing the same. The skin-attachable adhesive patch includes a substrate; a plurality of negative pressure chambers formed on a surface of the substrate, wherein each of the plurality of negative pressure chambers has a truncated hollow sphere structure; a micro-wrinkle layer formed on at least a portion of a remaining area of the substrate except for an area thereof where the negative pressure chambers are formed; and a patterned carbon particle layer formed on the micro-wrinkle layer.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 27, 2023
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Changhyun PANG, Hyeongho MIN, Jinhyung KIM, Da Wan KIM
  • Patent number: 11530909
    Abstract: The present invention relates to a fiber composite for a strain sensor and a method for producing the same. The composite includes a stretchable fiber; a conductive elastic polymer layer coated on the stretchable fiber; polymer beads disposed on the stretchable fiber or on the elastic polymer layer; and a conductive elastic polymer layer covering the polymer beads. The fiber composite is durable and stable. Therefore, a strain sensor produced using the fiber composite exhibits excellent durability, recoverability, repeatability and sensitivity, and a fast sensing speed.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: December 20, 2022
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Chang Hyun Pang, Gi Ra Yi, Ji Sun Kim, Da Wan Kim, Si Yeon Jang
  • Patent number: 11504036
    Abstract: Disclose is a dry adhesive patch comprising: a plurality of embossed pillars formed on a substrate; a hemi-spherical adsorbing cup defining a top portion of each pillar, wherein a hemi-spherical hole is defined in a top portion of the adsorbing cup and is exposed to an outside; and an annular extension extending radially from an outer perimeter of a distal end of each adsorbing cup.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: November 22, 2022
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Chang Hyun Pang, Sang Yul Baik, Da Wan Kim, Ji Hyun Lee
  • Patent number: 11058609
    Abstract: The present invention relates to an adhesive patch. The adhesive patch includes a plurality of reliefs, each relief having a flat top face, and each micro channel groove defined between adjacent reliefs of the plurality of reliefs, wherein the plurality of reliefs and the micro channel groove are respectively formed on and defined the adhesive patch, and wherein a hydrogel layer is disposed on at least a portion of a bottom face of the micro channel groove and is contained in the groove. Therefore, the adhesive patch is well-adhered to a dry or wet adhered face.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: July 13, 2021
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Chang Hyun Pang, Da Wan Kim, Sang Yul Baik
  • Publication number: 20200261001
    Abstract: Disclose is a dry adhesive patch comprising: a plurality of embossed pillars formed on a substrate; a hemi-spherical adsorbing cup defining a top portion of each pillar, wherein a hemi-spherical hole is defined in a top portion of the adsorbing cup and is exposed to an outside; and an annular extension extending radially from an outer perimeter of a distal end of each adsorbing cup.
    Type: Application
    Filed: February 6, 2020
    Publication date: August 20, 2020
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: Chang Hyun PANG, Sang Yul BAIK, Da Wan KIM, Ji Hyun LEE
  • Publication number: 20200163844
    Abstract: The present invention relates to an adhesive patch. The adhesive patch includes a plurality of reliefs, each relief having a flat top face, and each micro channel groove defined between adjacent reliefs of the plurality of reliefs, wherein the plurality of reliefs and the micro channel groove are respectively formed on and defined the adhesive patch, and wherein a hydrogel layer is disposed on at least a portion of a bottom face of the micro channel groove and is contained in the groove. Therefore, the adhesive patch is well-adhered to a dry or wet adhered face.
    Type: Application
    Filed: October 25, 2019
    Publication date: May 28, 2020
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: Chang Hyun PANG, Da Wan KIM, Sang Yul BAIK
  • Publication number: 20200072596
    Abstract: The present invention relates to a fiber composite for a strain sensor and a method for producing the same. The composite includes a stretchable fiber; a conductive elastic polymer layer coated on the stretchable fiber; polymer beads disposed on the stretchable fiber or on the elastic polymer layer; and a conductive elastic polymer layer covering the polymer beads. The fiber composite is durable and stable. Therefore, a strain sensor produced using the fiber composite exhibits excellent durability, recoverability, repeatability and sensitivity, and a fast sensing speed.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: Research & Business Foundation Sungkyunkwan University
    Inventors: Chang Hyun PANG, Gi Ra YI, Ji Sun KIM, Da Wan KIM, Si Yeon JANG