Patents by Inventor Dae-Geun Choi

Dae-Geun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating patterned polymer film with nanometer scale
    Patent number: 7081269
    Abstract: A method of fabricating a patterned polymer film with nanometer scale includes filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a desired polymer film; allowing the embossed stamp placed on the polymer film to stand at temperatures higher than a glass transfer temperature of the polymer film for a predetermined time; and releasing the embossed stamp from the polymer film. Alternatively, the patterned polymer film is obtained by filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a coating layer of a polymer precursor formed on a substrate; curing the coating layer; and releasing the embossed stamp from the cured coating layer.
    Type: Grant
    Filed: January 22, 2004
    Date of Patent: July 25, 2006
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Seung-Man Yang, Se Gyu Jang, Dae-Geun Choi
  • Method of fabricating patterned polymer film with nanometer scale
    Publication number: 20040265490
    Abstract: A method of fabricating a patterned polymer film with nanometer scale includes filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a desired polymer film; allowing the embossed stamp placed on the polymer film to stand at temperatures higher than a glass transfer temperature of the polymer film for a predetermined time; and releasing the embossed stamp from the polymer film. Alternatively, the patterned polymer film is obtained by filling particles each having a predetermined size in a pattern provided to a soft polymer mold to prepare an embossed stamp; placing the embossed stamp on a coating layer of a polymer precursor formed on a substrate; curing the coating layer; and releasing the embossed stamp from the cured coating layer.
    Type: Application
    Filed: January 22, 2004
    Publication date: December 30, 2004
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Seung-Man Yang, Se Gyu Jang, Dae-Geun Choi