Abstract: A display device includes pixels; a sensing block generating first sensing data during a first sensing period, and generating second sensing data and third sensing data during a second sensing period; and a timing controller compensating first image data with second image data based on the first sensing data, the second sensing data, and the third sensing data. The sensing block generates the first sensing data corresponding to an initial channel voltage applied to each of sensing channels and at least one auxiliary sensing channel during the first sensing period, generates the second sensing data by sensing characteristic information of the pixels corresponding to an initialization voltage applied to the pixels during the second sensing period, and generates the third sensing data corresponding to a reference voltage applied to the at least one auxiliary sensing channel during the second sensing period.

Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.

Abstract: A torque vectoring device for a vehicle is disclosed. The torque vectoring device includes: a differential; a first planetary gear set connected, at a first rotating element thereof, to a differential case of the differential; a second planetary gear set connected, at a first rotating element thereof, to a selected drive shaft that is one of two drive shafts coupled to the differential; a motor connected to a second rotating element of the first planetary gear set; and a selective fixing mechanism configured to selectively fix a second rotating element or a third rotating element of the second planetary gear set.

Abstract: A torque vectoring device for a vehicle includes: a differential; a first planetary gear device including a first rotating element fixed to a transmission case and a second rotating element connected to a differential case of the differential; a second planetary gear device including a first rotating element connected to a motor, and a third rotating element connected to a third rotating element of the first planetary gear device; and a selective connector configured such that a second rotating element of the second planetary gear device can be selectively connected to one of the third rotating element of the second planetary gear device and a selected drive shaft which is one of two drive shafts coupled to the differential.

Abstract: Provided are a device and method for estimating a pose of an object. The method includes inputting a labeled source image and an unlabeled target image to a recognition model for generating training data, training the recognition model to generate object information of the unlabeled target image, determining the generated object information to be a pseudo label of the unlabeled target image, and training a pose estimation model for estimating a pose of an object by inputting the pseudo-labeled target image and the labeled source image to the pose estimation model.

Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.

Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.

Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.

Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.

Abstract: A lamp module includes a light source unit that generates light, an optical unit that forms a predetermined beam pattern by transmitting the light generated by the light source unit therethrough, and a reflection unit that reflects the light generated by the light source unit to be incident upon the optical unit. In particular, the light source unit includes a light source chip, which is spaced apart laterally from an optical axis of the optical unit, and the light source chip is disposed to allow a central line that passes through middle of both sides of a light-emitting surface formed by at least one light source to be tilted with respect to the optical axis of the optical unit by an angle that is different from an angle that a central axis of the reflection unit forms with respect to the optical axis of the optical unit.

Abstract: A lamp module includes a light source unit that generates light, an optical unit that forms a predetermined beam pattern by transmitting the light generated by the light source unit therethrough, and a reflection unit that reflects the light generated by the light source unit to be incident upon the optical unit. In particular, the light source unit includes a light source chip, which is spaced apart laterally from an optical axis of the optical unit, and the light source chip is disposed to allow a central line that passes through middle of both sides of a light-emitting surface formed by at least one light source to be tilted with respect to the optical axis of the optical unit by an angle that is different from an angle that a central axis of the reflection unit forms with respect to the optical axis of the optical unit.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: A semiconductor device includes a first semiconductor die, a first encapsulant surrounding the first semiconductor die, and a first redistribution structure formed on the first semiconductor die and the first encapsulant. The semiconductor device further includes a second semiconductor die, a second encapsulant surrounding the second semiconductor die, and a second redistribution structure formed on the second semiconductor die and the second encapsulant. The semiconductor device also include a conductive via electrically connecting the first redistribution structure to the second redistribution structure.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.

Abstract: Various aspects of this disclosure provide a method of manufacturing an electronic device and an electronic device manufactured thereby. As a non-limiting example, various aspects of this disclosure provide a method of manufacturing an electronic device, and an electronic device manufactured thereby, that utilizes ink to form an intermetallic bond between respective conductive interconnection structures of a semiconductor die and a substrate.