Abstract: A light emitting display device according to an embodiment includes a driving element layer disposed on a substrate, a light emitting element layer disposed on the driving element layer, and an external light decreasing layer disposed on the light emitting element layer. The light emitting element layer includes an anode, a pixel defining film having a first opening exposing at least a portion of the anode, a light emitting layer disposed on the anode in the first opening of the pixel defining film, and a cathode disposed on the light emitting layer and the pixel defining film. The external light decreasing layer includes an inorganic material having an absorption coefficient of greater than or equal to about 1.5, and includes a reflection control layer having a second opening corresponding to the first opening of the pixel defining film.

Abstract: Vehicle control apparatus and vehicle control method are described. The vehicle control apparatus may include a compressor and a controller. The controller may determine a thermal load level at one or more of: a first time point at which an engine is switched to an ON state from an OFF state, a second time point at which a first discharge amount of the battery exceeds a first reference value while the engine is in the OFF state, or a third time point at which a second discharge amount of the battery exceeds a second reference value smaller than the first reference value and a discharge rate associated with the battery exceeds a third reference value while the engine is in the OFF state. The controller may control the compressor using a control value corresponding to the thermal load level.

Abstract: A duty cycle correction circuit includes a duty correction circuit, an information generation circuit and a duty control circuit. The duty correction circuit corrects a duty rate of an input clock signal based on a duty control code to generate an output clock signal. The information generation circuit compares a difference between operation power voltages based on an operation mode to generate voltage information. The duty control circuit receives the voltage information from the information generation circuit and generates the duty control code that includes the voltage information based on a duty rate of the output clock signal.

Abstract: An apparatus and method for manufacturing a grilled seaweed includes the apparatus comprising a grilling unit having a first housing with a first inlet opening and a first outlet opening which communicate with each other; a first conveyor for transferring a sheet of seaweed from the first inlet opening to the first outlet opening; a first heating source installed over the first conveyor to discharge a flame onto a top surface of the seaweed being transferred by the first conveyor; and a second heating source installed on both sides of a lower portion of the first conveyor to apply a flame onto a bottom surface of the seaweed being transferred by the first conveyor.

Abstract: A display panel includes a first substrate including a display area, in which a plurality of pixel areas is arranged, and a non-display area around the display area, a second substrate disposed opposite to the first substrate, a light emitting array disposed on the first substrate and including a plurality of light emitting elements corresponding to the plurality of pixel areas, a sealing layer disposed in the non-display area between the first substrate and the second substrate and bonding the first substrate and the second substrate to each other, a vacuum layer sealed by the sealing layer and defined between the light emitting array and the second substrate, and a reflection adjustment layer disposed on the second substrate and absorbing a portion of external light, where the reflection adjustment layer includes a plurality of protrusions protruding toward the light emitting array and exposed to the vacuum layer.

Abstract: A probe card includes a ceramic substrate; an electrode connection part connecting an electrode pad and a via pad which are provided on one surface of the ceramic substrate; a bonding pad provided on an upper surface of the electrode pad and disposed inwardly of an edge of the electrode pad; and a probe bonded to an upper surface of the bonding pad by a solder layer between the bonding pad and the probe. The bonding pad includes a lead part protruding from a side surface of the bonding pad. As a result, overflowed solder at the time of attaching the probe onto the upper surface of the bonding pad may be dispersed to the lead part.

Abstract: A probe card includes a ceramic substrate; an electrode connection part connecting an electrode pad and a via pad which are provided on one surface of the ceramic substrate; a bonding pad provided on an upper surface of the electrode pad and disposed inwardly of an edge of the electrode pad; and a probe bonded to an upper surface of the bonding pad by a solder layer between the bonding pad and the probe. The bonding pad includes a lead part protruding from a side surface of the bonding pad. As a result, overflowed solder at the time of attaching the probe onto the upper surface of the bonding pad may be dispersed to the lead part.

Abstract: A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted.

Abstract: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

Abstract: A capacitor embedded substrate and a manufacturing method thereof are disclosed. The capacitor embedded substrate in accordance with an embodiment of the present invention includes: a ceramic layer having a first circuit included therein; a receiving grooved formed on one surface of the ceramic layer; a capacitor being inserted in the receiving groove; a polymer layer being laminated on the ceramic layer in such a way that the capacitor is embedded in the receiving groove and comprising a second circuit electrically connected with the first circuit; and a via electrode being connected with the capacitor by penetrating the polymer layer.

Abstract: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

Abstract: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.

Abstract: There is provided a probe card, including: a substrate having a plurality of grooves formed in one surface thereof; and at least one probe pin having a plurality of substrate combining protrusions formed on one surface thereof and corresponding to the plurality of grooves, the plurality of substrate combining protrusions having heights corresponding to the plurality of grooves.

Abstract: There are provided a probe card and a method of manufacturing the same, in which an electrode pad having a probe pin bonded thereto may be prevented from being delaminated from a substrate. The probe card according to embodiments of the present invention may include a ceramic substrate including at least one pad groove formed in one surface thereof and an electrode pad embedded in the pad groove; and a probe pin bonded to the electrode pad.

Abstract: There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin.

Abstract: Disclosed herein are a multilayer ceramic substrate and a method for manufacturing the same. In a method for manufacturing the multilayer ceramic substrate, which has a ceramic laminate including multiple ceramic layers and allowing interconnection between layers through vias respectively formed in the multiple ceramic layers, the method includes: preparing a ceramic laminate in which a void is formed around a via in at least one ceramic layer of multiple ceramic layers; immersing the ceramic laminate in a precipitating bath in which an electrode solution is contained; putting the ceramic laminate out of the precipitating bath after a predetermined period of time, and then removing a nanoparticle film stacked on a surface of a multilayer ceramic substrate; and applying heat to the multilayer ceramic substrate to form nanoparticles filling an inside of the void, after the removing of the nanoparticle film.

Abstract: There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. The adhesive portions are selectively formed, thereby preventing short circuits occurring between the resistor mounted onto the circuit board and the heat dissipation member. Accordingly, the reliability of components can be increased. Furthermore, an adhesive material used to connect the board and the heat dissipation member is formed of a thermally conductive material, thereby increasing heat dissipation efficiency.

Abstract: A method for manufacturing a ceramic elements module. The method includes providing a ceramic elements that has a plurality of lower inserting grooves; mounting an electronic component on a lower surface of the ceramic elements; providing a heat sink that has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted to a lower part of the ceramic elements; coupling the ceramic elements with the heat sink; engaging a fixing member with the lower inserting groove of the ceramic elements by passing through the first penetrating hole of the heat sink; and removing the fixing member.

Abstract: Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.

Abstract: There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.