Abstract: A semiconductor device may include: a first conductive line extending in a first direction; a second conductive line disposed over the first conductive line to be spaced apart from the first conductive line and extending in a second direction different from the first direction; and a selector layer disposed between the first conductive line and the second conductive line and extending in a direction crossing at least one of the first direction or the second direction, wherein the selector layer includes a trench formed on a surface of the selector layer and extending in the direction crossing at least one of the first direction or the second direction.

Abstract: Heat treatment equipment and a method of driving the same are provided. The heat treatment equipment includes: a process tube having an aperture at one side thereof; a sealing unit for opening or closing the aperture; and a pressure sensor for measuring sealing pressure between the sealing unit and the one side of the process tube. In the heat treatment equipment, the aperture of the process tube can be sealed according to the sealing pressure of the sealing unit so that the process tube can be precisely sealed.

Abstract: Heat treatment equipment and a method of driving the same are provided. The heat treatment equipment includes: a process tube having an aperture at one side thereof; a sealing unit for opening or closing the aperture; and a pressure sensor for measuring sealing pressure between the sealing unit and the one side of the process tube. In the heat treatment equipment, the aperture of the process tube can be sealed according to the sealing pressure of the sealing unit so that the process tube can be precisely sealed.

Abstract: In a substrate processing apparatus used for manufacturing a semiconductor substrate, and a method using the same, the apparatus includes a substrate processing apparatus used for manufacturing a semiconductor substrate includes, a reaction chamber in which a thermal processing process is performed, a heater chamber for providing heat required for the process to the reaction chamber, the heater chamber surrounding the reaction chamber, a housing defining a space in which the reaction chamber and the heater chamber are provided, a heat venting unit for venting heat in the housing, and a controller for controlling the heat venting unit to maintain a temperature of an interior of the reaction chamber within a predetermined range of a process temperature by regulating an amount of thermal atmosphere exhausted through the heat venting unit.