Patents by Inventor Dae-suk LEE
Dae-suk LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240194403Abstract: A protective layer including glass may be disposed between an end of a first electrode layer in contact with one end of an internal electrode and a body thereby blocking a penetration path of external moisture, a plating solution, and hydrogen to improve the moisture resistance reliability of a multilayer electronic component.Type: ApplicationFiled: November 1, 2023Publication date: June 13, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Bum Suk Kang, Dae Woo Yoon, Da Mi Kim, Su Jin Lee
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Patent number: 12000754Abstract: The present invention provides a load generating unit for testing an actuator, the unit including a first permanent magnet and a second permanent magnet spaced apart from each other; a third permanent magnet or a ferromagnetic body arranged in a row with the first permanent magnet and the second permanent magnet between the first permanent magnet and the second permanent magnet; and a first link passing through central axes of the first permanent magnet and the second permanent magnet to be penetrated to a central axis of the third permanent magnet and be connected to the actuator, wherein the third permanent magnet and the link are displaced in a length direction of the first link by a magnetic force. According to the present invention, the complexity, cost, and inertia of a device may be overcome and a load profile may be easily generated.Type: GrantFiled: March 29, 2022Date of Patent: June 4, 2024Assignee: AGENCY FOR DEFENSE DEVELOPMENTInventors: Seung-Chul Han, Ji-Suk Kim, Ha-Jun Lee, Dae-Gyeom Kang
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Patent number: 11990279Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.Type: GrantFiled: March 23, 2022Date of Patent: May 21, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Woo Yoon, Su Jin Lee, Da Mi Kim, Bum Suk Kang, Seong Han Park, Jeong Ryeol Kim
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Publication number: 20240161976Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.Type: ApplicationFiled: March 14, 2023Publication date: May 16, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Woo YOON, Bum Suk KANG, Da Mi KIM, Su Jin LEE
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Patent number: 11982291Abstract: A blower unit for a vehicle and an air conditioning device including the same, the blower unit including: a scroll casing having an inlet port; a fan rotatably disposed in the scroll casing; a motor having a shaft coupled to the fan; and a bell mouth disposed in the inlet port, in which an inner end of the scroll casing, which defines the inlet port, is disposed to be spaced apart from the fan in a radial direction to define a separation space, and the bell mouth prevents air, which flows by a rotation of the fan, from flowing reversely through the separation space. The blower unit and the air conditioning device including the same prevent air from flowing reversely to the outside of the scroll casing by means of the arrangement of the bell mouth and the scroll casing and the structural shape of the bell mouth.Type: GrantFiled: August 27, 2020Date of Patent: May 14, 2024Assignee: Hanon SystemsInventors: Dae Keun Park, Dong Gyun Kim, Si Hyung Kim, Eun Suk Bae, Jun Ho Seo, Nam Jun Lee, Ho Lee, Seung Woo Jo
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Publication number: 20240155844Abstract: A semiconductor memory device includes a mold structure including gate electrodes stacked on a first substrate, a channel structure that penetrates a first region of the mold structure to cross the gate electrodes, a first through structure that penetrates a second region of the mold structure, and a second through structure that penetrates a third region of the mold structure. The mold structure further includes memory cell blocks extending in a first direction and spaced apart in a second direction, and a dummy block extending in the first direction and disposed between the memory cell blocks. Each of the memory cell blocks and the dummy block includes a cell region and an extension region arranged in the first direction. The first region is the cell region of one of the memory cell blocks, the second region is the extension region of the one of the memory cell blocks, and the third region is the extension region of the dummy block.Type: ApplicationFiled: January 17, 2024Publication date: May 9, 2024Inventors: Myung Hun Lee, Dong Ha Shin, Pan Suk Kwak, Dae Seok Byeon
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Patent number: 11950425Abstract: A mold structure includes gate electrodes stacked on a first substrate, a channel structure penetrating a first region of the mold structure to cross the gate electrodes, a first through structure penetrating a second region of the mold structure, and a second through structure penetrating a third region of the mold structure. The mold structure includes memory cell blocks extending in a first direction and spaced apart in a second direction, and a dummy block extending in the first direction and disposed between the memory cell blocks. Each of the memory cell and dummy blocks includes a cell region and an extension region arranged in the first direction. The first region is the cell region of one of the memory cell blocks, the second region is the extension region of the one of the memory cell blocks, and the third region is the extension region of the dummy block.Type: GrantFiled: May 6, 2021Date of Patent: April 2, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Myung Hun Lee, Dong Ha Shin, Pan Suk Kwak, Dae Seok Byeon
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Patent number: 11804472Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a substrate having a first via hole, an insulation interlayer formed on the substrate and having a first bonding pad in an outer surface thereof and a second via hole connected to the first via hole and exposing the first bonding pad, and a plug structure formed within the first and second via holes to be connected to the first bonding pad. The second semiconductor chip includes a second bonding pad bonded to the plug structure which is exposed from a surface of the substrate of the first semiconductor chip.Type: GrantFiled: March 2, 2021Date of Patent: October 31, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hak-Seung Lee, Kwang-Jin Moon, Tae-Seong Kim, Dae-Suk Lee, Dong-Chan Lim
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Patent number: 11705386Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.Type: GrantFiled: February 17, 2022Date of Patent: July 18, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Kwang Wuk Park, Sung Dong Cho, Eun Ji Kim, Hak Seung Lee, Dae Suk Lee, Dong Chan Lim, Sang Jun Park
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Publication number: 20220173016Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.Type: ApplicationFiled: February 17, 2022Publication date: June 2, 2022Inventors: Kwang Wuk PARK, Sung Dong CHO, Eun Ji KIM, Hak Seung LEE, Dae Suk LEE, Dong Chan LIM, Sang Jun PARK
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Patent number: 11289402Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.Type: GrantFiled: November 8, 2019Date of Patent: March 29, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Kwang Wuk Park, Sung Dong Cho, Eun Ji Kim, Hak Seung Lee, Dae Suk Lee, Dong Chan Lim, Sang Jun Park
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Patent number: 11069597Abstract: Semiconductor chips and methods of manufacturing the same are provided. The semiconductor chip includes a substrate, an interlayer insulation layer including a bottom interlayer insulation layer on an upper surface of the substrate and a top interlayer insulation layer on the bottom interlayer insulation layer, an etch stop layer between the bottom interlayer insulation layer and the top interlayer insulation layer, a landing pad on the interlayer insulation layer, and a through via connected to the landing pad through the substrate, the interlayer insulation layer, and the etch stop layer. The etch stop layer is isolated from direct contact with the landing pad.Type: GrantFiled: March 27, 2019Date of Patent: July 20, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Dae-suk Lee, Hak-seung Lee, Dong-chan Lim, Tae-seong Kim, Kwang-jin Moon
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Publication number: 20210183822Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a substrate having a first via hole, an insulation interlayer formed on the substrate and having a first bonding pad in an outer surface thereof and a second via hole connected to the first via hole and exposing the first bonding pad, and a plug structure formed within the first and second via holes to be connected to the first bonding pad. The second semiconductor chip includes a second bonding pad bonded to the plug structure which is exposed from a surface of the substrate of the first semiconductor chip.Type: ApplicationFiled: March 2, 2021Publication date: June 17, 2021Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hak-Seung LEE, Kwang-Jin Moon, Tae-Seong Kim, Dae-Suk Lee, Dong-Chan Lim
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Patent number: 10950578Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a substrate having a first via hole, an insulation interlayer formed on the substrate and having a first bonding pad in an outer surface thereof and a second via hole connected to the first via hole and exposing the first bonding pad, and a plug structure formed within the first and second via holes to be connected to the first bonding pad. The second semiconductor chip includes a second bonding pad bonded to the plug structure which is exposed from a surface of the substrate of the first semiconductor chip.Type: GrantFiled: June 4, 2019Date of Patent: March 16, 2021Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hak-Seung Lee, Kwang-Jin Moon, Tae-Seong Kim, Dae-Suk Lee, Dong-Chan Lim
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Publication number: 20200273780Abstract: A semiconductor device includes a substrate, an interlayer insulating layer on the substrate, a first etch stop layer on the substrate, a first through-silicon-via (TSV) configured to pass vertically through the substrate and the interlayer insulating layer, and a second TSV configured to pass vertically through the substrate, the interlayer insulating layer, and the first etch stop layer, wherein the second TSV has a width greater than that of the first TSV.Type: ApplicationFiled: November 8, 2019Publication date: August 27, 2020Inventors: Kwang Wuk Park, Sung Dong Cho, Eun Ji Kim, Hak Seung Lee, Dae Suk Lee, Dong Chan Lim, Sang Jun Park
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Publication number: 20200161277Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a substrate having a first via hole, an insulation interlayer formed on the substrate and having a first bonding pad in an outer surface thereof and a second via hole connected to the first via hole and exposing the first bonding pad, and a plug structure formed within the first and second via holes to be connected to the first bonding pad. The second semiconductor chip includes a second bonding pad bonded to the plug structure which is exposed from a surface of the substrate of the first semiconductor chip.Type: ApplicationFiled: June 4, 2019Publication date: May 21, 2020Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hak-Seung LEE, Kwang-Jin Moon, Tae-Seong Kim, Dae-Suk Lee, Dong-Chan Lim
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Publication number: 20200075458Abstract: Semiconductor chips and methods of manufacturing the same are provided. The semiconductor chip includes a substrate, an interlayer insulation layer including a bottom interlayer insulation layer on an upper surface of the substrate and a top interlayer insulation layer on the bottom interlayer insulation layer, an etch stop layer between the bottom interlayer insulation layer and the top interlayer insulation layer, a landing pad on the interlayer insulation layer, and a through via connected to the landing pad through the substrate, the interlayer insulation layer, and the etch stop layer. The etch stop layer is isolated from direct contact with the landing pad.Type: ApplicationFiled: March 27, 2019Publication date: March 5, 2020Applicant: Samsung Electronics Co., LtdInventors: Dae-suk LEE, Hak-seung Lee, Dong-chan Lim, Tae-seong Kim, Kwang-jin Moon