Abstract: A semiconductor package may include a first semiconductor chip, a second semiconductor chip, and a thermal redistribution pattern which are disposed on a package substrate. The thermal redistribution pattern may include a first end portion disposed in a high temperature region adjacent to the first semiconductor chip, a second end portion disposed in a low temperature region adjacent to the second semiconductor chip, and an extension portion connecting the first end portion to the second end portion.

Abstract: The present invention relates to a device for fixing a pipe and an electric wire that fastenedly blocks a fastening hole formed on a vehicle roof by means of a first connection member adapted to pass the pipe therethrough and a second connection member adapted to pass the electric wire therethrough, thus reducing the number of fastening holes formed on the vehicle roof and achieving easy assembling. According to the present invention, the device includes: a first connection member having a first through hole adapted to pass the pipe therethrough and a hollow portion formed on a given region thereof; and a second connection member having a second through hole adapted to pass the electric wire therethrough, wherein the second connection member has the corresponding shape to the hollow portion in such a manner as to be integrally formed with the first connection member, so that the first connection member and the second connection member block a fastening hole formed on a given region of a vehicle.

Abstract: The present specification provides an organoluminescent device including a capping layer on one surface of an electrode.

Abstract: The present invention relates to a device for fixing a pipe and an electric wire that fastenedly blocks a fastening hole formed on a vehicle roof by means of a first connection member adapted to pass the pipe therethrough and a second connection member adapted to pass the electric wire therethrough, thus reducing the number of fastening holes formed on the vehicle roof and achieving easy assembling. According to the present invention, the device includes: a first connection member having a first through hole adapted to pass the pipe therethrough and a hollow portion formed on a given region thereof; and a second connection member having a second through hole adapted to pass the electric wire therethrough, wherein the second connection member has the corresponding shape to the hollow portion in such a manner as to be integrally formed with the first connection member, so that the first connection member and the second connection member block a fastening hole formed on a given region of a vehicle.

Abstract: The present invention provides a novel compound that is capable of largely improving a life time, efficiency, electrochemical stability, and thermal stability of an organic electronic device, and an organic electronic device that comprises an organic material layer comprising the compound.

Abstract: An air conditioning system for motor vehicles includes an air conditioner case having an external air introduction port and an internal air introduction port, an intake door rotatably installed in the air conditioner case so as to open the external air introduction port in an external air mode and open the internal air introduction port in an internal air mode, a blower configured to draw an internal air or an external air through the external air introduction port or the internal air introduction port and to blow the internal air or the external air into a vehicle room, and a control unit configured to control the intake door to move in such a direction as to close the external air introduction port and to restrain entry of rainwater into the external air introduction port, if a rotation speed level of the blower satisfies a predetermined condition in the external air mode.

Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.

Abstract: The present invention relates to a polarizing plate including a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin, an amine-based metal compound, and a pH adjuster, and the pH adjuster includes epoxy (meth)acrylate, alcohol, and acid, and a method for manufacturing the same.

Abstract: The present invention relates to a polarizing plate including a polyethylene terephthalate film and having an excellent optical property, and a method for manufacturing the same, and the polarizing plate of the present invention includes: a water-based adhesive layer, a primer layer, and a polyethylene terephthalate protection film sequentially provided on at least one surface of a polarizer, in which the water-based adhesive layer is formed by using a water-based adhesive including a polyvinyl alcohol-based resin and a glyoxalate crosslinking agent at a weight ratio of 100:5 to 100:50, and the primer layer is formed by using a primer composition including a polyester-based compound and an acryl-based compound.

Abstract: A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.

Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.

Abstract: An air conditioning system for motor vehicles includes a front seat air conditioner installed in a front seat region of a vehicle room, and an auxiliary blower configured to draw an air existing in the vehicle room and blow the air into the vehicle room such that a cold air or a hot air supplied to the front seat region flows toward a rear seat region. The system further includes a rear seat air conditioner installed within one of vehicle sidewalls which define the rear seat region. The rear seat air conditioner configured to supply a cold air or a hot air to cool or heat the rear seat region. The system further includes a control unit for controlling the auxiliary blower.

Abstract: The present disclosure relates to a polarizing plate including an adhesive layer, a primer layer and a polyethylene terephthalate film which are sequentially formed on at least one side of a polarizer, wherein the adhesive layer in the present disclosure is formed by an active energy ray-curable adhesive including a first epoxy compound of which a homopolymer has a glass transition temperature of 120° C. or higher, a second epoxy compound of which a homopolymer has a glass transition temperature of 60° C. or lower, and a cationic photopolymerization initiator, and wherein the primer layer is formed by a primer composition including one or more binder resins selected from the group consisting of polyester and polyvinyl alcohol-based resins, and one or more cross-linking agents selected from the group consisting of acrylic cross-linking agents, epoxy-based cross-linking agents and polyvinyl alcohol-based cross-linking agents.

Abstract: The present invention provides a novel compound that is capable of largely improving a life time, efficiency, electrochemical stability, and thermal stability of an organic electronic device, and an organic electronic device that comprises an organic material layer comprising the compound.

Abstract: The present invention provides a novel compound that is capable of largely improving a life time, efficiency, electrochemical stability, and thermal stability of an organic electronic device, and an organic electronic device that comprises an organic material layer comprising the compound.

Abstract: The present invention provides a novel compound that is capable of largely improving a life time, efficiency, electrochemical stability, and thermal stability of an organic electronic device, and an organic electronic device that comprises an organic material layer comprising the compound.

Abstract: A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.

Abstract: The present invention provides a novel compound that is capable of largely improving a life time, efficiency, electrochemical stability, and thermal stability of an organic electronic device, and an organic electronic device that comprises an organic material layer comprising the compound.

Abstract: A semiconductor device includes a through electrode, a pad, and a bump. The through electrode penetrates a device body of the semiconductor device. The pad is disposed over an end of the through electrode to have a first overlap region and a second overlap region that overlap with a central portion and an edge portion of the end of the through electrode, respectively. The bump is disposed over the pad to contact the second overlap region of the pad without contacting the first overlap region of the pad.

Abstract: The present invention relates to a novel anthracene derivative and an organic electronic device using the same. An anthracene derivative that is represented by the following Formula 1: The anthracene derivative can act as a hole injecting, hole transporting, electron injecting and transporting, or light emitting material in an organic light emitting device and an organic electronic device. In particular, the anthracene derivative can act as a light emitting host. The organic electronic device according to the present invention has excellent characteristics in views of efficiency, the driving voltage, and the stability.