Patents by Inventor DAE HUN YOU

DAE HUN YOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11625193
    Abstract: A redundant array of independent disks (RAID) storage device including; a memory device including first memory devices configured to store at least one of data chunks and corresponding parity (data chunks/parity) and a second memory device configured to serve as a spare memory region, and a RAID controller including a RAID internal memory configured to store a count table and configured to control performing of a rebuild operation in response to a command received from a host, wherein upon identification of a failed first memory device, the RAID controller accesses used regions of non-failed first memory devices based on the count table and rebuilds data of the failed first memory device using the second memory device.
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: April 11, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae Hwan Lim, Seung-Woo Lim, Sung-Wook Kim, So-Geum Kim, Jae Eun Kim, Dae Hun You, Walter Jun
  • Publication number: 20220011979
    Abstract: A redundant array of independent disks (RAID) storage device including; a memory device including first memory devices configured to store at least one of data chunks and corresponding parity (data chunks/parity) and a second memory device configured to serve as a spare memory region, and a RAID controller including a RAID internal memory configured to store a count table and configured to control performing of a rebuild operation in response to a command received from a host, wherein upon identification of a failed first memory device, the RAID controller accesses used regions of non-failed first memory devices based on the count table and rebuilds data of the failed first memory device using the second memory device.
    Type: Application
    Filed: June 18, 2021
    Publication date: January 13, 2022
    Inventors: JAE HWAN LIM, SEUNG-WOO LIM, SUNG-WOOK KIM, SO-GEUM KIM, JAE EUN KIM, DAE HUN YOU, WALTER JUN