Abstract: The present disclosure describes a network switch design that includes a vertical switch circuit board that is mounted parallel to the front panel of the network switch. The vertical circuit board supports switch chip(s) to process and forward packets and pluggable module connectors to receive pluggable optics modules that provide connections to other network switches. The pluggable module connectors are horizontally oriented to facilitate routing of electrical signal traces. The arrangement of the circuit board, switch chip(s) and pluggable module connectors achieves reduced lengths for the electrical signal traces that connect the switch chip(s) to the pluggable module connectors. The design improves cooling by providing separate airflow regions between the switch chip heatsink(s) and the optics modules.

Abstract: In one embodiment a device for tightening and loosening a securing device is provided. The device includes a housing, a shaft, and a clutch assembly. In one embodiment, the clutch assembly includes a clutch activation member, a first friction member coupled to the clutch activation member, and a second friction member coupled to the shaft. When the clutch activation member is in a first position, the clutch activation member engages the first friction member with the second friction member for transmission of torque from the first friction member to the second friction member. When the clutch activation member is in the second position, the clutch activation member disengages the first friction member from the second friction member to prevent transmission of the torque from the first friction member to the second friction member.

Abstract: In one embodiment a device for tightening and loosening a securing device is provided. The device includes a housing, a shaft, and a clutch assembly. In one embodiment, the clutch assembly includes a clutch activation member, a first friction member coupled to the clutch activation member, and a second friction member coupled to the shaft. When the clutch activation member is in a first position, the clutch activation member engages the first friction member with the second friction member for transmission of torque from the first friction member to the second friction member. When the clutch activation member is in the second position, the clutch activation member disengages the first friction member from the second friction member to prevent transmission of the torque from the first friction member to the second friction member.

Abstract: In one example, a rotatable top shell is provided for an example optoelectronic device. The rotatable top shell includes a body defining a curved tongue on one end. The tongue is configured to rotate about a complimenting curved mating surface of a bottom shell of the optoelectronic device to allow the body to rotate between an open position and a closed position. The rotatable top shell further includes means for securing the rotatable top shell relative to the bottom shell. The means for securing the rotatable top shell may include one or more of: a plurality of nubs defined along at least one edge of the body, a hole defined in the body for receiving a retention pin of the bottom shell, two sides for being received within a main cavity of the bottom shell, or the like.

Abstract: In one example, a heat management system suitable for use in connection with an electronic module is disclosed. In a disclosed embodiment the heat management system includes a module guide configured to receive an electronic module. At least two heat sink elements are configured and arranged for movement independent of each other. At least two retention elements are configured to bias a respective heat sink element against any electronic module that is positioned within the module guide.

Abstract: In one example, a heat management system suitable for use in connection with an electronic module is disclosed. In a disclosed embodiment the heat management system includes a module guide configured to receive an electronic module. At least two heat sink elements are configured and arranged for movement independent of each other. At least two retention elements are configured to bias a respective heat sink element against any electronic module that is positioned within the module guide.

Abstract: Electromagnetic radiation containment in an electronic module. In one example, an electronic module includes a housing, a printed circuit board, and an electrically conductive sealing element. The printed circuit board is partially positioned within the housing and defines an edge connector extending from the housing. The electrically conductive sealing element radially surrounds 360 degrees of one end of the housing and the printed circuit board proximate the edge connector such that when the edge connector is fully received in a host board connector mounted to a host board, the electrically conductive sealing element cooperates with a corresponding structure of the host board to at least partially define a Faraday cage substantially enclosing the edge connector and the host board connector. The housing defines a radial groove which aids in the retention of the sealing element.

Abstract: Methods of packaging a high density optical module. In one example embodiment, a method of packaging the high density optical module includes various acts. First, a first detachable fiber assembly is connected to an optical component disposed in the module such that the connection between the fiber assembly and the optical component is disposed inside a housing of the optical module. Next, the fiber included in the fiber assembly is spooled around a spooling assembly. Then, the receptacle is secured in a receptacle holder such that the receptacle is able to connect with an external fiber connector. Next, the fiber assembly is detached from the optical component. Finally, the optical component is heated such that a ball grid array connection, that connects the optical component to a high speed printed circuit board, flows such that the optical component can be removed from the high speed printed circuit board.

Abstract: A retention mechanism for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module retention clip includes a base, a pair of arms extending from the base, and a protrusion extending from each arm. Each protrusion is configured to engage a complementary structure defined in a de-latch slide and a complementary structure defined in an optoelectronic module shell so as to prevent motion of the de-latch slide relative to the shell when the optoelectronic module retention clip is attached to the optoelectronic module.

Abstract: An optical module and packaging thereof. A high speed optical module, such as a transceiver or transponder is disclosed. A fiber assembly including a receptacle, a fiber, and a modified connector are provided and enable an optical connection from inside of the optical component to outside of the component. Internally, the fiber assembly is detachable from an internal optical component. the optical component is connected to a PCB using a ball grid array. By detaching the fiber assembly, the optical component can be changed-out without damaging the fiber. The fiber is spooled inside the module to protect the fiber around a spooling assembly that is integrated with the receptacle holders that form part of the module's ports.

Abstract: A retention mechanism for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module retention clip includes a base, a pair of arms extending from the base, and a protrusion extending from each arm. Each protrusion is configured to engage a complementary structure defined in a de-latch slide and a complementary structure defined in an optoelectronic module shell so as to prevent motion of the de-latch slide relative to the shell when the optoelectronic module retention clip is attached to the optoelectronic module.

Abstract: In one example, a rotatable top shell is provided for an example optoelectronic device. The rotatable top shell includes a body defining a curved tongue on one end. The tongue is configured to rotate about a complimenting curved mating surface of a bottom shell of the optoelectronic device to allow the body to rotate between an open position and a closed position. The rotatable top shell further includes means for securing the rotatable top shell relative to the bottom shell. The means for securing the rotatable top shell may include one or more of: a plurality of nubs defined along at least one edge of the body, a hole defined in the body for receiving a retention pin of the bottom shell, two sides for being received within a main cavity of the bottom shell, or the like.

Abstract: In one example, and electromagnetic radiation containment system includes an electrically conductive shroud configured to be mounted to a ground plane of a host board, the electrically conductive shroud defining an opening by way of which an edge connector of an electronic module can be received, the electrically conductive shroud sized and configured to substantially enclose a host board connector mounted to the host board. The electromagnetic radiation containment system further includes, in this example, an electrically conductive sealing element configured to be disposed about a portion of the electronic module such that when the edge connector of the electronic module is fully received in the host board connector, the electrically conductive sealing element cooperating with the electrically conductive shroud to at least partially define a Faraday cage substantially enclosing the edge connector and the host board connector.

Abstract: A classification clip for an electronic or optoelectronic module. In one example embodiment, an optoelectronic module classification clip includes a body, a complementary structure attached to the body and configured to engage a complementary structure of a shell of an optoelectronic module, and a visible indicator included on at least a portion of the body or the complementary structure. The visible indicator indicates information concerning a characteristic of the optoelectronic module.