Abstract: A voltage converter, including a switch circuit configured to generate an output voltage by switching an input voltage and a ground voltage based on a driving control signal; an error voltage generator configured to generate an error voltage based on a comparison between the output voltage and a reference voltage; a duty signal generator configured to generate a duty signal having a constant pulse frequency or a modulated pulse frequency, based on a result of the comparing; and a driving controller configured to generate the driving control signal based on the duty signal.

Abstract: A circuit includes: an overcurrent limiting (OCL) detector configured to detect whether a level of an inductor current reaches an OCL level and to generate an OCL detection voltage; a control loop circuit configured to generate a reset voltage by comparing a ramp voltage reflecting the level of the inductor current with an error voltage generated based on an operating condition that is out of a preset operating condition; an adaptive OCL controller configured to generate an OCL control current by counting a number of pulses of the OCL detection voltage and a number of pulses of the reset voltage; an oscillator configured to generate an oscillation voltage wherein a frequency of the oscillation voltage varies based on a magnitude of the overcurrent limit control current; and a switching transistor for switching the inductor current based on the oscillation voltage.

Abstract: There is provided a method of manufacturing a semiconductor package, a first redistribution wiring layer including a chip mounting region and a peripheral region surrounding the chip mounting region is formed, and the first redistribution wiring layer has first redistribution wires stacked in at least two layers. A first semiconductor device is mounted on the chip mounting region on the first redistribution wiring layer. A sealing member is formed on the first redistribution wiring layer to cover the first semiconductor device. A plurality of conductive connectors is formed on the peripheral region, and the conductive connectors penetrate the sealing member and are electrically connected to the first redistribution wires. A plurality of through openings extending from an upper surface of the sealing member is formed on the chip mounting region and exposes an upper surface of the first semiconductor device.

Abstract: A wire bonding apparatus includes a bonding stage, a capillary, a clamp provided with the capillary rotatably installed thereon, and a bonding arm. The clamp includes a housing having an internal space, a first member fixedly installed at an upper end of the internal space of the housing and provided with a first gear unit on a lower surface thereof, a second member fixedly installed at a lower end of the internal space of the housing to be spaced apart from the first member, and provided with a second gear unit on an upper surface thereof, a third member, the third member being provided with a third gear unit corresponding to the first gear unit and a fourth gear unit corresponding to the second gear unit, . The capillary is fixedly installed on the third member and rotates in conjunction with the third member.

Abstract: A semiconductor substrate processing apparatus includes a chamber dimensioned to accommodate a plurality of strip magazines, each strip magazine configured to receive a plurality of substrates therein, a plasma generator coupled to the chamber and configured to generate plasma used to remove foreign substances on the substrates in the chamber, and a rotation support mechanism configured to rotate the plurality of strip magazines within the chamber. Each of the strip magazines includes first and second side wall plates, an upper plate and a lower plate, and a plurality of guides on inner sides of the first and second side wall plates to support the substrates. The rotation support mechanism includes: a shaft, a motor configured to rotate the shaft, and a plurality of support frames fixed to side surfaces of the shaft and configured to fixedly support the strip magazines.