Abstract: A semiconductor device includes: a substrate; and a semiconductor element, wherein the substrate includes a base and a conductor pattern arranged on the base, the conductor pattern includes a die pad portion and first and second connection portions, the die pad portion includes first and second ends in a first direction, and third and fourth ends in a second direction, outer periphery of the die pad portion includes first and second sides in the second direction, and third and fourth sides in the first direction, a recess is formed on one of the first and second sides, the first and second connection portions are respectively connected to a first corner of the outer periphery where the second and third sides are joined, and a second corner of the outer periphery where the second and fourth sides are joined.

Abstract: A semiconductor light emitting device includes a board including a first principal surface facing a first side in a thickness direction thereof, a first electrode provided on the board, a semiconductor light emitting element, and a light-transmitting resin that covers the element. The first electrode includes a first bonding portion and first, second, and third portions. The first bonding portion is formed on the first principal surface and is joined and electrically connected to the element. The first and second portions are each formed on the first principal surface and disposed on a first side in a first direction. The first portion is connected to the first bonding portion. The second portion is apart from the first bonding portion, and from the first portion in a second direction. The third portion is formed on a place different from the first principal surface, electrically connecting the first and second portions to each other.

Abstract: Disclosed herein is a semiconductor light emitting device including a semiconductor light emitting element, a Zener diode, and a conductive support component that supports the semiconductor light emitting element and the Zener diode. The semiconductor light emitting element has a first electrode. The semiconductor light emitting device further includes a first wire connected to the Zener diode and the first electrode.

Abstract: Disclosed herein is a semiconductor light emitting device including a semiconductor light emitting element and a conductive support component that supports the semiconductor light emitting element and that includes an electrically-conductive part and an insulating part. The electrically-conductive part includes a first electrically-conductive part and a second electrically-conductive part. The insulating part has an insulating main surface and an insulating back surface. The first electrically-conductive part includes a first main surface part exposed from the insulating main surface. The second electrically-conductive part includes a second back surface part exposed from the insulating back surface. The first main surface part includes a first main surface base part on which the semiconductor light emitting element is mounted and a first main surface extending part extending from the first main surface base part.

Abstract: A semiconductor light emitting device includes a main lead, a sub lead, a semiconductor light emitting element bonded to the main lead, and a protective element bonded to the sub lead, wherein the semiconductor light emitting element is connected to the main lead and the sub lead via a first wire and a second wire, respectively, wherein the protective element has a main surface electrode and a back surface electrode which is connected to the sub lead via a conductive bonding material, and wherein the main surface electrode of the protective element is connected to the main lead via a third wire, a connecting wiring which connects electrodes of the semiconductor light emitting element, and a connecting member including the second wire.

Abstract: There is provided a semiconductor light-emitting device including: a main lead including a main surface; a semiconductor light-emitting element mounted on the main surface of the main lead; a bonding material that bonds the semiconductor light-emitting element to the main surface of the main lead; a sub lead arranged in a first direction with respect to the main lead and including a main surface facing the same side as the main surface of the main lead; a first wire including a first end connected to the main surface of the sub lead and a second end connected to the semiconductor light-emitting element; a resin case including a case main surface facing the same direction as the main surfaces of the main lead and the sub lead and supporting the main lead and the sub lead.

Abstract: A semiconductor light emitting device includes a main lead, a sub lead, a semiconductor light emitting element bonded to the main lead, and a protective element bonded to the sub lead, wherein the semiconductor light emitting element is connected to the main lead and the sub lead via a first wire and a second wire, respectively, wherein the protective element has a main surface electrode and a back surface electrode which is connected to the sub lead via a conductive bonding material, and wherein the main surface electrode of the protective element is connected to the main lead via a third wire, a connecting wiring which connects electrodes of the semiconductor light emitting element, and a connecting member including the second wire.

Abstract: There is provided a semiconductor light-emitting device including: a main lead including a main surface; a semiconductor light-emitting element mounted on the main surface of the main lead; a bonding material that bonds the semiconductor light-emitting element to the main surface of the main lead; a sub lead arranged in a first direction with respect to the main lead and including a main surface facing the same side as the main surface of the main lead; a first wire including a first end connected to the main surface of the sub lead and a second end connected to the semiconductor light-emitting element; a resin case including a case main surface facing the same direction as the main surfaces of the main lead and the sub lead and supporting the main lead and the sub lead.