Patents by Inventor Dai-Tin Huang

Dai-Tin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planar integrated micro-optical pickup head including two planar cylindrical collimators
    Patent number: 6807141
    Abstract: A planar integrated micro-optical pickup head is used to perform reading and writing operations on a high-density disk. The planar integrated micro-optical pickup head includes a set of optical elements that is comprised of a beam splitter, a plurality of 45-degrees-oriented folding mirrors, and two planar collimators. The pickup head further comprises a photo-detector, a laser source for emitting a laser beam of short wavelength, and an objective lens of high value of numerical aperture. The set of optical elements is formed on lower and upper substrates via semiconductor planar fabrication processes, the laser source and the objective lens then are mechanically attached on the lower substrate. The lower and upper substrates are ultimately aligned and attached with each other to achieve the pickup head hence having a reduced size and simply fabricated.
    Type: Grant
    Filed: December 20, 2001
    Date of Patent: October 19, 2004
    Assignee: Industrial Technology Research
    Inventors: Chi-Lone Chang, Hsi-Fu Shih, Yuan-Chin Lee, Chau-Yuan Ke, Dai-Tin Huang, Jau-Jiu Ju
  • Planar integrated micro-optical pickup head
    Publication number: 20030095493
    Abstract: A planar integrated micro-optical pickup head is used to perform reading and writing operations on a high-density disk. The planar integrated micro-optical pickup head includes a set of optical elements that is comprised of a beam splitter, a plurality of 45-degrees-oriented folding mirrors, and two planar collimators. The pickup head further comprises a photo-detector, a laser source for emitting a laser beam of short wavelength, and an objective lens of high value of numerical aperture. The set of optical elements is formed on lower and upper substrates via semiconductor planar fabrication processes, the laser source and the objective lens then are mechanically attached on the lower substrate. The lower and upper substrates are ultimately aligned and attached with each other to achieve the pickup head hence having a reduced size and simply fabricated.
    Type: Application
    Filed: December 20, 2001
    Publication date: May 22, 2003
    Applicant: Industrial Technology Research
    Inventors: Chi-Lone Chang, Hsi-Fu Shih, Yuan-Chin Lee, Chau-Yuan Ke, Dai-Tin Huang, Jau-Jiu Ju