Abstract: An electronic component evaluation method of evaluating a state of an electronic component includes acquiring reference point information, with respect to at least one terminal, reference point information including at least one of position information and first height information of a plurality of corresponding reference points on the terminal from imaging data obtained by image-capturing the electronic component including a component body and a plurality of terminals attached to the component body, and determining a state according to a shape of the electronic component based on a plurality of pieces of the reference point information.

Abstract: An electronic component inspection apparatus includes: a holding unit that holds an electronic component having a component body and terminals; light sources and reflection plates that irradiate reflected light at least on the terminals of the electronic component held by the holding unit, from the side of a back face opposite to a mounting face of the electronic component; a camera that captures an image of the electronic component under irradiation of the reflected light, from the side of the mounting face; and a control unit that controls processing related to inspection of the electronic component, on the basis of the image of the electronic component captured by the camera.

Abstract: An electronic component evaluation method is provided for evaluating an electronic component. The electronic component has a lower surface facing a mounting substrate, an upper surface having a flat main surface, and a plurality of mounting terminals configured to be mounted on the mounting substrate. The method includes the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals in response to the terminal position information; and detecting a height of at least one of the upper surface or the lower surface relative to the reference plane.

Abstract: An electronic component inspection apparatus includes: a holding unit that holds an electronic component having a component body and terminals; light sources and reflection plates that irradiate reflected light at least on the terminals of the electronic component held by the holding unit, from the side of a back face opposite to a mounting face of the electronic component; a camera that captures an image of the electronic component under irradiation of the reflected light, from the side of the mounting face; and a control unit that controls processing related to inspection of the electronic component, on the basis of the image of the electronic component captured by the camera.

Abstract: An electronic component evaluation method of evaluating a state of an electronic component includes acquiring reference point information, with respect to at least one terminal, reference point information including at least one of position information and first height information of a plurality of corresponding reference points on the terminal from imaging data obtained by image-capturing the electronic component including a component body and a plurality of terminals attached to the component body, and determining a state according to a shape of the electronic component based on a plurality of pieces of the reference point information.

Abstract: An electronic component evaluation method is provided for evaluating an electronic component. The electronic component has a lower surface facing a mounting substrate, an upper surface having a flat main surface, and a plurality of mounting terminals configured to be mounted on the mounting substrate. The method includes the steps of: obtaining terminal position information of the plurality of mounting terminals; generating a reference plane including at least three of the plurality of mounting terminals in response to the terminal position information; and detecting a height of at least one of the upper surface or the lower surface relative to the reference plane.

Abstract: A flatness detection method is provided for detecting component tilt regardless of measurement conditions. The flatness detection method is based on data of an electronic component captured by a 3D camera and is realized by acquiring position information and height information of a plurality of reference points of the electronic component, creating a virtual plane based on the position and the height information of at least three of the plurality of reference points, determining, based on the height information that takes, as a reference, the virtual plane of the reference points excluding selected points from the reference points, whether the virtual plane is a valid plane or an invalid plane, and detecting flatness of the component by taking the valid plane as a reference.

Abstract: A flatness detection method is provided for detecting component tilt regardless of measurement conditions. The flatness detection method is based on data of an electronic component captured by a 3D camera and is realized by acquiring position information and height information of a plurality of reference points of the electronic component, creating a virtual plane based on the position and the height information of at least three of the plurality of reference points, determining, based on the height information that takes, as a reference, the virtual plane of the reference points excluding selected points from the reference points, whether the virtual plane is a valid plane or an invalid plane, and detecting flatness of the component by taking the valid plane as a reference.