Abstract: A substrate clamping apparatus includes a substrate holding part which is movable between a closed state in which a substrate is clamped and an open state in which clamping of the substrate is released, a support column part which supports the substrate holding part and is capable of being raised and lowered, and an interlocking mechanism which interlocks a raising and lowering operation of the support column part with an opening and closing operation of the substrate holding part, in which an opening and closing operation range A of the substrate holding part in an up-and-down stroke S of the support column part includes at least a part of an intermediate region M of the up-and-down stroke S.

Abstract: The present invention provides a resin film that is less likely to suffer peeling or creasing of a layer formed on the resin film in a high temperature process for producing a device and that can be used suitably to produce a product that requires transparency, where the resin film comprises a resin that has a repeating unit as represented by the chemical formula (1) and has a light transmittance of 68% or more at a wavelength of 400 nm, a glass transition temperature of 370° C. or more, and a weight loss starting temperature of 440° C. or more, where in the chemical formula (1), A denotes a tetravalent tetracarboxylic acid residue containing 2 or more carbon atoms and B denotes a divalent diamine residue containing 2 or more carbon atoms.

Abstract: The present embodiment is a fuel cell including a stacked body of single cells each of which includes a power generating unit and separators disposed on both surfaces of the power generating unit, in which the separators each include a metal base material, a carbon layer made of carbon and formed on a first surface of the metal base material on a power generating unit side, and a titanium nitride layer made of titanium nitride and formed on a second surface of the metal base material opposite to the first surface.

Abstract: A device substrate is provided with an increased light transmittance that is a resin film resistant to thermal decomposition in high temperature processes, along with a production method for a device substrate, a device, and a production method for a device, where a resin composition designed to produce a resin film to be used as a substrate for a display device or light receiving device, comprises (a) a resin that has a repeating unit as represented by the chemical formula (1) or (2) as a primary component and (b) a chemical compound as represented by the chemical formula (3) and/or a condensation product thereof, wherein in the chemical formulae (1) and (2), X, Y, R1 and R2 are defined, and Si(OR11)n(R12)4-n??(3) wherein in the chemical formula (3), R11 and R12 are as defined.

Abstract: A resin film according to one aspect of the present invention contains polyimide, and satisfies the condition “the electric charge change in film after irradiation with a light having a wavelength of 470 nm and an intensity of 4.0 ?W/cm2 for 30 minutes relative to before irradiation with the light is 1.0×1016 cm?3 or less.” Such a resin film can be used as a substrate for a semiconductor element to form an electronic device including the resin film, and a semiconductor element formed on the resin film.

Abstract: The present embodiment is a fuel cell including a stacked body of single cells each of which includes a power generating unit and separators disposed on both surfaces of the power generating unit, in which the separators each include a metal base material, a carbon layer made of carbon and formed on a first surface of the metal base material on a power generating unit side, and a titanium nitride layer made of titanium nitride and formed on a second surface of the metal base material opposite to the first surface.

Abstract: A resin film used as a support substrate of a thin film transistor is described where the resin film contains a heat-resistant resin and a predetermined face of the resin film has a sheet resistance of more than 1×1012? and less than 1×1016?. The resin film is less likely to have foreign substances stuck thereto, and thus, can inhibit damage caused to a TFT element by gas emitted from foreign substances in high-temperature processes. The resin film can also be provided as a support substrate of a thin film transistor in a display.

Abstract: A resin composition for display substrates includes the following: the resin (a): a resin containing, as a main component, a repeating unit represented by the chemical formula (1), wherein the resin contains the total of 95 mass % or more of a tetracarboxylic acid residue A, having 2 or more carbon atoms and an SP value of 15 or more and 17 or less and a diamine residue having an SP value of 11 or more and 13 or less with respect to the total of 100 mass % of A and B contained in the resin; the solvent (b): a solvent having an SP value of 7.5 or more and less than 9.5; and the solvent (c): a solvent having an SP value of 9.5 or more and 14.0 or less; wherein R1 and R2 independently represent a hydrogen atom, hydrocarbon group having 1 to 10 carbon atoms, alkylsilyl group having 1 to 10 carbon atoms, alkali metal ion, ammonium ion, imidazolium ion, or pyridinium ion.

Abstract: A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.

Abstract: A resin composition for a display substrate, the resin composition including a solvent and a heat-resistant resin or a precursor thereof, wherein the solvent has as a main component an amide compound having a surface tension of 35 mN/m or less at 25° C. Provided is a resin composition for a display substrate, whereby pinholing of a thin film is not prone to occur.

Abstract: A resin composition includes an (a) resin having a structure represented by Chemical Formula (1); and a (b) solvent. The resin composition also includes an amount of a compound represented by Chemical Formula (3) which is 0.1 ppm by mass or more and 40 ppm by mass or less.

Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), ? represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein ? represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract: A polyamic acid useful for forming a protective or insulative layer for semiconductor elements has a structure represented by chemical formula (1): wherein ? represents an oxygen or sulfur atom; W represents an electron-withdrawing group; and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract: An object is to provide a polyamic acid resin composition that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics. Another object is to provide a polyamic acid resin composition in which the acid anhydride terminal group is low in reactivity with diamine and which can give a varnish that does not suffer significant precipitation of diamine. These objects can be met by a polyamic acid resin composition that contains: (a) polyamic acid and (b) a compound as represented by chemical formula (1). (In Chemical formula (1), Z is a di- or higher-valent organic group containing 2 or more carbon atoms, V is a structure as represented by chemical formula (2), and k is an integer of 2 or more.) (In In Chemical formula (2), ? represents oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group containing 1 to 10 carbon atoms.

Abstract: The invention aims to provide polyamic acid that can form a varnish with a low viscosity and serves to produce, through curing, coat film with good mechanical characteristics and further aims to produce cured coat film with good mechanical characteristics regardless of whether the molar concentration of the acid anhydride group in the acid dianhydride monomer and that of the amino group in the multivalent amine compound or diamine compound are identical to or different from each other. This objective is met by polyamic acid including a structure as represented by chemical formula (1) given below: (In chemical formula (1), ? represents an oxygen or sulfur atom and W represents an electron-withdrawing group, and R11 and R12 represent independently a hydrogen atom or a hydrocarbon group having 1 to 10 carbon atoms.

Abstract: The disclosed polyamic acid resin composition contains (a) a polyamic acid represented by general formula (1) or (2), and (b) a solvent. (A, A?, C, C? are end-capped polyamic acid blocks comprising diaminobenzanilide and pyromellitic dianhydride or benzophenone tetracarboxylic dianhydride, and B, or D, is a polyamic acid block comprising a repeating unit other than A, A?, or C, C?.

Abstract: A polyamic acid resin composition includes (a) a polyamic acid having structures represented by general formula (1) in an amount of at least 80% of all the repeating units and (b) a solvent. In formula (1), A is a polyamic acid block represented by general formula (2); B is a polyamic acid block represented by general formula (3); and k is a positive integer. In formula (2), Ws are divalent organic groups having two or more carbon atoms, mainly composed of divalent organic groups represented by general formula (4); Xs are tetravalent organic groups having two or more carbon atoms. In formula (3), Ys are divalent organic groups having two or more carbon atoms, exclusive of the groups represented by formula (4); Zs are tetravalent organic groups each having two or more carbon atoms, and are mainly composed of tetravalent organic groups represented by general formula (5) or (6).