Abstract: Heat-insulation materials that can be placed along the lines of heat sources, heat-insulation structures using the same, and processes for producing the same. A heat-insulation material, that includes: fiber sheets that each have fibers and an aerogel and that have different sizes; and at least one covering material that covers the fiber sheets, or at least one elastic material that includes the fiber sheets. The at least one covering material may include a first covering material and a second covering material.

Abstract: Heat-insulation materials that can be placed along the lines of heat sources, heat-insulation structures using the same, and processes for producing the same. A heat-insulation material, that includes: fiber sheets that each have fibers and an aerogel and that have different sizes; and at least one covering material that covers the fiber sheets, or at least one elastic material that includes the fiber sheets. The at least one covering material may include a first covering material and a second covering material.

Abstract: An object of the disclosure is to provide heat insulation materials that combine high heat insulation properties realizing effective heat insulation, and flame retardancy realizing prevention of fire spreading, and devices using the same. In order to achieve this object, disclosed are heat insulation materials, including: a silica xerogel; a carbon material; unwoven fabric fibers that retains the silica xerogel, and the carbon material. Further disclosed are devices, including the above-described heat insulation material, wherein the heat insulation material serves as a part of a heat-insulation or refrigeration structure, or is placed between a heat-producing component and a casing.

Abstract: A composite sheet includes a graphite layer, a heat insulation layer including a fiber and a heat insulation material and a fiber layer located between the graphite layer and the heat insulation layer, wherein the fiber layer comprises the fiber. An electronic apparatus includes an electronic component that involves heat generation, a housing and the composite sheet, wherein the composite sheet is placed between the electronic component and the housing.

Abstract: A composite sheet includes: a graphite layer that is disposed on a high temperature portion; an aerogel layer that is disposed on a low temperature portion; and an adhesive layer to which the graphite layer and the aerogel layer are fixed, in which the adhesive layer is formed of a water-based adhesive. The water-based adhesive layer is formed of an adhesive containing water as a solvent or an adhesive containing water as a raw material. The water-based adhesive layer includes gaps.

Abstract: A heat insulation sheet includes, as a substrate, a silica aerogel with low heat conductivity and high mechanical strength In a hydrophobization reaction of a hydrogel, a silane coupling agent having a reactive organic functional group is used to conduct hydrophobization, and, after volatilization of a solvent in a drying step, the temperature is elevated to 100° C. or higher that is a reaction-starting temperature, thereby reacting and bonding the reactive functional group and a fiber to each other. This allows prevention of detachment or loss of fine particles of silica xerogel from the unwoven fabric fiber.

Abstract: A composite sheet includes a graphite layer, a heat insulation layer including a fiber and a heat insulation material and a fiber layer located between the graphite layer and the heat insulation layer, wherein the fiber layer comprises the fiber. An electronic apparatus includes an electronic component that involves heat generation, a housing and the composite sheet, wherein the composite sheet is placed between the electronic component and the housing.

Abstract: A composite sheet includes: a graphite layer that is disposed on a high temperature portion; an aerogel layer that is disposed on a low temperature portion; and an adhesive layer to which the graphite layer and the aerogel layer are fixed, in which the adhesive layer is formed of a water-based adhesive. The water-based adhesive layer is formed of an adhesive containing water as a solvent or an adhesive containing water as a raw material. The water-based adhesive layer includes gaps.