Patents by Inventor Daigo Hoshino
Daigo Hoshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100208220Abstract: When a self-cleaning method for an aligner is carried out, a reflecting plate having a convex lens portion is set in an original plate holder, and exposure light rays are irradiated from a light source. The surface of the lens portion is coated with a reflective film. The light rays are reflected by the reflecting plate, diffused, and emitted onto the surface of a condenser lens, thereby breaking down and removing contaminants that are adhered to the surface of the condenser lens. The light rays also enter the interior of the condenser lens to clean away contaminants that are adhered to locations other than a normal exposure path. When a concave mirror and/or a reflecting plate having 50% transmittance is used as the reflecting plate, the emission range of the light rays (i.e., the locations that are cleaned) can be changed.Type: ApplicationFiled: April 26, 2010Publication date: August 19, 2010Applicant: OKI SEMICONDUCTOR CO., LTD.Inventors: Ryoichi Aoyama, Daigo Hoshino, Toshio Onodera, Yasuhiro Yamamoto
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Patent number: 7733460Abstract: When a self-cleaning method for an aligner is carried out, a reflecting plate having a convex lens portion is set in an original plate holder, and exposure light rays are irradiated from a light source. The surface of the lens portion is coated with a reflective film. The light rays are reflected by the reflecting plate, diffused, and emitted onto the surface of a condenser lens, thereby breaking down and removing contaminants that are adhered to the surface of the condenser lens. The light rays also enter the interior of the condenser lens to clean away contaminants that are adhered to locations other than a normal exposure path. When a concave mirror and/or a reflecting plate having 50% transmittance is used as the reflecting plate, the emission range of the light rays (i.e., the locations that are cleaned) can be changed.Type: GrantFiled: November 23, 2005Date of Patent: June 8, 2010Assignee: Oki Semiconductor Co., Ltd.Inventors: Ryoichi Aoyama, Daigo Hoshino, Toshio Onodera, Yasuhiro Yamamoto
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Publication number: 20070240735Abstract: When a self-cleaning method for an aligner is carried out, a reflecting plate having a convex lens portion is set in an original plate holder, and exposure light rays are irradiated from a light source. The surface of the lens portion is coated with a reflective film. The light rays are reflected by the reflecting plate, diffused, and emitted onto the surface of a condenser lens, thereby breaking down and removing contaminants that are adhered to the surface of the condenser lens. The light rays also enter the interior of the condenser lens to clean away contaminants that are adhered to locations other than a normal exposure path. When a concave mirror and/or a reflecting plate having 50% transmittance is used as the reflecting plate, the emission range of the light rays (i.e., the locations that are cleaned) can be changed.Type: ApplicationFiled: November 23, 2005Publication date: October 18, 2007Inventors: Ryoichi Aoyama, Daigo Hoshino, Toshio Onodera, Yasuhiro Yamamoto
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Patent number: 7183025Abstract: A phase shift mask comprises first and second mask patterns. The first mask pattern is a backing film enabling a first optical image to be formed on a substrate. The first optical image forms a resist pattern having a width that changes depending on the distance between the phase shift mask and the substrate. The second mask pattern is a semi-transmissive film enabling a second optical image to be formed on the substrate. The second optical image can form a resist pattern having a width that changes depending on the distance between the phase shift mask and the substrate and on a thickness of the semi-transmissive film. The duty ratio of the second mask is set so that the rate at which the width of the first optical image varies will be the same as the rate at which the width of the second optical image varies.Type: GrantFiled: May 30, 2006Date of Patent: February 27, 2007Assignee: Oki Electric Industry Co., Ltd.Inventor: Daigo Hoshino
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Publication number: 20060275678Abstract: A phase shift mask comprises first and second mask patterns. The first mask pattern is a backing film enabling a first optical image to be formed on a substrate. The first optical image forms a resist pattern having a width that changes depending on the distance between the phase shift mask and the substrate. The second mask pattern is a semi-transmissive film enabling a second optical image to be formed on the substrate. The second optical image can form a resist pattern having a width that changes depending on the distance between the phase shift mask and the substrate and on a thickness of the semi-transmissive film. The duty ratio of the second mask is set so that the rate at which the width of the first optical image varies will be the same as the rate at which the width of the second optical image varies.Type: ApplicationFiled: May 30, 2006Publication date: December 7, 2006Applicant: OKI ELECTRIC INDUSTRY CO., LTD.Inventor: Daigo HOSHINO
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Patent number: 7074547Abstract: A photomask for use in a semiconductor fabrication process, comprises a plurality of first mask patterns for transferring resist patterns, and second mask patterns for restraining an optical proximity effect, each having a width not larger than a resolution limit. The second mask patterns are formed in a line-like shape, and disposed so as to link together the plurality of the first mask patterns. As a result of use of the second mask patterns in the line-like shape, a fewer parameters may be added in simulation of resist patterns. Thus, it becomes possible to provide the photomask for efficiently performing simulation and forming suitable resist patterns. Further, the photomask can be used in a semiconductor fabrication process.Type: GrantFiled: February 8, 2005Date of Patent: July 11, 2006Assignee: Oki Electric Industry Co., Ltd.Inventor: Daigo Hoshino
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Patent number: 6980278Abstract: To an original plate holder 16 to which an original pattern plate 15 is set in ordinary exposure, a transmittable plate 20 having a concave-shaped concave portion 22 formed at a middle of a quartz glass plate is set in self-cleaning and irradiated with ultraviolet light emitted from a light source 11. The ultraviolet light is diffused through the concave lens of the transmittable plate 20 and an entire surface of a projection lens 17 is irradiated with it. Accordingly, molecular bonds of a contaminant adhering to the surface of the projection lens 17 are cut off with strong energy of the ultraviolet light, so that the contaminant is decomposed, vaporized, and then removed.Type: GrantFiled: December 31, 2003Date of Patent: December 27, 2005Assignee: Oki Electric Industry Co., Ltd.Inventors: Ryoichi Aoyama, Toshio Onodera, Yasuhiro Yamamoto, Daigo Hoshino
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Publication number: 20050147896Abstract: A photomask for use in a semiconductor fabrication process, comprises a plurality of first mask patterns for transferring resist patterns, and second mask patterns for restraining an optical proximity effect, each having a width not larger than a resolution limit. The second mask patterns are formed in a line-like shape, and disposed so as to link together the plurality of the first mask patterns. As a result of use of the second mask patterns in the line-like shape, a fewer parameters may be added in simulation of resist patterns. Thus, it becomes possible to provide the photomask for efficiently performing simulation and forming suitable resist patterns. Further, the photomask can be used in a semiconductor fabrication process.Type: ApplicationFiled: February 8, 2005Publication date: July 7, 2005Applicant: Oki Electric Industry Co.. Ltd.Inventor: Daigo Hoshino
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Patent number: 6894782Abstract: There is provided a method of measuring defocusing when a semiconductor wafer is exposed to light. With the method, a resist is exposed to light by deviating a focus of the light by a given distance in relation to the semiconductor wafer with the resist applied thereto, and after development of the resist, resist patterns for measurement are formed. Based on respective lengths of the resist patterns for measurement, defocusing in relation to the resist is found.Type: GrantFiled: July 15, 2003Date of Patent: May 17, 2005Assignee: Oki Electric Industry Co., Ltd.Inventors: Daigo Hoshino, Takahiro Yamauchi
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Patent number: 6872494Abstract: A photomask for use in a semiconductor fabrication process, comprises a plurality of first mask patterns for transferring resist patterns, and second mask patterns for restraining an optical proximity effect, each having a width not larger than a resolution limit. The second mask patterns are formed in a line-like shape, and disposed so as to link together the plurality of the first mask patterns. As a result of use of the second mask patterns in the line-like shape, a fewer parameters may be added in simulation of resist patterns. Thus, it becomes possible to provide the photomask for efficiently performing simulation and forming suitable resist patterns. Further, the photomask can be used in a semiconductor fabrication process.Type: GrantFiled: May 8, 2002Date of Patent: March 29, 2005Assignee: Oki Electric Industry Co., Ltd.Inventor: Daigo Hoshino
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Publication number: 20040239900Abstract: To an original plate holder 16 to which an original pattern plate 15 is set in ordinary exposure, a transmittable plate 20 having a concave-shaped concave portion 22 formed at a middle of a quartz glass plate is set in self-cleaning and irradiated with ultraviolet light emitted from a light source 11. The ultraviolet light is diffused through the concave lens of the transmittable plate 20 and an entire surface of a projection lens 17 is irradiated with it. Accordingly, molecular bonds of a contaminant adhering to the surface of the projection lens 17 are cut off with strong energy of the ultraviolet light, so that the contaminant is decomposed, vaporized, and then removed.Type: ApplicationFiled: December 31, 2003Publication date: December 2, 2004Inventors: Ryoichi Aoyama, Toshio Onodera, Yasuhiro Yamamoto, Daigo Hoshino
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Publication number: 20040013957Abstract: There is provided a method of measuring defocusing when a semiconductor wafer is exposed to light. With the method, a resist is exposed to light by deviating a focus of the light by a given distance in relation to the semiconductor wafer with the resist applied thereto, and after development of the resist, resist patterns for measurement are formed. Based on respective lengths of the resist patterns for measurement, defocusing in relation to the resist is found.Type: ApplicationFiled: July 15, 2003Publication date: January 22, 2004Inventors: Daigo Hoshino, Takahiro Yamauchi
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Publication number: 20020172872Abstract: A photomask for use in a semiconductor fabrication process, comprises a plurality of first mask patterns for transferring resist patterns, and second mask patterns for restraining an optical proximity effect, each having a width not larger than a resolution limit. The second mask patterns are formed in a line-like shape, and disposed so as to link together the plurality of the first mask patterns. As a result of use of the second mask patterns in the line-like shape, a fewer parameters may be added in simulation of resist patterns. Thus, it becomes possible to provide the photomask for efficiently performing simulation and forming suitable resist patterns. Further, the photomask can be used in a semiconductor fabrication process.Type: ApplicationFiled: May 8, 2002Publication date: November 21, 2002Inventor: Daigo Hoshino