Abstract: According to one embodiment, an information processing apparatus includes a processing circuit configured to acquire first data that includes a first position of a mobile object at a time of receiving a first signal from an antenna or a first distance between the mobile object and the antenna, and a first received power of the first signal, acquire second data that includes a second position of the mobile object at a time of receiving a second signal from the antenna or a second distance between the mobile object and the antenna, and a second received power of the second signal, and estimate a propagation environment of a signal in a space facing the antenna with the second position interposed therebetween by comparing the first data with the second data.

Abstract: A hard wafer grinding method includes a rough grinding step of forming a section along the diameter of a hard wafer into a centrally recessed shape by roughly grinding the hard wafer such that a central part of the hard wafer is thinner than a peripheral part of the hard wafer, a finish grinding step of expanding a ground area of the hard wafer from the peripheral part in an annular shape to the central part while dressing lower surfaces of finish grinding stones by the peripheral part of the hard wafer of the centrally recessed shape after the rough grinding, then setting the whole of a radius part of the hard wafer as the ground area, and further finish-grinding the hard wafer so as to obtain a predetermined thickness.

Abstract: A grinding method includes a first grinding step of executing grinding feed of a rough grinding unit and grinding the workpiece to a predetermined thickness while supplying grinding water with a first grinding water amount that allows suppression of wear of grinding abrasive stones and a second grinding step of, after executing the first grinding step, promoting dressing of the grinding abrasive stones to prepare for processing of the next workpiece through executing grinding feed of the rough grinding unit and grinding the workpiece to the finished thickness while supplying the grinding water with a second grinding water amount that increases wear of the grinding abrasive stones and promotes self-sharpening through reduction relative to the first grinding water amount.

Abstract: A robot includes: a robot body including a plurality of joints, and a cleaning mechanism provided to the robot body and configured to clean a predetermined cleaning target site of the robot body to which a foreign material is likely to adhere.

Abstract: A robot includes: a robot body including a plurality of joints, and a cleaning mechanism provided to the robot body and configured to clean a predetermined cleaning target site of the robot body to which a foreign material is likely to adhere.

Abstract: A communication device includes: an encryption unit configured to encrypt a stream into encrypted data using a common key; a communication unit configured to transmit the encrypted data encrypted using the common key to a communication device; a common key update unit configured to update, after an update timing of the common key is reached, the common key using an unencrypted stream of the encrypted data started to be transmitted after the update timing; and a control unit configured to control the encryption unit so that the encryption unit does not start encryption of the stream and control the communication unit so that the communication unit does not start transmission of the encrypted data, in a case where a time when the stream to be transmitted to the communication unit is generated is within a predetermined period before and after the update timing.

Abstract: It is a problem of the present invention to provide a convenient and safe periodontal tissue regeneration material and provide a method of regenerating a periodontal tissue. The present invention provides a periodontal tissue regeneration material comprising dedifferentiated fat cells (DFAT) as the convenient and safe periodontal tissue regeneration material. The present invention provides a method of regenerating a periodontal tissue with the periodontal tissue regeneration material.

Abstract: An electromagnetic flowmeter includes a measuring tube, electrodes, an exciting coil for applying, to a fluid, a time-changing magnetic field asymmetrical with respect to a plane PLN, a signal conversion unit which extracts a ?A/?t component, irrelevant to a fluid flow velocity, from a resultant electromotive force of an electromotive force based on the ?A/?t component and an electromotive force based on a v×B component originating from the flow velocity of the fluid, a flow rate output unit which removes a variation factor for a span as a coefficient applied to a magnitude V of a flow velocity of the v×B component in the resultant electromotive force, based on the extracted ?A/?t component, and calculates a flow rate of the fluid from a result obtained by removing the variation factor, and signal lines inclined with respect to a direction of the magnetic field in parallel with the plane PLN.

Abstract: Power that is supplied to a primary coil of a transformer from a DC power supply that is connected to the primary coil is modulated based on continuous pulses supplied from a microcontroller, and power that is induced between terminals of a secondary coil of the transformer is supplied to a relay. A large driving current can be supplied to the relay thereby, thus making it possible to reduce the ripple component, and, as a result, to achieve stabilized operation.

Abstract: Forecasting the end of the service life of a relay more accurately due to the effects of the load conditions and the environmental conditions can occur through diagnosing the end of service life of the relay based on the time, until the point in time that the actual opening or closing of the relay is detected, from the point in time of the application of the power to the relay or the point in time of the end of application of power to the relay coil by the controlling portion. Forecasting the end of the service life of the relay based on time, increases accuracy because time is a value that is not affected by the external environment. Additionally, because the end of the service life is forecasted based on the actual opening/closing of the relay, not only is it possible to detect immediately a fault in the relay, but it is also possible to eliminate the effects due to individual differences.

Abstract: An electromagnetic flowmeter includes a measuring tube, electrodes, an exciting coil for applying, to a fluid, a time-changing magnetic field asymmetrical with respect to a plane PLN, a signal conversion unit which extracts a ?A/?t component, irrelevant to a fluid flow velocity, from a resultant electromotive force of an electromotive force based on the ?A/?t component and an electromotive force based on a v×B component originating from the flow velocity of the fluid, a flow rate output unit which removes a variation factor for a span as a coefficient applied to a magnitude V of a flow velocity of the v×B component in the resultant electromotive force, based on the extracted ?A/?t component, and calculates a flow rate of the fluid from a result obtained by removing the variation factor, and signal lines inclined with respect to a direction of the magnetic field in parallel with the plane PLN.

Abstract: A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the semiconductor wafer, and the whole surface protective film is heated by the heating block. Thus, the air bubbles existing between the semiconductor wafer and the surface protective film are expanded or swelled, and the adhesion between the semiconductor wafer and the surface protective film is weakened. After that, the surface protective film is peeled from the semiconductor wafer. As a result, a peel starting point can be appropriately formed and damage to the wafer can be prevented.

Abstract: A method and an apparatus for peeling a surface protective film attached on the surface of a semiconductor wafer are provided. A heating block is set in proximity to the whole surface of the semiconductor wafer, and the whole surface protective film is heated by the heating block. Thus, the air bubbles existing between the semiconductor wafer and the surface protective film are expanded or swelled, and the adhesion between the semiconductor wafer and the surface protective film is weakened. After that, the surface protective film is peeled from the semiconductor wafer. As a result, a peel starting point can be appropriately formed and damage to the wafer can be prevented.