Abstract: To reduce a dielectric loss while determining a direction of an antenna formed on a flexible board. An antenna device includes: a flexible board including an antenna and a signal line coupled to the antenna, the antenna and the signal line being formed on a front surface side of the flexible board; and a support that puts the flexible board in a predetermined shape, the support having a shape that does not cover at least a part of a second region of a back surface of the flexible board, the second region corresponding to a first region in which the antenna and the signal line are formed.

Abstract: [Problem] To electrically connect two substrates by using conductive paste while maintaining the distance between the two substrates at a predetermined distance. [Solution] A substrate module of the present disclosure includes: a first substrate including a plurality of first pads; and a second substrate including a plurality of second pads, the first substrate and the second substrate being electrically connected. A spacer is attached to a pad of at least either of the first pads and the second pads, and one or more pairs of the first pads and the second pads not sandwiching the spacer are bonded with conductive paste in a state where the spacer is sandwiched between another pair of the first pads and the second pads.

Abstract: The present invention provides an antenna device whose radiation direction is adjustable and which can be manufactured at a lower cost than in the case of a conventional antenna device. An antenna device (1) includes a dielectric substrate (11), a ground conductor (12) provided on a first main surface of the dielectric substrate (11), and an antenna conductor (13) provided on a second main surface of the dielectric substrate (11). The ground conductor (12) is made of a conductor material having a thermal expansion coefficient higher than that of a dielectric material of which the dielectric substrate (11) is made. A heating wire (16) which serves as a heating/cooling mechanism is provided inside the dielectric substrate (11).

Abstract: An embodiment of the present invention provides a wiring substrate which allows bending of the wiring substrate to be carried out concurrently with reflow for mounting an electronic component to the wiring substrate. A component-mounted body (1) of an embodiment of the present invention includes a wiring substrate (10) and at least one bend assisting body (30) which is belt-like and formed on the wiring substrate (10). The wiring substrate (10) is bent so that a straight bending line is formed along a direction in which the at least one bend assisting body (30) extends. This forms, in the wiring substrate (10), a depressed portion (14) which can contain an IC chip (20).

Abstract: An embodiment of the present invention provides a wiring substrate which allows bending of the wiring substrate to be carried out concurrently with reflow for mounting an electronic component to the wiring substrate. A component-mounted body (1) of an embodiment of the present invention includes a wiring substrate (10) and at least one bend assisting body (30) which is belt-like and formed on the wiring substrate (10). The wiring substrate (10) is bent so that a straight bending line is formed along a direction in which the at least one bend assisting body (30) extends. This forms, in the wiring substrate (10), a depressed portion (14) which can contain an IC chip (20).

Abstract: A lid constitutes, together with a housing, a package that encloses an optical element. The lid includes a frame plate divided into a first member and a second member; and a window plate that closes an opening of the frame plate. The window plate includes a lower surface whose outer peripheral part is bonded to the first member and an upper surface whose outer peripheral part is bonded to the second member.

Abstract: A lid constitutes, together with a housing, a package that encloses an optical element. The lid includes a frame plate divided into a first member and a second member; and a window plate that closes an opening of the frame plate. The window plate includes a lower surface whose outer peripheral part is bonded to the first member and an upper surface whose outer peripheral part is bonded to the second member.

Abstract: An optical device (10) includes an LCOS element (3), a heater substrate (2), and a resin layer (4) provided between the LCOS element (3) and the heater substrate (2), the resin layer (4) having a larger thickness at a central region of the LCOS element (3) than at a peripheral region of the LCOS element (3).

Abstract: A cover (8) of an optical device (10) is divided into: a first cover (5) which is fixed to a side wall section (4) so that an optical window (52) covers a light receiving section (1a) that serves as an effective region of an LCOS element (1); and a second cover (6) which is fixed to the side wall section (4) and the first cover (5) so as to cover an electrode terminal (3) and a wire (7) that connects the electrode terminal (3) and the semiconductor element (1b) to each other.

Abstract: A sensor head for an optical pressure sensor according to the present invention includes: a light-emitting optical fiber for transmitting light emitted from a light source; a reflecting plate whose position relative to an end surface of the light-emitting optical fiber moves in accordance with a pressure and which reflects the light emitted from the end surface of the light-emitting optical fiber; a first optical fiber and a second optical fiber, each of which has an end surface that the light reflected by the reflecting plate enters, the first optical fiber transmitting the light thus entered to a first photodetector and the second optical fiber transmitting the light thus entered to a second photodetector; and a light-intensity variation section that changes a transmission loss in the light-emitting optical fiber in accordance with a change in humidity in the sensor head.

Abstract: A method of the present invention is a method for manufacturing an optical module (10) including an optical fiber (3) and an optical fiber insertion pipe (2) into which the optical fiber (3) is inserted, and includes a sealing step in which the optical fiber insertion pipe (2) is hermetically sealed. The sealing step includes a contact step, a heating step, and a feeding step. In the contact step, a heat conductor member (5) is provided along and in contact with a side surface of the optical fiber insertion pipe (2), the heat conductor member having a heat conductivity greater than that of an environmental atmosphere of the sealing step and having a heat generating property of generating heat by induction heating, which heat generating property of the heat conductor member is inferior to that of the optical fiber insertion pipe (2) in terms of heat generation amount. In the heating step, the optical fiber insertion pipe (2) thus provided with the heat conductor member (5) is heated by induction heating.

Abstract: A sensor head for an optical pressure sensor according to the present invention includes: a light-emitting optical fiber for transmitting light emitted from a light source; a reflecting plate whose position relative to an end surface of the light-emitting optical fiber moves in accordance with a pressure and which reflects the light emitted from the end surface of the light-emitting optical fiber; a first optical fiber and a second optical fiber, each of which has an end surface that the light reflected by the reflecting plate enters, the first optical fiber transmitting the light thus entered to a first photodetector and the second optical fiber transmitting the light thus entered to a second photodetector; and a light-intensity variation section that changes a transmission loss in the light-emitting optical fiber in accordance with a change in humidity in the sensor head.

Abstract: A method of the present invention is a method for manufacturing an optical module (10) including an optical fiber (3) and an optical fiber insertion pipe (2) into which the optical fiber (3) is inserted, and includes a sealing step in which the optical fiber insertion pipe (2) is hermetically sealed. The sealing step includes a contact step, a heating step, and a feeding step. In the contact step, a heat conductor member (5) is provided along and in contact with a side surface of the optical fiber insertion pipe (2), the heat conductor member having a heat conductivity greater than that of an environmental atmosphere of the sealing step and having a heat generating property of generating heat by induction heating, which heat generating property of the heat conductor member is inferior to that of the optical fiber insertion pipe (2) in terms of heat generation amount. In the heating step, the optical fiber insertion pipe (2) thus provided with the heat conductor member (5) is heated by induction heating.