Patents by Inventor Daisuke Fukui

Daisuke Fukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6498123
    Abstract: The present invention is to provide a thermal transfer sheet provided with a backface layer having high heat resistance and slipping characteristics by using a one-solution type coating solution adopting an environmentally acceptable general solvent without performing heat treatment such as aging. The thermal transfer sheet provided with the backface layer according to the present invention comprises a transfer ink layer which is melted or sublimated by heating on one surface of a substrate and the backface layer on the other surface of the substrate film, wherein the backface layer comprises a binder which comprises a polyamideimide resin and a polyamideimide silicone resin each having a grass transition temperatures of 200° C. or more based on differential thermal analysis at a specified mixing ratio, a polevalent metal salt of alkyl phosphate and filler at a specified mixing ratio.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: December 24, 2002
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Taro Suzuki, Daisuke Fukui, Munenori Ieshige
  • Publication number: 20020127378
    Abstract: A thermal transfer sheet is provided which, during storage up to use thereof, is less likely to cause a dye contained in a thermally transferable ink layer to migrate to a heat-resistant protective layer in contact with the thermally transferable ink layer and, in actually performing thermal printing, does not cause heat fusing between a thermal head and the sheet. The thermal transfer sheet comprises: a substrate sheet; a thermally transferable ink layer provided on one surface of the substrate sheet; and provided on the other surface of the substrate sheet, a heat-resistant protective layer comprising a primer layer and a heat-resistant slip layer provided in that order, the primer layer being formed of a composition comprising a synthetic resin which has a storage modulus G′ of not less than 106 Pa at 40° C. and a loss modulus G″ of not less than 104 Pa at 120° C.
    Type: Application
    Filed: December 26, 2001
    Publication date: September 12, 2002
    Applicant: DAI NIPPON PRINTING CO.
    Inventors: Taro Suzuki, Daisuke Fukui, Munenori Ieshige
  • Publication number: 20010034302
    Abstract: The present invention is to provide a thermal transfer sheet provided with a backface layer having high heat resistance and slipping characteristics by using a one-solution type coating solution adopting an environmentally acceptable general solvent without performing heat treatment such as aging. The thermal transfer sheet provided with the backface layer according to the present invention comprises a transfer ink layer which is melted or sublimated by heating on one surface of a substrate and the backface layer on the other surface of the substrate film, wherein the backface layer comprises a binder which comprises a polyamideimide resin and a polyamideimide silicone resin each having a grass transition temperatures of 200° C. or more based on differential thermal analysis at a specified mixing ratio, a polevalent metal salt of alkyl phosphate and filler at a specified mixing ratio.
    Type: Application
    Filed: March 9, 2001
    Publication date: October 25, 2001
    Inventors: Taro Suzuki, Daisuke Fukui, Munenori Ieshige