Abstract: A molded product production device that includes a molding die having an inner circumferential surface defining a cavity with upper and lower openings, the cavity into which the molding material is to be filled, a lower punch provided so as to be inserted into the cavity from the lower opening thereof and vertically move, the lower punch having a lower punch surface and a lower punch release agent holding portion which is provided at a lower side of the lower punch surface and capable of holding a release agent, an upper punch provided so as to be inserted into the cavity from the upper opening thereof and vertically move, the upper punch having an upper punch surface, and a lower punch release agent supply means which supplies the release agent to the lower punch release agent holding portion when being exposed outside the cavity.

Abstract: In a molded body production device, a release agent injection means applies a release agent onto an upper punch surface by injecting the release agent toward the upper punch surface in a state that an upper punch is located above an upper end surface of a molding die, and applies the release agent onto a lower punch surface and an inner circumferential surface exposing above the lower punch surface by injecting the release agent toward the lower punch surface in a state that the lower punch surface is located into the cavity and below the upper end surface of the molding die, before the molding material is filled into the cavity. This makes it possible to prevent the molding material from bonding to the upper punch surface, the lower punch surface and the inner circumferential surface defining the cavity.

Abstract: In a molded body production device, a release agent injection means applies a release agent onto an upper punch surface by injecting the release agent toward the upper punch surface in a state that an upper punch is located above an upper end surface of a molding die, and applies the release agent onto a lower punch surface and an inner circumferential surface exposing above the lower punch surface by injecting the release agent toward the lower punch surface in a state that the lower punch surface is located into the cavity and below the upper end surface of the molding die, before the molding material is filled into the cavity. This makes it possible to prevent the molding material from bonding to the upper punch surface, the lower punch surface and the inner circumferential surface defining the cavity.

Abstract: A molded product production device that includes a molding die having an inner circumferential surface defining a cavity with upper and lower openings, the cavity into which the molding material is to be filled, a lower punch provided so as to be inserted into the cavity from the lower opening thereof and vertically move, the lower punch having a lower punch surface and a lower punch release agent holding portion which is provided at a lower side of the lower punch surface and capable of holding a release agent, an upper punch provided so as to be inserted into the cavity from the upper opening thereof and vertically move, the upper punch having an upper punch surface, and a lower punch release agent supply means which supplies the release agent to the lower punch release agent holding portion when being exposed outside the cavity.

Abstract: An epoxy resin composition for encapsulating semiconductors containing an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, a glycerol tri-fatty acid ester produced by dehydration condensation reaction of glycerol and a saturated fatty acid with a carbon atom content of 24-36, and a hydrotalcite compound as essential components is provided. The resin composition exhibits excellent mold releasability and produces only a slight amount of stains on the surfaces of the mold and semiconductor packages. A semiconductor device exhibiting excellent solder resistance is also provided.

Abstract: An epoxy resin composition for encapsulating semiconductors containing an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, a glycerol tri-fatty acid ester produced by dehydration condensation reaction of glycerol and a saturated fatty acid with a carbon atom content of 24-36, and a hydrotalcite compound as essential components is provided. The resin composition exhibits excellent mold releasability and produces only a slight amount of stains on the surfaces of the mold and semiconductor packages. A semiconductor device exhibiting excellent solder resistance is also provided.