Patents by Inventor Daisuke MOTOI

Daisuke MOTOI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240124697
    Abstract: A resin composition has a low styrene-based resin content and that has little impact on the environment, wherein the resin composition has good moldability and yields molded articles having excellent tensile moduli and tensile elongations at break; and a molded article composed of the resin composition. The resin composition contains an inorganic filler containing calcium carbonate and a styrene-based resin containing a diene component, wherein the inorganic filler content is 50 mass % or more relative to the overall mass of the resin composition, and as measured in accordance with ASTM-D638, the tensile modulus is 1,000-3,000 MPa, and the tensile elongation at break is 5% or higher.
    Type: Application
    Filed: March 24, 2022
    Publication date: April 18, 2024
    Applicant: DENKA COMPANY LIMITED
    Inventors: Eri KAMIMAKI, Daisuke MOTOI, Hirotaka KOBAYASHI