Patents by Inventor Daisuke Niwa

Daisuke Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7838912
    Abstract: A semiconductor sensing field effect transistor uses an organic unimolecular film formed on a gate insulating layer. In the semiconductor sensing field effect transistor and a semiconductor sensing device, the gate insulating layer has a stack structure wherein a second silicon oxide layer is stacked on a first silicon oxide layer through a silicon nitride layer. A semiconductor sensor chip and the semiconductor sensing device are provided with a field effect transistor chip wherein the gate insulating layer, a source electrode and a drain electrode are integrated on a silicon board, a source electrode terminal wiring connected with the source electrode, and a drain electrode terminal wiring connected with the drain electrode.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: November 23, 2010
    Assignee: Waseda University
    Inventors: Daisuke Niwa, Ichiro Koiwa, Tetsuya Osaka
  • Publication number: 20100221841
    Abstract: A semiconductor DNA sensing device is provided herein, which includes a detection section with a field-effect transistor including a semiconductor substrate and a first insulator layer formed thereon as a reactive gate insulator, the first insulating layer including silicon oxide or an inorganic oxide, a first organic monolayer formed on the first insulator layer, the first organic monolayer comprising an organic molecule having a reactive functional group, and a probe DNA containing 3 to 35 nucleotides bonded to the first organic monolayer by the reactive functional group either directly or by an intervening crosslinker, the structure of the probe DNA/the first organic monolayer/the insulating layer/the semiconductor constituting the detection section.
    Type: Application
    Filed: March 3, 2010
    Publication date: September 2, 2010
    Inventors: Tetsuya OSAKA, Daisuke Niwa, Norikazu Motohashi
  • Patent number: 7671996
    Abstract: The present invention relates to a surface plasmon resonance sensor which has a first dielectric layer, a metal layer disposed on the first dielectric layer, and a second dielectric layer covering the metal layer. The surface plasmon resonance sensor includes: a sensor main body provided with an opening for exposing a part of a surface of the metal layer on a side facing the second dielectric layer, and for allowing a measurement sample to be brought into contact with this surface; a light source for introducing a beam into the metal layer from one end of the metal layer in a longitudinal direction of the metal layer; and a detection unit detecting a beam emitted from the other end of the metal layer, has high sensitivity in measurement, is downsized, and is usable in a simple manner.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: March 2, 2010
    Assignee: Rohm Co., Ltd.
    Inventors: Daisuke Niwa, Dai Ohnishi
  • Publication number: 20090209028
    Abstract: There is provided a sensing chip capable of measuring a refractive index by utilizing a long-range surface plasmon polariton, accurately measuring an accumulative refractive index in a wide range, and more easily enabling sealing for measurement. The present invention relates to the sensing chip which has a thin metal film or a strip-like metal grown on an underlayer, and has a dielectric that limits a refractive index and a dielectric buffer layer on an upper surface and a lower surface of the thin metal film or the strip-like metal. The dielectric buffer layer is attached onto the thin metal film or the strip-like metal. The thin metal film or the strip-like metal and the buffer layer are sandwiched between two dielectric layers. A hole is made in a surface of the upper dielectric layer to serve as a measurement groove.
    Type: Application
    Filed: December 31, 2008
    Publication date: August 20, 2009
    Applicants: Rohm Co., Ltd., Tsinghua University
    Inventors: Huang Yi Dong, Rao Yi, Liu Fang, Zhang Wei, Peng Jiang De, Dai Ohnishi, Daisuke Niwa, Atsushi Tazuke, Yoshikatsu Miura
  • Publication number: 20090195783
    Abstract: A surface plasmon resonance sensor chip includes: a first dielectric layer; a metal layer disposed on the first dielectric layer; and a second dielectric layer covering the metal layer, the chip being provided with an opening that makes a part of a surface on the side of the second dielectric layer of the metal layer be exposed, and allows a measurement sample and the surface on the side of the second dielectric layer to contact each other, wherein an organic molecule film is provided at least one of between the first dielectric layer and the metal layer, and between the metal layer and the second dielectric layer.
    Type: Application
    Filed: February 4, 2009
    Publication date: August 6, 2009
    Applicant: Rohm Co., Ltd.
    Inventors: Atsushi Tazuke, Daisuke Niwa, Yoshikatsu Miura, Dai Ohnishi
  • Publication number: 20090066962
    Abstract: The present invention relates to a surface plasmon resonance sensor which has a first dielectric layer, a metal layer disposed on the first dielectric layer, and a second dielectric layer covering the metal layer. The surface plasmon resonance sensor includes: a sensor main body provided with an opening for exposing a part of a surface of the metal layer on a side facing the second dielectric layer, and for allowing a measurement sample to be brought into contact with this surface; a light source for introducing a beam into the metal layer from one end of the metal layer in a longitudinal direction of the metal layer; and a detection unit detecting a beam emitted from the other end of the metal layer, has high sensitivity in measurement, is downsized, and is usable in a simple manner.
    Type: Application
    Filed: September 8, 2008
    Publication date: March 12, 2009
    Applicant: Rohm Co., Ltd.
    Inventors: Daisuke Niwa, Dai Ohnishi
  • Publication number: 20080012049
    Abstract: A semiconductor sensing field effect transistor uses an organic unimolecular film formed on a gate insulating layer. In the semiconductor sensing field effect transistor and a semiconductor sensing device, the gate insulating layer has a stack structure wherein a second silicon oxide layer is stacked on a first silicon oxide layer through a silicon nitride layer. A semiconductor sensor chip and the semiconductor sensing device are provided with a field effect transistor chip wherein the gate insulating layer, a source electrode and a drain electrode are integrated on a silicon board, a source electrode terminal wiring connected with the source electrode, and a drain electrode terminal wiring connected with the drain electrode.
    Type: Application
    Filed: March 11, 2005
    Publication date: January 17, 2008
    Inventors: Daisuke Niwa, Tetsuya Osaka
  • Publication number: 20070207471
    Abstract: A semiconductor DNA sensing device having a detection section is provided. The detection section comprises a structure of a probe DNA/a first organic monolayer/an insulating layer/a semiconductor. The field-effect transistor (FET) comprises a semiconductor substrate and a first insulator layer formed thereon as a reactive gate insulator, and the first insulating layer comprises silicon oxide or an inorganic oxide. The first organic monolayer formed on the first insulator layer comprises an organic molecule having a reactive functional group. The probe DNA contains 3 to 35 nucleotides, and this probe DNA is bonded to the first organic monolayer by the reactive functional group either directly or by an intervening crosslinker.
    Type: Application
    Filed: September 5, 2006
    Publication date: September 6, 2007
    Applicant: WASEDA UNIVERSITY
    Inventors: Tetsuya Osaka, Daisuke Niwa, Norikazu Motohashi