Patents by Inventor Daisuke Ono
Daisuke Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11988981Abstract: An endless belt includes a resin and conductive particles, in which a content of the conductive particles with respect to the endless belt is 5% by volume or more and 20% by volume or less in terms of a volume ratio, a Young's modulus of the endless belt is 3,000 MPa or more, and the number of times of bending endurance of the endless belt measured by an MIT test specified in JIS P8115:2001 is 10,000 or more.Type: GrantFiled: March 26, 2023Date of Patent: May 21, 2024Assignee: FUJIFILM Business Innovation Corp.Inventors: Yosuke Kubo, Hiroaki Tanaka, Shigeru Fukuda, Daisuke Tanemura, Masato Ono, Masato Furukawa, Masayuki Seko, Koichi Matsumoto, Iori Nishimura
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Publication number: 20240152077Abstract: An intermediate transfer belt has metal oxide particles as a solid lubricant on a surface of the intermediate transfer belt, in which an average spacing between the metal oxide particles on the surface is 1,000 nm or less, and an average height of the metal oxide particles from the surface is 15 nm or more and 320 nm or less.Type: ApplicationFiled: July 17, 2023Publication date: May 9, 2024Applicant: FUJIFILM BUSINESS INNOVATION CORP.Inventors: Daisuke TANEMURA, Masato ONO, Shigeru FUKUDA, Masato FURUKAWA, Hiroaki TANAKA, Yosuke KUBO, Iori NISHIMURA, Masayuki SEKO, Koichi MATSUMOTO, Satoya SUGIURA
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Publication number: 20240155261Abstract: An imaging device according to the present disclosure includes the plurality of normal pixels arranged in a matrix, the special pixel arranged by replacing a part of the normal pixels, the color filter corresponding to the normal pixels and arranged according to a predetermined rule, the special filter arranged corresponding to the special pixel, and the special pixel color filter arranged to surround at least a part of the periphery of the special filter.Type: ApplicationFiled: October 26, 2020Publication date: May 9, 2024Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATIONInventors: Yuji ISERI, Hodaka KIRA, Daisuke HAGIHARA, Kazuki YOSHIDA, Syo YASUNAGA, Koji YAMARYO, Takeo ONO, Kimihiko SATO
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Patent number: 11967797Abstract: A puncture forming method is a method of forming punctures in a sample by irradiating a surface of the sample with a light beam. The puncture forming method includes: forming a first puncture by irradiating a first position on the surface of the sample with a first pulse of the light beam; and after the forming of the first puncture, forming a second puncture which at least partially overlaps the first puncture by irradiating, with a second pulse of the light beam, a second position on the surface of the sample positioned away from the first position in a first direction. The second puncture has a tip which is positioned inside the sample and which is bent in a direction opposite to the first direction.Type: GrantFiled: October 2, 2020Date of Patent: April 23, 2024Assignee: NUVOTON TECHNOLOGY CORPORATION JAPANInventors: Daisuke Ikeda, Hideo Kitagawa, Hiroshi Asaka, Masayuki Ono
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Patent number: 11961715Abstract: Described herein is a technique capable of efficiently removing a foreign substance in a reaction tube. According to one aspect of the technique, there is provided a substrate processing apparatus including: a reaction tube in which a substrate is processed; and a substrate retainer including a plurality of support columns configured to support the substrate, wherein at least one among the plurality of the support columns includes: a hollow portion through which an inert gas is supplied; and a gas supply port through which the inert gas is supplied toward an inner wall of the reaction tube.Type: GrantFiled: March 1, 2021Date of Patent: April 16, 2024Assignee: Kokusai Electric CorporationInventors: Daisuke Hara, Takashi Yahata, Tsuyoshi Takeda, Kenji Ono, Kazuhiko Yamazaki
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Publication number: 20240118647Abstract: An endless belt includes a resin and conductive particles, in which a content of the conductive particles with respect to the endless belt is 5% by volume or more and 20% by volume or less in terms of a volume ratio, a Young's modulus of the endless belt is 3,000 MPa or more, and the number of times of bending endurance of the endless belt measured by an MIT test specified in JIS P8115:2001 is 10,000 or more.Type: ApplicationFiled: March 26, 2023Publication date: April 11, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Yosuke KUBO, Hiroaki TANAKA, Shigeru FUKUDA, Daisuke TANEMURA, Masato ONO, Masato FURUKAWA, Masayuki SEKO, Koichi MATSUMOTO, Iori NISHIMURA
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Publication number: 20240118646Abstract: An endless belt, in which an outer peripheral surface of the endless belt has a coefficient of dynamic friction of 0.85 or less, and in a case where polyester resin particles having a volume-average particle size of 4.7 ?m are caused to adhere to the outer peripheral surface under a load of 0 g/cm2, and then air is sprayed on the outer peripheral surface from above the outer peripheral surface at a spray pressure that keeps increasing, all the polyester resin particles having adhered to the outer peripheral surface are spaced apart from the outer peripheral surface at the spray pressure of 6 kPa or less.Type: ApplicationFiled: March 22, 2023Publication date: April 11, 2024Applicant: FUJIFILM Business Innovation Corp.Inventors: Hiroaki TANAKA, Daisuke TANEMURA, Masato FURUKAWA, Yosuke KUBO, Iori NISHIMURA, Masato ONO, Masayuki SEKO, Shigeru FUKUDA
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Publication number: 20240106194Abstract: A light-emitting array includes a light-emitting part having plural light-emitting block, a selection part that operates with a reference potential supplied from a reference part provided on an outside as a reference and selects the light-emitting block to be made to emit light, and a disconnection part that disconnects connection of the selection part and the reference part in a period during which a light emission current caused by low-side drive is flowing in the light-emitting block.Type: ApplicationFiled: April 18, 2023Publication date: March 28, 2024Applicants: FUJIFILM Business Innovation Corp., FUJIFILM CorporationInventors: Daisuke IGUCHI, Kei Takeyama, Seiji Ono, Tomoaki Sakita, Takashi Kondo, Junichiro Hayakawa
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Patent number: 11505866Abstract: According to one embodiment, film formation apparatus includes: a carrying unit that includes a rotation table which circulates and carries a workpiece; a film formation process unit which includes a target formed of a silicon material, and a plasma producer that produces plasma of a sputter gas introduced between the target and the rotation table, and which forms a silicon film on the workpiece by sputtering; and a hydrogenation process unit which includes a process gas introducing unit that introduces a process gas containing a hydrogen gas, and a plasma producer that produces plasma of the process gas, and which performs hydrogenation on the silicon film formed on the workpiece. The carrying unit carries the workpiece so as to alternately pass through the film formation process unit and through the hydrogenation process unit.Type: GrantFiled: April 23, 2020Date of Patent: November 22, 2022Inventors: Daisuke Ono, Akihiko Ito
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Patent number: 11211233Abstract: According to one embodiment, a film formation apparatus includes a chamber having an interior to be vacuumed, a carrying unit which is provided in the chamber, and which carries a workpiece that has a processing target surface in a solid shape along a circular carrying path, a film formation unit that causes a film formation material to be deposited by sputtering on the workpiece that is being carried by the carrying unit to form a film thereon, and a shielding member which has an opening located at a side where the workpiece passes through, and which forms a film formation chamber where the film formation by the film formation unit is performed. A compensation plate that protrudes in the film formation chamber is provided, and the compensation plate has a solid shape along a shape of the processing target surface of the workpiece, and is provided at a position facing the workpiece.Type: GrantFiled: September 27, 2019Date of Patent: December 28, 2021Assignee: SHIBAURA MECHATRONICS CORPORATIONInventor: Daisuke Ono
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Patent number: 11160994Abstract: The present invention makes it possible to reliably verify irradiation with a particle beam in accordance with a selected irradiation technique. A particle beam therapy system includes a charged particle beam generator accelerating the particle beam, an irradiator irradiating a target with the particle beam accelerated by the charged particle beam generator, and a controller controlling the charged particle beam generator and the irradiator. The controller controls the charged particle beam generator and the irradiator so as to irradiate the target with the particle beam through switching between at least two different irradiation techniques, and furthermore, after switching between the two irradiation techniques, controls the charged particle beam generator and the irradiator to perform tentative irradiation with the charged particle beam in accordance with one of the irradiation techniques switched, to verify the particle beam.Type: GrantFiled: January 21, 2020Date of Patent: November 2, 2021Assignee: HITACHI, LTD.Inventors: Daisuke Ono, Yuki Ito
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Patent number: 11004665Abstract: A plasma processing apparatus includes a vacuum container, a conveyance unit including a rotator and circulating and carrying a workpiece through the conveyance path, a cylindrical member having an opening at one end extended in the direction toward the conveyance path, a window member provided at the cylindrical member, and dividing a gas space from the exterior thereof, a supply unit supplying the process gas in the gas space, and an antenna generating inductive coupling plasma on the workpiece. The supply unit supplies the process gas from plural locations where a passing time at which the surface of the rotator passes through a process region is different, and the plasma processing apparatus further includes an adjusting unit individually adjusting the supply amounts of the process gas from the plural locations of the supply unit per a unit time in accordance with the passing time.Type: GrantFiled: March 30, 2018Date of Patent: May 11, 2021Assignee: SHIBAURA MECHATRONICS CORPORATIONInventors: Yoshio Kawamata, Daisuke Ono
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Patent number: 10903059Abstract: A film formation apparatus includes a chamber which has an interior capable of being vacuumed, and which includes a lid that is openable and closable on the upper part of the chamber, a rotation table which is provided in the chamber and which and carries a workpiece in the circular trajectory, a film formation unit that deposits film formation materials by sputtering on the workpiece carried by the rotation table to form films, a shielding member which is provided with an opening at the side which the workpiece passes through, and which forms a film formation room where the film formations by the film formation units are performed, and a support which supports the shielding member, and which is independent relative to the chamber and is independent from the lid.Type: GrantFiled: September 6, 2018Date of Patent: January 26, 2021Assignee: SHIBAURA MECHATRONICS CORPORATIONInventors: Daisuke Ono, Yu Kambe
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Patent number: 10896841Abstract: A film formation apparatus includes a film formation unit which includes a film formation room having an opening at one end, has a target formed of a film formation material in the film formation room, and deposits the film formation material of the target on a surface of a workpiece facing the opening by plasma produced by a sputter gas in the film formation room, and a carrier that carries the workpiece along a predetermined carrying path so that the workpiece repeatedly pass through a facing region which faces the opening of the film formation room and a non-facing region which does not face the opening of the film formation room.Type: GrantFiled: September 27, 2018Date of Patent: January 19, 2021Assignee: SHIBAURA MECHATRONICS CORPORATIONInventor: Daisuke Ono
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Publication number: 20200340117Abstract: According to one embodiment, film formation apparatus includes: a carrying unit that includes a rotation table which circulates and carries a workpiece; a film formation process unit which includes a target formed of a silicon material, and a plasma producer that produces plasma of a sputter gas introduced between the target and the rotation table, and which forms a silicon film on the workpiece by sputtering; and a hydrogenation process unit which includes a process gas introducing unit that introduces a process gas containing a hydrogen gas, and a plasma producer that produces plasma of the process gas, and which performs hydrogenation on the silicon film formed on the workpiece. The carrying unit carries the workpiece so as to alternately pass through the film formation process unit and through the hydrogenation process unit.Type: ApplicationFiled: April 23, 2020Publication date: October 29, 2020Inventors: Daisuke Ono, Akihiko Ito
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Publication number: 20200276454Abstract: The present invention makes it possible to reliably verify irradiation with a particle beam in accordance with a selected irradiation technique. A particle beam therapy system includes a charged particle beam generator accelerating the particle beam, an irradiator irradiating a target with the particle beam accelerated by the charged particle beam generator, and a controller controlling the charged particle beam generator and the irradiator. The controller controls the charged particle beam generator and the irradiator so as to irradiate the target with the particle beam through switching between at least two different irradiation techniques, and furthermore, after switching between the two irradiation techniques, controls the charged particle beam generator and the irradiator to perform tentative irradiation with the charged particle beam in accordance with one of the irradiation techniques switched, to verify the particle beam.Type: ApplicationFiled: January 21, 2020Publication date: September 3, 2020Inventors: Daisuke ONO, Yuki ITO
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Publication number: 20200118803Abstract: According to one embodiment, a film formation apparatus includes a chamber having an interior to be vacuumed, a carrying unit which is provided in the chamber, and which carries a workpiece that has a processing target surface in a solid shape along a circular carrying path, a film formation unit that causes a film formation material to be deposited by sputtering on the workpiece that is being carried by the carrying unit to form a film thereon, and a shielding member which has an opening located at a side where the workpiece passes through, and which forms a film formation chamber where the film formation by the film formation unit is performed. A compensation plate that protrudes in the film formation chamber is provided, and the compensation plate has a solid shape along a shape of the processing target surface of the workpiece, and is provided at a position facing the workpiece.Type: ApplicationFiled: September 27, 2019Publication date: April 16, 2020Inventor: Daisuke ONO
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Patent number: 10583312Abstract: A treatment bed arranged in a tip direction of an irradiation nozzle and constructed movably, a treatment information system that manages prescription data, a treatment control system that receives a target position stored in the treatment information system to cause a main display system to display the target position, a pendant to input a movement command for the treatment bed, the main display system that receives the target position of the treatment bed from the treatment control system and displays an actual position of the treatment bed, and a patient positioning support system that calculates correction values for the target position thereof to provide the correction values to the treatment control system and the pendant are included, wherein the treatment control system sends the target position thereof to the treatment information system at a period shorter than an operation sequence thereof and stores initial values to be sent in advance.Type: GrantFiled: January 24, 2018Date of Patent: March 10, 2020Assignee: Hitachi, Ltd.Inventors: Daisuke Ono, Takayoshi Matsushita, Isao Furuse, Takao Kidani
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Patent number: 10446427Abstract: A conveyance system includes a track, ceiling conveyance vehicles, and a conveyance controller configured or programmed to output a conveyance instruction for a FOUP to the ceiling conveyance vehicles. When a first FOUP on a downstream port is waiting for collection, the conveyance controller waits without outputting a conveyance instruction instructing collection of the first FOUP until any of the conveyance vehicles conveying a second FOUP to an upstream port has been recognized until a waiting time set in advance has elapsed since the first FOUP changed to a state waiting for collection and outputs the conveyance instruction instructing collection of the first FOUP when the waiting time has elapsed since a point in time when the first FOUP changed to the state waiting for collection.Type: GrantFiled: October 13, 2016Date of Patent: October 15, 2019Assignee: MURATA MACHINERY, LTD.Inventors: Osamu Honda, Keiji Yamada, Takashi Nozawa, Daisuke Ono
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Patent number: 10354902Abstract: A conveyance system includes a track, ceiling conveyance vehicles, storage apparatuses, and a conveyance controller configured or programmed to control operations of the ceiling conveyance vehicles and a local vehicle in accordance with an operation mode. The storage apparatus includes a storage plate and the local vehicle that transfer a FOUP between the storage plate and an apparatus port. The conveyance controller switches the operation mode among a first mode prohibiting transfer from the apparatus port to the storage plate by the local vehicle, a second mode prohibiting transfer to the storage plate by any of the ceiling conveyance vehicles and transfer from the storage plate to the apparatus port by the local vehicle, and a third mode that does not restrict transfer by the local vehicle.Type: GrantFiled: October 13, 2016Date of Patent: July 16, 2019Assignee: MURATA MACHINERY, LTD.Inventors: Osamu Honda, Keiji Yamada, Daisuke Ono, Takashi Nozawa