Abstract: A pressure-sensitive adhesive tape for a battery outer packaging including: a base material; and a pressure-sensitive adhesive layer arranged on one surface of the base material, where a value calculated from an expression “a loss modulus of elasticity (G?) of the pressure-sensitive adhesive tape for a battery outer packaging at 70° C.×a thickness (mm) of the pressure-sensitive adhesive layer/a thickness (mm) of the pressure-sensitive adhesive tape for a battery outer packaging” is 8×103 Pa or more; a value calculated from an expression “a storage modulus of elasticity (G?) of the pressure-sensitive adhesive tape for a battery outer packaging at 23° C. ×the thickness (mm) of the pressure-sensitive adhesive layer/the thickness (mm) of the pressure-sensitive adhesive tape for a battery outer packaging” is 3×105 Pa or less; and a pressure-sensitive adhesive strength of the pressure-sensitive adhesive tape for a battery outer packaging to a stainless-steel plate at 23° C. is 2 N/10 mm or more.

Abstract: Provided is a gas adsorption sheet for a secondary battery, which contains gas adsorbent particles excellent in gas adsorption property, and allows the gas adsorption performance of the gas adsorbent particles to be sufficiently exhibited. According to one embodiment of the present invention, there is provided a gas adsorption sheet for a secondary battery, including: a heat-resistant base material; and a gas adsorption layer arranged on at least one surface of the heat-resistant base material, wherein the gas adsorption layer contains: a binder resin; and gas adsorbent particles each of which is formed of an inorganic porous material having pores, and is capable of adsorbing a gas.

Abstract: Provided is a pressure-sensitive adhesive tape that can be used in the fixing of an electrode and a separator at the time of the production of a secondary battery, and that can satisfactorily fix the separator and the electrode to each other while maintaining the permeability of an electrolytic solution into the separator. A pressure-sensitive adhesive tape according to one embodiment of the present invention includes: a first base material; and a pressure-sensitive adhesive layer formed in a peelable manner on the first base material, in which the pressure-sensitive adhesive layer is formed by patterning.

Abstract: Provided is a pressure-sensitive adhesive tape for a battery outer packaging having the following feature: the shift (adhesive shift) of the tape in its pressure-sensitive adhesive surface and liquid penetration when the tape is subjected to a salt water immersion test are prevented, and hence the tape is useful for the outer packaging of a battery. The pressure-sensitive adhesive tape for a battery outer packaging includes: a base material; and a pressure-sensitive adhesive layer arranged on one surface of the base material, in which: a value calculated from an expression “a loss modulus of elasticity (G?) of the pressure-sensitive adhesive tape for a battery outer packaging at 70° C.×a thickness (mm) of the pressure-sensitive adhesive layer/a thickness (mm) of the pressure-sensitive adhesive tape for a battery outer packaging” is 8×103 Pa or more; a value calculated from an expression “a storage modulus of elasticity (G?) of the pressure-sensitive adhesive tape for a battery outer packaging at 23° C.

Abstract: A covering material-provided non-aqueous secondary cell includes a non-aqueous secondary cell including a cell main body having one surface, the other surface disposed in opposed relation at spaced intervals to the one surface, and circumferential side surfaces connecting a circumferential end edge of the one surface to a circumferential end edge of the other surface and a terminal provided on at least any one of the one surface and the other surface and a covering material covering the cell main body so as to expose the terminal.

Abstract: A simplified production method for a chip-shaped electronic component such as a semiconductor chip is provided.

Abstract: A heat-peelable adhesive sheet is provided which includes a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and the coloring agent and that is provided on one side or both sides of the substrate, or a thermally expansive pressure-sensitive adhesive layer that contains thermally expansive microspheres and is provided on one side or both sides of the substrate through a colored intermediate layer, and which has a total light transmittance of 50% or more.

Abstract: There are provided a base material-less double-sided pressure-sensitive adhesive sheet without warping due to shrinkage of a base material after heat treatment, and having good peelability in heat peeling, and a method for manufacturing electronic parts or semiconductors by using the pressure-sensitive adhesive sheet. A heat-peelable pressure-sensitive adhesive sheet which is a base material-less double-sided pressure-sensitive adhesive sheet including a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres and a pressure-sensitive adhesive layer different from the heat-expandable pressure-sensitive adhesive layer and laminated thereon, wherein the pressure-sensitive adhesive layer has a higher elastic modulus than the heat-expandable pressure-sensitive adhesive layer.

Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of ?40° C. to 30° C.

Abstract: In the production process of electronic parts, the static electricity generated when peeling a pressure-sensitive adhesive tape has interfered with the performance of the electronic parts. This problem has been solved by a pressure-sensitive adhesive tape for temporary fixing of electronic parts of the present invention including at least a supporting substrate film and a thermally expandable pressure-sensitive adhesive layer provided on one side of the substrate, wherein the thermally expandable pressure-sensitive adhesive layer contains thermally expandable microspheres and an ionic liquid; the content of the ionic liquid is 0.01 to 10 parts by weight based on 100 parts by weight of a polymer contained in the thermally expandable pressure-sensitive adhesive layer; the surface resistance of the thermally expandable pressure-sensitive adhesive layer is 1.0×1013 ?/? or less; and the ratio of the surface resistance after heating for foaming to that before the heating is 5.0 or less.

Abstract: The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, and then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, with a high degree of freedom in designing and adequate handleability. The temporary fixing sheet includes a supporting substrate and a temporary fixing layer provided on at least one face thereof, wherein the temporary fixing layer contains a urethane polymer and a vinyl polymer.

Abstract: The present invention provides a temporary fixing sheet which firmly holds a ceramic sheet in a cutting step for the ceramic sheet and the like, can provide high cutting accuracy, then can efficiently and easily peel a chip from itself by being cooled to a predetermined temperature or lower, gives a high degree of freedom to designing and has adequate handleability. The temporary fixing sheet has a resin layer which contains a urethane polymer component and a vinyl polymer, develops the tack strength at a particular temperature equal to or higher than 40° C., and loses the tack strength at the particular temperature or lower.

Abstract: The present invention relates to an adhesive sheet including a substrate and, an adherent layer containing heat-expandable microspheres, the adherent layer being disposed on at least one side of the substrate, in which the adherent layer has a thickness of 10 to 38 ?m, and wherein the heat-expandable microspheres have a maximum particle diameter equal to or smaller than the thickness of the adherent layer and have a mode diameter of 5 to 30 ?m. The adhesive sheet of the invention enables a high-accuracy processing in the step of processing an electronic part such as a small ceramic capacitor to thereby greatly improve product characteristics and productivity.

Abstract: An adhesive tape for resin-encapsulating used in a method of manufacture of a resin-encapsulated semiconductor device has a base material layer and an adhesive agent layer laminated on the base material layer, a total film thickness of the base material layer and the adhesive agent layer of 25 to 40 ?m. According to the adhesive tape for resin encapsulating of the present invention, resin leakage can be efficiently prevented during the resin encapsulating operation.

Abstract: [Object] To provide an electronic paper manufacturing method which allows formation of an electronic paper by forming thin film transistors on a support film and affixing a display layer thereto without causing wrinkling of the support film, even when the support film is thin, and which is in no need of an extra cleaning step after the formation of the electronic paper. [Solution] The electronic paper manufacturing method includes an electronic paper formation step including the substeps of forming thin film transistors on an electronic-paper support film to give a driver layer; and affixing a display layer having an image displaying function onto the driver layer, in which the electronic paper formation step is performed while temporarily fixing the electronic-paper support film to a support plate through a double-sided pressure-sensitive adhesive tape.

Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of ?40° C. to 30° C.

Abstract: The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive, a foaming agent and a tackifying resin, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the base polymer of the pressure-sensitive adhesive forming the heat-expandable pressure-sensitive adhesive layer has an acid value of 350 mg-KOH/g or less and the tackifying resin contained in the heat-expandable pressure-sensitive adhesive layer has an acid value of 80 mg-KOH/g or less.

Abstract: Provided is a heat-peelable double-sided pressure-sensitive adhesive sheet that is advantageously usable in the step of cutting a multilayer ceramic sheet performed in a high-temperature atmosphere. Also provided is a process for the cutting of a multilayer ceramic sheet using the above-mentioned sheet. The heat-peelable double-sided pressure-sensitive adhesive sheet includes a substrate; arranged on one side thereof, a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres; and arranged on the other side, a temporary-fixing pressure-sensitive adhesive layer containing a lipophilic layered clay mineral. The lipophilic layered clay mineral is preferably a layered silicate. The lipophilic layered clay mineral may be present in an amount of 0.1 to 45 parts by weight per 100 parts by weight of a base polymer of a pressure-sensitive adhesive constituting the temporary-fixing pressure-sensitive adhesive layer.

Abstract: Disclosed is a heat-peelable pressure-sensitive adhesive sheet which satisfactorily fits a rough surface, develops a sufficient adhesive strength even when a bonding face of adherend is rough, less causes chip scattering when used for holding, during dicing, a semiconductor substrate having a rough surface typically of an encapsulation resin, and, after the completion of working, can be smoothly peeled off from the adherend by heating, without applying stress on the adherend. Also disclosed are a method for working an adherend and a method for producing an electronic component using the heat-peelable pressure-sensitive adhesive sheet. The heat-peelable pressure-sensitive adhesive sheet includes a base material, an organic rubber-like elastic layer and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres.

Abstract: Provided is a heat-peelable pressure-sensitive adhesive sheet which is resistant to deformation caused by pressurization, excels in cohesive strength, maintains an adequate adhesive strength until the temperature reaches a heating-peeling treatment temperature, and can be easily removed by heating. Also provided is a process for the production of electronic components using the above-mentioned sheet. The heat-peelable pressure-sensitive adhesive sheet includes a substrate and, arranged on or above at least one side thereof, a heat-peelable pressure-sensitive adhesive layer containing heat-expandable microspheres and a layered silicate. The silicate is preferably present in a content of 1 to 200 parts by weight per 100 parts by weight of a base polymer constituting the heat-peelable pressure-sensitive adhesive layer.