Patents by Inventor Daisuke Wakabayashi

Daisuke Wakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11958921
    Abstract: To provide a disposable diaper enabling reduction in re-wet amount and having an excellent speed of incorporating liquid regardless of concentration and configuration of a water-absorbing agent in an absorbent material. A water-absorbing agent having excellent Gel Capillary Absorption (GCA) and Free Gel Bed Permeability (FGBP) is obtained by crushing a crosslinked hydrogel polymer obtained in a polymerization step to have a specific weight average particle diameter while fluid retention capacity and a surface tension of a water-absorbing agent are adjusted in a specific range, drying the crushed crosslinked hydrogel polymer, and then adding a liquid permeability enhancer thereto during surface crosslinking or after surface crosslinking.
    Type: Grant
    Filed: November 16, 2022
    Date of Patent: April 16, 2024
    Assignee: NIPPON SHOKUBAI CO., LTD.
    Inventors: Tsuyoshi Yorino, Daisuke Takeda, Yoshitaka Ikeuchi, Shigeru Sakamoto, Yoshihiro Shobo, Yoshifumi Adachi, Ryota Wakabayashi, Daisuke Takagi, Sachie Kitabata
  • Publication number: 20240100783
    Abstract: A fusion sheet includes: a base material layer including a first surface and a second surface; a fusion base part partially stacked to the first surface of the base material layer and fusible to a wire-like transmission member; and an adhesive base part partially stacked to the second surface of the base material layer and having larger adhesive strength with an adhesive member than the base material layer. A first section and a second section are provided along an extension direction of the base material layer. The first section is a section where the adhesive base part is stacked to the base material layer other than a laminated section where the adhesive base part is stacked. The second section is a section where the adhesive base part is stacked to the base material layer other than a laminated section where the fusion base part is stacked.
    Type: Application
    Filed: February 1, 2022
    Publication date: March 28, 2024
    Applicants: Sumitomo Wiring Systems, Ltd., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Kenta ARAI, Takuya KABA, Daisuke EBATA, Hirozumi OKANIWA, Yusuke MITANI, Itsuo WAKABAYASHI
  • Publication number: 20240008297
    Abstract: An imaging device includes a semiconductor substrate, a first photoelectric converter located above the semiconductor substrate and converting light having a wavelength in a first wavelength range into first charge, and a second photoelectric converter located above the first photoelectric converter and converting light having a wavelength in a second wavelength range into second charge. The first photoelectric converter includes a first pixel electrode, a first counter electrode facing the first pixel electrode, and a first photoelectric conversion layer located between the first pixel electrode and the first counter electrode. The imaging device further includes a plug that penetrates the first photoelectric conversion layer and that is connected to the second photoelectric converter and an insulating layer that is located between the first photoelectric conversion layer and the plug and that covers a side surface of the plug. The insulating layer has a tapered shape that tapers upward.
    Type: Application
    Filed: September 17, 2023
    Publication date: January 4, 2024
    Inventor: DAISUKE WAKABAYASHI
  • Publication number: 20230114451
    Abstract: An imaging device includes: a photoelectric conversion film; a first electrode located above the photoelectric conversion film; a second electrode; a plug coupled to the second electrode; a protective film located above the second electrode; and a wiring line that electrically couples the first electrode to the second electrode. The protective film overlaps the entire plug and does not overlap the photoelectric conversion film in plan view. The second electrode includes a non-overlapping portion that does not overlap the protective film in plan view, and the wiring line is coupled to the non-overlapping portion of the second electrode.
    Type: Application
    Filed: November 1, 2022
    Publication date: April 13, 2023
    Inventors: DAISUKE WAKABAYASHI, YUUKO TOMEKAWA
  • Publication number: 20220216259
    Abstract: An imaging device includes a pixel section and a peripheral circuitry section provided around the pixel section. The pixel section includes: a photoelectric conversion film; a top electrode located above the photoelectric conversion film; bottom electrodes that face the top electrode, with the photoelectric conversion film being disposed between the top electrode and the bottom electrodes; and a first light-shielding film that overlaps part of the photoelectric conversion film in a plan view and that is electrically connected to the top electrode. The first light-shielding film has electrical conductivity. The peripheral circuitry section includes peripheral circuitry and a second light-shielding film that overlaps at least part of the peripheral circuitry in the plan view. The first light-shielding film and the second light-shielding film are separated from each other.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 7, 2022
    Inventors: DAISUKE WAKABAYASHI, YUUKO TOMEKAWA
  • Publication number: 20220058276
    Abstract: The present invention makes it possible to reduce threats to the security of a control unit. This controller system is provided with: a control unit that performs a control calculation for controlling a controlled object; and a security unit that is responsible for security. The control unit comprises: a first interface that brokers data exchange with an external device; a communication controller that is responsible for communication with the security unit; and a restriction means that restricts data from being exchanged with the external device via the first interface if a connection between the control unit and the security unit is detected via the communication controller.
    Type: Application
    Filed: December 19, 2019
    Publication date: February 24, 2022
    Applicant: OMRON Corporation
    Inventors: Daisuke WAKABAYASHI, Yuta NAGATA
  • Publication number: 20210313378
    Abstract: A photoelectric conversion device includes: a substrate; a photodetection film including a first surface facing the substrate and a second surface opposing the first surface; first electrodes provided between the substrate and the photodetection film; a second electrode provided between the substrate and the photodetection film and including a first portion overlapped with the first surface and a second portion not overlapped therewith when viewed from a normal direction of the substrate; a third electrode provided on the second surface of the photodetection film and including a third surface facing the second surface; wiring allowing for conduction between the second and third electrodes; and a first conductive plug connected with the first portion and extending toward the substrate. Material of the first conductive plug differs from that of the second electrode. The wiring is in contact with a side surface of the photodetection film and the second portion.
    Type: Application
    Filed: June 14, 2021
    Publication date: October 7, 2021
    Inventors: DAISUKE WAKABAYASHI, YUUKO TOMEKAWA
  • Patent number: 10539944
    Abstract: A power supply circuit in a PLC includes a first node that receives a DC voltage with a first level, a second node that outputs a voltage for driving a control unit, wiring connecting the first and second nodes, a first rectifier on the wiring having a forward direction from the first node to the second node, a charger for charging and discharging, a first converter that converts a discharging voltage from the charger into a DC voltage with a second level lower than the first level and outputs the voltage, and a second rectifier connected between an output of the first converter and the second node to have a forward direction from the first converter to the second node.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: January 21, 2020
    Assignee: OMRON Corporation
    Inventors: Hiroaki Ueda, Hideki Harada, Daisuke Wakabayashi
  • Publication number: 20180095442
    Abstract: A power supply circuit in a PLC includes a first node that receives a DC voltage with a first level, a second node that outputs a voltage for driving a control unit, wiring connecting the first and second nodes, a first rectifier on the wiring having a forward direction from the first node to the second node, a charger for charging and discharging, a first converter that converts a discharging voltage from the charger into a DC voltage with a second level lower than the first level and outputs the voltage, and a second rectifier connected between an output of the first converter and the second node to have a forward direction from the first converter to the second node.
    Type: Application
    Filed: August 21, 2017
    Publication date: April 5, 2018
    Applicant: OMRON Corporation
    Inventors: Hiroaki UEDA, Hideki HARADA, Daisuke WAKABAYASHI
  • Publication number: 20180017485
    Abstract: A purpose of the present invention is to provide a sensor with high sensitivity or high target substance selectivity. A sensor that includes a structure having an internal space into which a detection target is capable of flowing, a light-emitting element, and a photo-receptor element is provided. The sensor is disposed so that light emitted from the light-emitting element passes through the internal space to reach the photo-receptor element. A wavelength of the light emitted from the light-emitting element falls within a range from 2.5 ?m to 15 ?m inclusive. A length of the internal space in a direction perpendicular to an extension direction of the structure should preferably be less than or equal to 1000 ?m.
    Type: Application
    Filed: January 20, 2016
    Publication date: January 18, 2018
    Inventors: KOJI SAKAI, SHINICHI KISHIMOTO, DAISUKE WAKABAYASHI
  • Patent number: 8176782
    Abstract: A capacitive sensor includes a fixed electrode and a movable electrode that is movably supported by an anchor portion through a beam portion. The fixed electrode and the movable electrode are opposed to each other with a gap interposed therebetween, thereby constituting a detecting unit. A capacitance suitable for a size of the gap is detected to detect a predetermined physical value. At least one of an end of the beam portion connected to the anchor portion and an end of the beam portion connected to the movable electrode is provided with a stress moderating unit that moderates a stress.
    Type: Grant
    Filed: April 25, 2007
    Date of Patent: May 15, 2012
    Assignee: Panasonic Electric Works Co., Ltd.
    Inventors: Eiichi Furukubo, Daisuke Wakabayashi, Hisakazu Miyajima, Masao Ohbuchi, Ryo Aoki
  • Publication number: 20090266164
    Abstract: A capacitive sensor includes a fixed electrode and a movable electrode that is movably supported by an anchor portion through a beam portion. The fixed electrode and the movable electrode are opposed to each other with a gap interposed therebetween, thereby constituting a detecting unit. A capacitance suitable for a size of the gap is detected to detect a predetermined physical value. At least one of an end of the beam portion connected to the anchor portion and an end of the beam portion connected to the movable electrode is provided with a stress moderating unit that moderates a stress.
    Type: Application
    Filed: April 25, 2007
    Publication date: October 29, 2009
    Applicant: PANASONIC ELECTRIC WORKS CO., LTD.
    Inventors: Eiichi Furukubo, Daisuke Wakabayashi, Hisakazu Miyajima, Masao Ohbuchi, Ryo Aoki
  • Patent number: 7195669
    Abstract: A silicon single crystal rod (24) is pulled from a silicon melt (13) made molten by a heater (17), and a change in diameter of the silicon single crystal rod every predetermined time is fed back to a pulling speed of the silicon single crystal rod and a temperature of the heater, thereby controlling a diameter of the silicon single crystal rod. A PID control in which a PID constant is changed on a plurality of stages is applied to a method which controls the pulling speed of the silicon single crystal rod so that the silicon single crystal rod has a target diameter and a method which controls a heater temperature so that the silicon single crystal rod has the target temperature. A set pulling speed for the silicon single crystal rod is set so that V/G becomes constant, and an actual pulling speed is accurately controlled so as to match with the set pulling speed, thereby suppressing a fluctuation in diameter of the single crystal rod.
    Type: Grant
    Filed: July 7, 2003
    Date of Patent: March 27, 2007
    Assignee: Sumitomo Mitsubishi Silicon Corporation
    Inventors: Daisuke Wakabayashi, Masao Saito, Satoshi Sato, Jun Furukawa, Kounosuke Kitamura
  • Patent number: 7107847
    Abstract: A semiconductor acceleration sensor comprises: a frame having an opening inside thereof; flexible beams extending from the frame to the inside of the opening of the frame; a weight suspended from and supported by the beams so that the weight can freely move; piezoresistors to be mounted on the beams and to vary the resistance values in response to accelerations which work on the piezoresistors. The frame comprises damper plate portions, each of which covers a part of the opening spanning from a corner portion of two neighboring sides of the frame on the side of the opening to the inside of the opening, and each of which serves serve as a stopper to limit movement of the weight. The weight has corner portions which face the corner portions, respectively, and each of which is chamfered to have a shape of arc or a polygonal line consisting of at least three sides as seen in plan view.
    Type: Grant
    Filed: June 16, 2004
    Date of Patent: September 19, 2006
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hitoshi Yoshida, Kazushi Kataoka, Hisakazu Miyajima, Sumio Akai, Daisuke Wakabayashi, Koji Goto, Makoto Morii
  • Publication number: 20060130737
    Abstract: A silicon single crystal rod (24) is pulled from a silicon melt (13) molten by a heater (17), and a change in diameter of the silicon single crystal rod every predetermined time is fed back to a pulling speed of the silicon single crystal rod and a temperature of the heater, thereby controlling a diameter of the silicon single crystal rod. A PID control in which a PID constant is changed on a plurality of stages is applied to a method which controls the pulling speed of the silicon single crystal rod so that the silicon single crystal rod has a target diameter and a method which controls a heater temperature so that the silicon single crystal rod has the target temperature. A set pulling speed for the silicon single crystal rod is set so that V/G becomes constant, and an actual pulling speed is accurately controlled so as to match with the set pulling speed, thereby suppressing a fluctuation in diameter of the single crystal rod.
    Type: Application
    Filed: July 7, 2003
    Publication date: June 22, 2006
    Inventors: Daisuke Wakabayashi, Masao Saito, Satoshi Sato, Jun Furukawa, Kounosuke Kitamura
  • Patent number: 6878429
    Abstract: A sealing member for sealing a slenderly extending developer outflow opening formed in a container accommodating a developer. The sealing member includes a first film strip formed from a longitudinally stretched plastic film, and a second film strip formed from a similarly longitudinally stretched plastic film. The first film strip and the second film strip are bonded to each other as required.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: April 12, 2005
    Assignee: Shirasaki Corporation
    Inventors: Hirotaka Shirasaki, Yozo Okawa, Yasuhisa Yamamoto, Daisuke Wakabayashi
  • Publication number: 20040261529
    Abstract: A semiconductor acceleration sensor comprises: a frame having an opening inside thereof; flexible beams extending from the frame to the inside of the opening of the frame; a weight suspended from and supported by the beams so that the weight can freely move; piezoresistors to be mounted on the beams and to vary the resistance values in response to accelerations which work on the piezoresistors. The frame comprises damper plate portions, each of which covers a part of the opening spanning from a corner portion of two neighboring sides of the frame on the side of the opening to the inside of the opening, and each of which serves serve as a stopper to limit movement of the weight. The weight has corner portions which face the corner portions, respectively, and each of which is chamfered to have a shape of arc or a polygonal line consisting of at least three sides as seen in plan view.
    Type: Application
    Filed: June 16, 2004
    Publication date: December 30, 2004
    Applicant: Matsushita Electric Works, Ltd.
    Inventors: Hitoshi Yoshida, Kazushi Kataoka, Hisakazu Miyajima, Sumio Akai, Daisuke Wakabayashi, Koji Goto, Makoto Morii
  • Publication number: 20040016981
    Abstract: A semiconductor acceleration sensor is provided, which has the capability of preventing a situation that detection accuracy of acceleration deteriorates due to undesirable thermal stress induced when a metal layer wiring is used in the acceleration sensor. This sensor comprises a frame, a weight, at least one pair of beams made of a semiconductor material, via which said weight is supported in the frame, and at least one resistor element formed on each of the beams to thereby detect acceleration according to piezoelectric effect of the resistor element. The sensor also includes a doped semiconductor layer formed in a top surface of each of the beams as a wiring for electrically connecting with the resistor element.
    Type: Application
    Filed: June 5, 2003
    Publication date: January 29, 2004
    Applicant: MATSUSHITA ELECTRIC WORKS, LTD.
    Inventors: Hitoshi Yoshida, Kazushi Kataoka, Daisuke Wakabayashi, Koji Goto
  • Publication number: 20030096080
    Abstract: A sealing member for sealing a slenderly extending developer outflow opening formed in a container accommodating a developer. The sealing member includes a first film strip formed from a longitudinally stretched plastic film, and a second film strip formed from a similarly longitudinally stretched plastic film. The first film strip and the second film strip are bonded to each other as required.
    Type: Application
    Filed: June 25, 2002
    Publication date: May 22, 2003
    Inventors: Hirotaka Shirasaki, Yozo Okawa, Yasuhisa Yamamoto, Daisuke Wakabayashi
  • Patent number: 5843228
    Abstract: The invention is directed to preventing meltdown of conductive metal electrodes 5, 5 used to supply current to a heater 104 of a crucible 103. A single crystal pulling apparatus comprises: the heater 104 which encircles the crucible 103, and the pair of electrodes 5, 5, respectively threaded to a pair of graphite intermediate electrodes 6 of the heater 104, and a voltage source 9 for supplying power to the pair of electrodes 5, 5. A switch 11 switches the power on and off. A watthour meter 10a, continuously measures the current flowing through the heater 104. Investigation by the present inventors showed that in the case of a crack 8 in a lower portion of the intermediate electrode 6, minute fluctuations occurred in the measured value of the current, arising from an electric discharge phenomena in the crack 8 prior to meltdown of the electrodes 5, 5.
    Type: Grant
    Filed: April 1, 1997
    Date of Patent: December 1, 1998
    Assignees: Mitsubishi Materials Silicon Corporation, Mitsubishi Materials Corporation
    Inventors: Masao Saitoh, Daisuke Wakabayashi, Takashi Atami, Hisashi Furuya