Abstract: An exploding thin film bridge fracturing fragment detonator comprises a base layer with a bridge layer vapor deposited, e.g., sputtered, thereon. The bridge layer is comprised of an electrically conductive material and includes a bridge portion which interconnects significantly larger portions of this layer. An inorganic insulating layer of rigid fracturing material is vapor deposited, e.g. sputtered, on the bridge layer. A flyer layer is vapor deposited on the insulating layer, whereby the flyer layer is insulated electrically and/or thermally from the bridge layer. The flyer layer is sputtered directly over the bridge portion and is of a mass sufficient for at least a portion of the flyer layer and any associated insulating material that is fractured off therewith to be sufficiently propelled by an explosion of the bridge so as to cause the initiation by shock of a designated acceptor explosive (i.e., a secondary explosive).