Abstract: A patient interface device (PID) for contacting the surface of the eye and having a meniscus inverter. A pin, clip and ridge configuration for holding a window and maintaining an open reservoir of BSS in a PID. A PID for integrated systems and methods for performing laser and phacoemulsification operations. A PID for a reconfigurable system for performing a laser procedure in a laser configuration, and then being reconfigured into a phaco configuration, to perform a phacoemulsification, and then being reconfigured back to the laser configuration.

Abstract: A fully integrated laser-ultrasound, including femto-phaco, system having a foot print of less than 1,500 sq inches. Integrated communication and control system for laser-ultrasound, including femto-phaco, system including common control system and GUI. A reconfigurable laser-ultrasound, including femto-phaco, femto-phaco system having different configurations and positions of a laser delivery head, and having a single laser beam path length for all configurations. Integrated systems and methods for performing laser and phacoemulsification operations. A reconfigurable system for performing a laser procedure in a laser configuration, and then being reconfigured into a phaco configuration, to perform a phacoemulsification, and then being reconfigured back to the laser configuration.

Abstract: Integrated systems and methods for performing laser and phacoemulsification operations. A reconfigurable system for performing a laser procedure in a laser configuration, and then being reconfigured into a phaco configuration, to perform a phacoemulsification, and then being reconfigured back to the laser configuration. Non-handed systems that provide full position and usage around a patient. Integrated imaging, cataract grading and determination of combination laser-ultrasound therapies, including femto-phaco, therapies. Integrated control and determining systems for recommending and delivering predetermined laser shot patterns and predetermined phacoemulsification procedures to address conditions of the eye, including cataracts.

Abstract: Systems and methods for performing laser and phacoemulsification operations. Systems that provide full position and usage around a patient. An integrated laser-ultrasound, including femto-phaco, system having a safety interlock preventing operation of laser during phacoemulsification procedure. An integrated laser-ultrasound, including femto-phaco, system having a movable and repositionable laser arm and laser head. A laser system and an integrated laser-ultrasound, including femto-phaco, system that provides for 330 degrees of clocking positioning around an eye of the patient. Non-handed integrated laser-ultrasound, including femto-phaco, systems.

Abstract: A remote cutter head and a system therefore which can operate in confined spaces are provided. The remote cutting system including a cutter assembly driven by a fluid source, a pushrod hose coupling the cutter assembly to the fluid source, a control assembly detachably secured to the pushrod hose, and a monitor assembly coupled to at least one camera. The monitor assembly provides video images of the cutter assembly and cutter assembly surroundings. The cutting head including a fluid-driven gearmotor, the gearmotor including a two-piece housing, bearings, a pressure balanced gearmotor cavity, and two rotating members provided in the pressure balanced gearmotor cavity, one of the rotating members protruding from the cutting head. High-pressure fluid provided to the cutting head turns the two rotating members to drive a cutting bit attached to the rotating member protruding from the cutting head. Also provided is a cutting bit.

Abstract: A remote cutter head and a system therefore which can operate in confined spaces are provided. The remote cutting system including a cutter assembly driven by a fluid source, a pushrod hose coupling the cutter assembly to the fluid source, a control assembly detachably secured to the pushrod hose, and a monitor assembly coupled to at least one camera. The monitor assembly provides video images of the cutter assembly and cutter assembly surroundings. The cutting head including a fluid-driven gearmotor, the gearmotor including a two-piece housing, bearings, a pressure balanced gearmotor cavity, and two rotating members provided in the pressure balanced gearmotor cavity, one of the rotating members protruding from the cutting head. High-pressure fluid provided to the cutting head turns the two rotating members to drive a cutting bit attached to the rotating member protruding from the cutting head. Also provided is a cutting bit.

Abstract: Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.