Abstract: A gas and moisture permeation barrier stack deposited by both sputtering and atomic layer deposition techniques. In one embodiment, the barrier stack comprises a bottom barrier layer deposited on a substrate by sputtering and a top barrier layer deposited on the sputtered layer by atomic layer deposition. In one embodiment, the sputtered barrier layer has a water vapor transmission rate of about 10?5 gm/m2·day or lower, and the top barrier layer improves the water vapor transmission rate of the resulting two-layer barrier stack to about 10?6 gm/m2·day or lower.

Abstract: An encapsulated device achieves good water vapor transmission rates while reducing the amount of time needed in an inert environment, and thereby reducing the size of the deposition tool used to encapsulate the device. The encapsulated device includes a first barrier layer deposited directly on the device, and a first adhesive and first laminate on the first barrier layer. The laminate comprises a polymeric substrate and a second barrier layer on the substrate. The first barrier layer has a water vapor transmission rate suitable to allow lamination of the laminate on the first barrier layer in a non-inert environment. A method of making an encapsulated device comprises depositing a first barrier layer on the device in an inert environment, applying an adhesive on the first barrier layer in a non-inert environment, and applying a first laminate on the first adhesive in the non-inert environment.

Abstract: Barrier stacks according to embodiments of the present invention achieve good optical properties by including a decoupling layer with a tunable refractive index. In some embodiments, the barrier stack includes one or more dyads, each of which includes a first layer comprising an organic-inorganic hybrid material, and a second layer comprising a barrier material. The first layer has a refractive index at an interface between the first layer and the second layer that is substantially matched to a refractive index of the second layer.

Abstract: An encapsulated device achieves good water vapor transmission rates while reducing the amount of time needed in an inert environment, and thereby reducing the size of the deposition tool used to encapsulate the device. The encapsulated device includes a first barrier layer deposited directly on the device, and a first adhesive and first laminate on the first barrier layer. The laminate comprises a polymeric substrate and a second barrier layer on the substrate. The first barrier layer has a water vapor transmission rate suitable to allow lamination of the laminate on the first barrier layer in a non-inert environment. A method of making an encapsulated device comprises depositing a first barrier layer on the device in an inert environment, applying an adhesive on the first barrier layer in a non-inert environment, and applying a first laminate on the first adhesive in the non-inert environment.

Abstract: A barrier stack includes a decoupling layer comprising a siloxane polymer, and a barrier layer on the decoupling layer. The siloxane polymer is prepared from a solvent solution including a solvent, a silyl monomer and one or more silicone monomers. A method of forming the decoupling layer includes depositing (via a non-vacuum deposition technique) the solvent solution comprising the silyl monomer and the one or more silicone monomers on the substrate, and curing the curable resin composition. The siloxane polymer resulting from cure may be represented by Formula 2.

Abstract: A barrier stack includes a decoupling layer comprising a siloxane containing resin composition, and a barrier layer on the decoupling layer. The siloxane containing resin composition comprises a moiety derived from a siloxane monomer represented by Formula 1. A method of forming the decoupling layer includes depositing a curable resin composition comprising a siloxane monomer on the substrate, and curing the curable resin composition. The siloxane monomer of the curable resin composition includes a monomer represented by Formula 1.

Abstract: Barrier stacks according to embodiments of the present invention achieve good water vapor transmission rates with a reduced number of dyads (i.e., polymer layer/oxide layer couple). In some embodiments, the barrier stack includes one or more dyads comprising a first polymer decoupling layer and a second barrier layer on the first layer. An intervening tie layer is deposited between the first and second layers of at least one of the dyads. The intervening tie layer includes an inorganic oxide layer deposited between the polymer decoupling layer and barrier layer of the dyad. The barrier layer includes a silicon nitride layer deposited by an evaporative deposition technique such as chemical vapor deposition (CVD), for example plasma enhanced chemical vapor deposition (PECVD). The barrier stack including the intervening tie layer has a water vapor transmission rate that is lower than a water vapor transmission rate of a barrier stack not including the intervening tie layer.

Abstract: Barrier stacks according to embodiments of the present invention achieve good water vapor transmission rates with a reduced number of dyads (i.e., polymer layer/barrier layer couple). In some embodiments, the barrier stack includes one or more dyads comprising a first polymer decoupling layer and a hybrid barrier layer on the first layer. The hybrid barrier layer includes an inner oxide barrier layer and an outer silicon nitride barrier layer. The inner oxide barrier layer is deposited between the first layer and the outer silicon nitride layer of at least one of the dyads. The outer silicon nitride barrier layer is deposited by an evaporative deposition technique such as chemical vapor deposition (CVD), for example plasma enhanced chemical vapor deposition (PECVD). The barrier stack including the inner oxide barrier layer has a water vapor transmission rate that is lower than a water vapor transmission rate of a barrier stack not including the inner oxide barrier layer.

Abstract: Barrier stacks according to embodiments of the present invention achieve good water vapor transmission rates with a reduced number of dyads (i.e., polymer layer/oxide layer couple). In some embodiments, the barrier stack includes one or more dyads comprising a first polymer decoupling layer and a second barrier layer on the first layer. A passivation layer is wet deposited on the second layer of at least one of the dyads. The passivation layer includes a wet coated and cured curable material that seals the localized defects in the underlying barrier layer, and the barrier stack including the passivation layer has a water vapor transmission rate that is lower than a water vapor transmission rate of a barrier stack not including the passivation layer.

Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.

Abstract: A gas and moisture permeation barrier stack deposited by both sputtering and atomic layer deposition techniques. In one embodiment, the barrier stack comprises a bottom barrier layer deposited on a substrate by sputtering and a top barrier layer deposited on the sputtered layer by atomic layer deposition. In one embodiment, the sputtered barrier layer has a water vapor transmission rate of about 10?5 gm/m2·day or lower, and the top barrier layer improves the water vapor transmission rate of the resulting two-layer barrier stack to about 10?6 gm/m2·day or lower.

Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.

Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.

Abstract: A barrier stack for protecting devices from the permeation of moisture and gases includes a first layer acting as a planarization, decoupling, and/or smoothing layer, a second layer acting as a plasma resistant protective layer over the first layer, and a third layer acting as a barrier layer over the second layer. The first layer includes a polymeric or organic material. The second layer includes an inorganic material or polymeric material. The third layer includes an inorganic material and has a different density and/or refractive index than the second layer. The barrier stack may further include a fourth layer acting as a tie layer between the first layer and the substrate.

Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.

Abstract: An evaporator includes a vaporization chamber having a monomer inlet and a vapor outlet. There is a vapor nozzle in the vapor outlet. The evaporator also includes a collar positioned between the vaporization chamber and the vapor nozzle which increases the pressure in the evaporation chamber while the conductance through the nozzle is substantially unchanged.