Abstract: The invention concerns a method of making contactless smart cards. To facilitate the fixing of an integrated circuit chip in a contactless smart card, and in particular the chip connection with the antenna incorporated in the card, the method consists in soldering on the chip contact pads a gold wire with at least one end projecting above the chip. The wire is preferably soldered while the chip is still part of a semiconductor wafer. The wire can be soldered between two contact pads on a common chip; it can also be soldered between two contact pads of two adjacent chips on the wafer and then sawed during dicing. When the chip is incorporated in the card, it is pressed against the antenna so that the soldered wire is in contact with the coiled or printed antenna feeder end.

Abstract: A micromodule includes a slotted metal strip and a perforated dielectric strip having a thickness of less than 70 micrometers, preferably between 30 and 50 micrometers. The metal strip is bonded to the dielectric strip so as to overlie the slots in the metal strip. A chip is bonded to the dielectric strip and connected to the metal strip through the perforations in the dielectric strip. An insulating resin layer encapsulates the chip and is bonded to the dielectric strip. The micromodule may be used, for example, in a smart card, as a radiating antenna, or as an identification label.

Abstract: The method consists in pressure bonding a first strip to a second strip through a bonding press, marking each of the strips with the pattern pitches and juxtaposing the pattern pitch markings of each strip at the time of the bonding by extension of at least one strip with respect to another and by differential heating of each of the opposing strips to cause a relative shift, by expansion, of the two strips with respect to each other.